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Copper electroplating additive for high aspect ratio through hole of PCB and preparation method of copper electroplating additive

A through-hole electroplating and additive technology, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve the problems of low TP value of high-aspect ratio through-hole plating, difficult to uniform coating of high vertical and horizontal through-holes, etc., to achieve good Gloss, good throwing power, high toughness effect

Pending Publication Date: 2021-06-04
深圳中科利尔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For printed circuit board manufacturing, copper plating is performed on selected portions of the printed circuit board surface, in blind holes and trenches, and on the walls of vias that pass between the surfaces of the circuit board substrate material. Copper additives need to be used in the process. The current copper additives are difficult to obtain a uniform coating in the holes with high aspect ratio through-holes in the PCB DC plating process, resulting in a low TP value for high-aspect-ratio through-hole plating.

Method used

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  • Copper electroplating additive for high aspect ratio through hole of PCB and preparation method of copper electroplating additive
  • Copper electroplating additive for high aspect ratio through hole of PCB and preparation method of copper electroplating additive
  • Copper electroplating additive for high aspect ratio through hole of PCB and preparation method of copper electroplating additive

Examples

Experimental program
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Embodiment 1

[0040] This embodiment provides a PCB high-aspect-ratio through-hole electroplating copper additive, which is composed of the following material ratios, and each liter of electroplating copper additive contains:

[0041]

[0042] The balance is deionized water.

[0043] Specifically, the brightener A in this embodiment is a compound of sodium polydithiodipropane sulfonate, mercaptan, sulfide, disulfide and polysulfide, wherein the brightener A is selected from the group comprising the following substances: 3 -(Benzothiazolyl-2-thio)-propylsulfonic acid, 3-mercaptopropane-1-sulfonic acid, ethylenedithiodipropylsulfonic acid, bis-(p-sulfophenyl)-di Thioether, bis-(ω-sulfobutyl)-disulfide, bis-(ω-sulfohydroxypropyl)-disulfide, bis-(ω-sulfopropyl)-disulfide; brightener B Sodium 3-mercapto-1-propanesulfonate, bis-(ω-sulfopropyl)-sulfide, methyl-(ω-sulfopropyl)-disulfide, methyl-(ω-sulfopropyl) -trisulfide, O-ethyl-dithiocarbonic acid-S-(ω-sulfopropyl) ester, thioglycolic acid,...

Embodiment 2

[0046] This embodiment provides a PCB high-aspect-ratio through-hole electroplating copper additive, which is composed of the following material ratios, and each liter of electroplating copper additive contains:

[0047]

[0048]

[0049] The balance is deionized water.

[0050] Brightener A, brightener B, carrier A, carrier B, leveling agent A, leveling agent B and the preparation method of electroplating copper solution in this embodiment, the electroplating method of PCB high aspect ratio through hole are all consistent with implementation Example 1 is the same, and the analysis and test results of the copper plating layer that the present embodiment obtains are as shown in Table 1.

Embodiment 3

[0052] This embodiment provides a PCB high-aspect-ratio through-hole electroplating copper additive, which is composed of the following material ratios, and each liter of electroplating copper additive contains:

[0053]

[0054] The balance is deionized water.

[0055] Brightener A, brightener B, carrier A, carrier B, leveling agent A, leveling agent B and the preparation method of electroplating copper solution in this embodiment, the electroplating method of PCB high aspect ratio through hole are all consistent with implementation Example 1 is the same, and the analysis and test results of the copper plating layer that the present embodiment obtains are as shown in Table 1.

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Abstract

The invention discloses a copper electroplating additive for a high aspect ratio through hole of a PCB and a preparation method of the copper electroplating additive. The additive is prepared from the following substances in proportion, and each liter of the copper electroplating additive comprises 60-130 g of copper sulfate pentahydrate, 150-250 g of sulfuric acid, 30-70 ppm of chloride ions, 3-30 mg of a brightener A, 3-30 mg of a brightener B, 150-1500 mg of a carrier A, 150-1500 mg of a carrier B, 2-25 mg of a leveling agent A, 2-25 mg of a leveling agent B and the balance of deionized water. The copper electroplating additive is good in uniform plating capacity and dispersive capacity, capable of improving uniform distribution of a copper layer in the high aspect ratio through hole of the printed circuit board and effectively reducing the ratio of the thickness of a surface copper layer to the thickness of a copper layer in the center of the hole, suitable for electroplating of the high aspect ratio through hole, and stable in plating solution and long in service life; and a copper plate is compact and flat, good in ductility, good in gloss, high in toughness and low in internal stress.

Description

technical field [0001] The invention relates to the technical field of PCB electroplating, in particular to a copper electroplating additive for PCB high aspect ratio through-holes and a preparation method thereof. Background technique [0002] Printed circuit boards are an essential part of electronic products, especially the emergence of multilayer printed circuit boards provides a basis for the development of electronic products towards miniaturization, convenience and intelligence. Through-hole copper plating is one of the main ways to realize the conduction between layers of multi-layer PCB, and it is also one of the very important technologies in today's PCB manufacturing process. For printed circuit board manufacturing, copper plating is performed on selected portions of the printed circuit board surface, in blind holes and trenches, and on the walls of vias that pass between the surfaces of the circuit board substrate material. Copper additives need to be used in th...

Claims

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Application Information

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IPC IPC(8): C25D3/38H05K3/42
CPCC25D3/38H05K3/424
Inventor 张进武庞德友曹海凤庞兰李卫洲
Owner 深圳中科利尔科技有限公司