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Method for preparing ultra-thick three-dimensional porous copper micro-film

A technology of porous copper and copper electrodes, applied in jewelry and other directions, can solve the problems of easy peeling thickness, loose coating, and inconspicuous three-dimensional structure of the coating, and achieve the effects of short preparation time, strong binding force, and not easy self-loosening.

Pending Publication Date: 2021-06-15
CHONGQING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Although the hydrogen bubble template method does not need to involve the subsequent elimination of the template, this method has the disadvantages that the three-dimensional structure of the coating is not obvious, the coating is loose and easy to fall off, and the thickness is small.

Method used

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  • Method for preparing ultra-thick three-dimensional porous copper micro-film
  • Method for preparing ultra-thick three-dimensional porous copper micro-film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Use 400#, 100# sandpaper in turn to size 1×1cm 2 The anode and cathode red copper sheets were water-milled until the test piece was bright, and then the surface was rinsed three times with ultrapure water. 2 CO 3 After soaking in the solution at room temperature for 8 minutes, rinse off the residual lye on the surface with ultrapure water, then soak in 0.1mol / L hydrochloric acid solution for 3 minutes at room temperature, rinse off the residual acid solution on the surface with ultrapure water, and then rinse with absolute ethanol After rinsing for 3 times, blot the surface moisture with filter paper, and then use adhesive tape to insulate one side of the cathode test piece. Place the cathode and anode red copper sheets after the above pretreatment in the plating solution, and keep the distance between cathode and anode at 2 cm. The composition of the plating solution is: 0.2mol / L CuSO 4 ·5H 2 O, 1mol / L H 2 SO 4 , 15mmol / L NaCl, 15mmol / L EDTA, total surfactant con...

Embodiment 2

[0034] At 0.5mol / L Na 2 CO 3 After soaking in the solution for 10 minutes at room temperature, rinse off the residual lye on the surface with ultrapure water, and then soak in 0.5mol / L hydrochloric acid solution for 5 minutes at room temperature. The composition of the plating solution is: 0.2mol / L CuSO 4 ·5H 2 O, 1mol / LH 2 SO 4 , 15mmol / L NaCl, total surfactant content 0.6mmol / L (0.5mmol / L CTAB+0.1mmol / L M+2mg / L PEG6000). The rest of the experimental conditions and steps are consistent with Example 1.

[0035] The morphology of the microporous copper film prepared in this example is basically the same as that in Example 1 under electron microscope observation. The obtained porous copper film has a thickness of 100 μm and a porosity of 94.7%.

Embodiment 3

[0037] The cathode is copper sheet, the anode is phosphor copper sheet, at 0.8mol / L Na 2 CO 3 After soaking in the solution for 10 minutes at room temperature, rinse off the residual lye on the surface with ultrapure water, and then soak in 0.3mol / L hydrochloric acid solution for 5 minutes at room temperature. The electrodeposition time was 100s, and the rest of the experimental conditions and steps were kept the same as in Example 2.

[0038] The morphology of the microporous copper film prepared in this example is basically the same as that in Example 1 under electron microscope observation. The obtained porous copper film has a thickness of 311.4 μm and a porosity of 95.9%.

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Abstract

A method for preparing an ultra-thick three-dimensional porous copper micro-film comprises the steps that: a clean to-be-plated substrate is provided; a clean copper electrode is provided; an acid electroplating solution is provided, wherein the content of Cu2+ is 0.05-0.25 mol / L, the content of Cl- is 10-20 mmol / L, the content of a complexing agent is 10-20 mmol / L, the total content of a surface active agent is 0.3-0.7 mmol / L, and the content of H+ is 0.5-2.5 mol / L; and the porous copper micro-film is deposited on the to-be-plated substrate in the electroplating solution through a hydrogen bubble template method with the to-be-plated substrate as a cathode and the copper electrode as an anode. According to the method for preparing the ultra-thick three-dimensional porous copper micro-film, the complexing agent is added to an acid electroplating system, so that a porous copper layer has high binding force and is not prone to looseness, and the ultra-thick high-porosity through porous micro-film with the thickness as high as 0.3mm is prepared. Relevant equipment and conditions of the preparation process are simple, the preparation time is short, power consumption is low, and the method is suitable for large-scale industrial production.

Description

technical field [0001] The present invention relates to the preparation of porous copper membranes. Background technique [0002] Porous metal materials are composed of metal skeleton and pores distributed in its metallographic structure. They have high specific surface area, high specific strength, high porosity, permeability and outstanding energy absorption performance, which are different from conventional bulk metals in physical and chemical properties. It is a new type of structural functional material with excellent comprehensive performance. At present, it is widely used in aerospace, electromagnetic shielding, material filtration and separation, catalytic support and battery electrodes and other fields. [0003] The preparation of porous copper reported so far basically has the following types. [0004] Nanoporous copper electrodes with controllable macroscopic size can be obtained by dealloying, but non-target metal residue is an unavoidable problem. [0005] Po...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D5/00C25D7/00
CPCC25D3/38C25D5/003C25D7/00
Inventor 杨文静宋绍意李安琪满帅帅黎学明简燕何银芳牛丽丹郭江娜
Owner CHONGQING UNIV
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