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Method for improving hole wall roughness of PTFE material

A roughness and hole wall technology, which is applied in the field of improving the hole wall roughness of PTFE materials, can solve the problems of large hole wall roughness, difficult machining and high value, so as to improve the alignment accuracy and reduce the hole wall roughness. The effect of improving production quality

Pending Publication Date: 2021-06-15
大连崇达电子有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, in the development process of multi-layer PCB, radio frequency, antenna or radar board have more and more special requirements for PCB materials. PTFE material is currently the mainstream base material selection in the market. The PTFE material is of high value and difficult to machine, especially During the drilling process, due to the high stability of the material, the roughness of the hole wall is large. Even in the case of using plasma technology for post-processing, it is difficult to make the hole wall roughness reach the value required by the customer, which cannot meet high performance and high quality. requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A kind of manufacturing method of circuit board shown in the present embodiment, wherein comprises the method for improving the roughness of PTFE material hole wall, comprises following processing procedure successively:

[0024] (1) Cutting: Cut out the copper clad laminate and backing plate according to the panel size 520mm×620mm. The thickness of the copper clad laminate is 0.5mm (excluding the thickness of the outer copper foil), and the thickness of the outer copper foil of the copper clad laminate is 1oz.

[0025] (2), making the inner layer circuit (negative film process): apply a photosensitive film on the copper clad board with a vertical coating machine, the film thickness of the photosensitive film is controlled at 8 μm, and a fully automatic exposure machine is used to expose the ruler with 5-6 grids (21 grid exposure ruler) to complete the exposure of the inner layer circuit; inner layer etching, etch the inner layer circuit on the copper clad laminate afte...

Embodiment 2

[0042] A kind of manufacturing method of circuit board shown in the present embodiment, wherein comprises the method for improving the roughness of PTFE material hole wall, comprises following processing procedure successively:

[0043] (1) Cutting: Cut out the copper clad laminate and backing plate according to the panel size 520mm×620mm. The thickness of the copper clad laminate is 0.5mm (excluding the thickness of the outer copper foil), and the thickness of the outer copper foil of the copper clad laminate is 1oz.

[0044] (2) Drilling rivet holes: first laminate and fix the copper clad laminate and the backing plate, then drill a rivet hole at the four corners of the production board and the backing plate, and then remove the backing plate.

[0045] (3), drilling: first drill three target holes on the edge of the copper clad laminate, and the three target holes are respectively located on the long side and / or short side of the copper clad laminate; then use the three targ...

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PUM

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Abstract

The invention discloses a method for improving the hole wall roughness of a PTFE material. The method comprises the following steps of: drilling a plurality of target holes in the plate edge of a production plate, and drilling through holes in the production plate in a mechanical drilling manner by taking the target holes as positioning holes; fixing the production plate to a machining table top of a laser machine, and drilling the through holes again through laser by taking the target holes as positioning holes; and then carrying out plasma degumming treatment on the production plate. According to the method, the via holes are drilled in the plate in a mechanical drilling mode, and then the via holes are formed through laser, so that the roughness of hole walls can be effectively reduced, the production quality is improved, and the production requirement is met.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for improving the roughness of hole walls of PTFE materials. Background technique [0002] With the advent of the 5G era, the application of high-frequency and high-speed PCBs is becoming more and more extensive; high-frequency and high-speed PCBs not only need to provide high-speed, low-loss, low-latency, high-quality signal transmission, but also need to adapt to high-frequency and high-power devices. power consumption environment. [0003] At present, in the development process of multi-layer PCB, radio frequency, antenna or radar board have more and more special requirements for PCB materials. PTFE material is currently the mainstream base material selection in the market. The PTFE material is of high value and difficult to machine, especially During the drilling process, due to the high stability of the material, the roughness of the hole w...

Claims

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Application Information

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IPC IPC(8): H05K3/00B23K26/36B23K101/42
CPCB23K26/36B23K2101/42H05K3/0047
Inventor 乐禄安张大鹏叶亚林陈小勇
Owner 大连崇达电子有限公司