Tin-silver-copper ternary weldable alloy electroplating solution and electroplating method

A technology of alloy electroplating and tin-silver-copper, which is applied in tin-silver-copper ternary solderable alloy electroplating bath and electroplating field, can solve the problems such as large difference in precipitation potential of three kinds of metal ions, achieve wettability, cathode grain Fine and dense, increase the effect of cathode polarization

Inactive Publication Date: 2021-06-18
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The technical problem to be solved by the present invention is to provide a tin Silver-copper ternary solderable alloy electroplating bath and electroplating method

Method used

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  • Tin-silver-copper ternary weldable alloy electroplating solution and electroplating method
  • Tin-silver-copper ternary weldable alloy electroplating solution and electroplating method
  • Tin-silver-copper ternary weldable alloy electroplating solution and electroplating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] (1) The components and concentrations in the plating solution are as follows:

[0052]

[0053]

[0054] (2) Plating solution configuration method:

[0055] Add 0.0015 mol of silver oxide into 10 ml of methanesulfonic acid solution, heat and stir until the silver oxide completely reacts and disappears to obtain a silver salt solution. To form a heating reflux device, put 5ml of methanesulfonic acid solution in it, heat to 130°C, after the temperature stabilizes, slowly add 0.001mol basic copper carbonate in small amounts for several times, and continue heating after all the basic copper carbonate is added Reflux for 3h. After heating, the device was cooled to room temperature, and deionized water was added to dissolve the solid and filtered to obtain a concentrated copper salt solution. Add 0.00004 mol of benzylidene acetone into 10 ml of deionized water, heat to 40° C. and stir until the solid benzylidene acetone is completely dissolved to obtain a brightener s...

Embodiment 2

[0134] (1) The components and concentrations in the plating solution are as follows:

[0135]

[0136]

[0137] (2) Plating solution configuration method:

[0138] Add 0.003 mol of silver oxide into 10 ml of methanesulfonic acid solution, heat and stir until the silver oxide completely reacts and disappears to obtain a silver salt solution. To form a heating reflux device, put 5ml of methanesulfonic acid solution in it, heat it to 130°C, after the temperature stabilizes, slowly add 0.002mol basic copper carbonate in small amounts for several times, and continue heating after all the basic copper carbonate is added Reflux for 3h. After heating, the device was cooled to room temperature, and deionized water was added to dissolve the solid and filtered to obtain a copper salt solution. Add 0.00004 mol of benzylidene acetone into 10 ml of deionized water, heat to 40° C. and stir until the solid benzylidene acetone is completely dissolved to obtain a brightener solution. Aft...

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Abstract

The invention relates to a tin-silver-copper ternary weldable alloy electroplating solution, and belongs to the field of interconnection circuit manufacturing. According to the electroplating solution, a citrate electroplating system is used for producing a tin-silver-copper ternary alloy, and the plating solution is stable; and specific main salt is selected, so that components which possibly react with one another are avoided, and the problems that the components of a plating solution are unstable, metal ions react with one another, and the plating solution pollutes the environment and harms human health are solved; the plating solution is simple in formula and stable in component, all the components can be prepared into a solution to be directly added in the using process, and the problem that a ternary alloy plating solution is inconvenient to maintain is solved; the plating solution is stable in the electroplating process, the proportion of obtained plated metal is controllable, and the problems that the components of a plating layer are large in fluctuation and the proportion is difficult to control are solved; and the obtained ternary alloy plating layer is flat and bright in appearance and excellent in binding force, and the problems that an electroplated ternary alloy plating layer is poor in appearance and insufficient in binding force are solved.

Description

technical field [0001] The invention belongs to the field of interconnect circuit manufacturing, and in particular relates to a tin-silver-copper ternary solderable alloy electroplating solution and an electroplating method. Background technique [0002] The manufacturing process of electronic products needs to go through the surface mount process (SMT). In this step, the electronic components are mounted on the printed circuit board that has been made by the placement machine, and then flux and solder are used to pass through The method of reflow soldering realizes the soldering of components and printed circuit boards. A layer of solderable metal layer can be made in advance before making solder on the soldering part of the printed circuit board to improve soldering performance. [0003] Currently commonly used tin-based solderability coatings are tin-lead alloy coatings and tin-based lead-free coatings. Although lead-containing alloys have excellent performance in terms ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/60
CPCC25D3/60
Inventor 王翀李明瑞周国云何为王守绪陈苑明洪延杨文君
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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