Check patentability & draft patents in minutes with Patsnap Eureka AI!

A thermal peel-assisted integration process for extensible flexible neural electrode interfaces

A thermal stripping and flexible technology, applied in the field of biomedical engineering, can solve the problems of insufficient reliability and time-consuming electrode interface integration, and achieve the effect of simple operation, high reliability, and long-term recording or stimulation

Active Publication Date: 2022-07-12
MORMA MEDICAL SCI & TECH (SHANGHAI) LTD CO
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It overcomes the time-consuming and insufficient reliability problems of electrode interface integration caused by brushing conductive solder on electrode pads or directly using connectors to clamp the pad area in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A thermal peel-assisted integration process for extensible flexible neural electrode interfaces
  • A thermal peel-assisted integration process for extensible flexible neural electrode interfaces
  • A thermal peel-assisted integration process for extensible flexible neural electrode interfaces

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] This embodiment provides a thermal peel-assisted extensible flexible neural electrode interface integration process, such as figure 1 As shown, the integration process is divided into eight steps:

[0047] (a) Using water-soluble adhesive tape (ASWT-2, Aquasol, Australia), the released polyimide substrate serpentine structure electrode was evenly adhered from the silicon wafer;

[0048] (b) Cut out a thermal peel tape (Revalpha, Nitto Denko, Japan) with a length and width slightly larger than the rectangular pad area of ​​the polyimide substrate serpentine structure electrode, and attach it to the polyimide substrate serpentine structure in parallel alignment On the back of the electrode pad area, make sure that the thermal peel tape completely covers the area below the electrode pad, and at the same time, there is a certain distance from the edge of the polyimide rectangular pad near the serpentine wire, that is, exposing one of the rectangular pads near the serpentine...

Embodiment 2

[0060] In this embodiment, the silicone rubber adhesive is no longer used, but after the polyimide substrate serpentine structure electrode is prepared, water-soluble tape is used to stick it from the surface of the silicon wafer, and then the backside is exposed and sputtered. A layer of titanium and silicon dioxide, 10 nanometers and 50 nanometers thick, respectively, followed by a rectangular thermal release tape. Before transferring to the elastic silica gel substrate, UV ultraviolet light is used to irradiate the elastic silica gel substrate, so that the back surface of the serpentine structure electrode sputtered with titanium and silicon dioxide is in contact with the surface of the elastic silica gel substrate, and under a certain pressure, It was placed in an oven for 10 minutes to generate a strong chemical bond through a condensation reaction, and then the water-soluble tape was dissolved in hot water to achieve reliable bonding between the polyimide substrate serpen...

Embodiment 3

[0063] In this embodiment, according to the differences in the physical structure and mechanical properties of the implanted target tissue, elastic silicone substrates with different thicknesses and Young's modulus can be selected. Changes in the physical structure and properties of the material will not affect the thermocompression bonding effect.

[0064] In addition, the polymer substrate serpentine structure electrode substrate material can be replaced with a better biocompatible Parylene film, which can withstand the ACF hot pressing temperature and has the same properties as polyimide. Mechanical strength, high optical transparency and excellent biocompatibility (FDA Class VI), suitable for integration with elastic PDMS substrates that are also biocompatible, providing an effective guarantee for long-term implantation of extensible flexible neural electrodes .

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a thermal peeling-assisted extensible flexible neural electrode interface integration process. After the thermal peeling tape is used for the first time to realize the integration of the polymer substrate serpentine structure electrode and the elastic silica gel substrate, the interface can still be connected to the flexible neural electrode through the anisotropic conductive tape. The flexible flat cable is integrated by hot pressing. After hot pressing, the thermal peeling tape can be easily removed by heating according to actual needs. It overcomes the problems of time-consuming electrode interface integration and insufficient reliability caused by brushing conductive solder on the electrode pads or directly using a connector to clamp the pad area in the prior art. The integrated process of the invention is easy to operate, mature in hot pressing and high in reliability, and is especially suitable for integrating a high-channel-count polymer substrate electrode with an elastic silica gel base, ensuring that the electrode has both ductility and conformal attachment properties.

Description

technical field [0001] The invention belongs to the technical field of biomedical engineering, and in particular relates to a neural electrode interface integration process. Background technique [0002] Collecting electrophysiological signals from animal or human brains, nerves, muscles and other tissues through flexible microelectrode technology has become an important direction for the rapid development of neural interfaces in recent years. Considering the mechanical matching and deformation problems of soft tissues, a single flexible polymer film material can no longer meet the needs. The application of low Young's modulus elastic materials to flexible nerve electrodes has become one of the important development trends. In the face of this new type of electrode, the existing research often brushes conductive solder on the electrode pad or directly uses a connector to clamp the pad area, which brings about the problems of time-consuming and insufficient reliability for th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01R43/24A61B5/25
CPCH01R43/24Y02P70/50
Inventor 吉博文周宇昊常洪龙冯慧成熊俊彦张凯陶凯
Owner MORMA MEDICAL SCI & TECH (SHANGHAI) LTD CO
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com