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Thermal stripping auxiliary extensible flexible neural electrode interface integration process

A thermal peeling and flexible technology, applied in the field of biomedical engineering, can solve the problems of time-consuming and insufficient reliability of electrode interface integration, achieve the effect of simple operation, high reliability, and long-term recording or stimulation function

Active Publication Date: 2021-06-18
MORMA MEDICAL SCI & TECH (SHANGHAI) LTD CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It overcomes the time-consuming and insufficient reliability problems of electrode interface integration caused by brushing conductive solder on electrode pads or directly using connectors to clamp the pad area in the prior art

Method used

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  • Thermal stripping auxiliary extensible flexible neural electrode interface integration process
  • Thermal stripping auxiliary extensible flexible neural electrode interface integration process
  • Thermal stripping auxiliary extensible flexible neural electrode interface integration process

Examples

Experimental program
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Effect test

Embodiment 1

[0047] This embodiment provides a thermal stripping assisted extensible flexible neural electrode interface integration process, such as figure 1 As shown, the integrated process is divided into eight steps:

[0048] (a) Using water-soluble adhesive tape (ASWT-2, Aquasol, Australia), the released polyimide substrate serpentine electrode is evenly adhered from the silicon wafer;

[0049] (b) Cut the thermal release tape (Revalpha, Nitto Denko, Japan) whose length and width are slightly larger than the rectangular electrode pad area of ​​the serpentine structure of the polyimide substrate, and attach it to the serpentine structure of the polyimide substrate in parallel alignment On the back of the electrode pad area, ensure that the heat-peelable tape completely covers the area under the electrode pad, and at the same time, there is a certain distance from the edge of the polyimide rectangular pad near the serpentine wire, that is, a part of the rectangular pad near the serpenti...

Embodiment 2

[0061] In this embodiment, instead of using silicone rubber adhesive, after the polyimide substrate serpentine electrode is prepared, use water-soluble adhesive tape to stick it from the surface of the silicon wafer, then turn over to expose the back and sputter A layer of titanium and silicon dioxide with a thickness of 10nm and 50nm respectively, followed by a rectangular thermal release tape. Before transferring to the elastic silica gel substrate, UV ultraviolet light is used to irradiate the elastic silica gel substrate, so that the back of the serpentine structure electrode sputtered with titanium and silicon dioxide is in contact with the surface of the elastic silica gel substrate, and under a certain pressure, Place in an oven for 10 minutes to generate a strong chemical bond through condensation reaction, and then dissolve the water-soluble adhesive tape with hot water to achieve reliable adhesion between the polyimide substrate serpentine structure electrode and the ...

Embodiment 3

[0064] In this embodiment, elastic silicone substrates with different thicknesses and Young’s moduli can be selected according to the physical structure and mechanical properties of the implanted target tissue. Changes in the physical structure and properties of the material will not affect the thermocompression connection effect.

[0065] In addition, the electrode substrate material of the polymer substrate serpentine structure can be replaced by a more biocompatible parylene (Parylene) film, which can withstand the temperature of ACF hot pressing, and has the same strength as polyimide. Mechanical strength, high optical transparency and excellent biocompatibility (FDA Class VI), suitable for integration with the same biocompatible elastic PDMS substrate, providing an effective guarantee for the long-term implantation of stretchable flexible nerve electrodes .

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Abstract

The invention discloses a thermal stripping-assisted extensible flexible neural electrode interface integration process, which is characterized in that after integration of a snakelike structure electrode of a polymer substrate and an elastic silica gel substrate is realized by using a thermal stripping adhesive tape for the first time, an interface can still be integrated with a flexible flat cable in a hot pressing manner through an anisotropic conductive adhesive tape; after hot pressing, the hot stripping adhesive tape can be conveniently removed through heating according to actual requirements. Problems that in the prior art, due to the fact that conductive welding flux is brushed on an electrode bonding pad or a connector is directly used for clamping a bonding pad area, extra time is consumed for electrode interface integration, and reliability is insufficient are solved. The integration process is simple and convenient to operate, mature in hot pressing and high in reliability, is particularly suitable for the elastic silica gel substrate to integrate a high-channel-number polymer substrate electrode, and ensures that the electrode has extensibility and conformal attachment characteristics at the same time.

Description

technical field [0001] The invention belongs to the technical field of biomedical engineering, and in particular relates to a nerve electrode interface integration process. Background technique [0002] Collecting electrophysiological signals from animal or human brain, nerve, muscle and other tissues through flexible microelectrode technology has become an important direction for the rapid development of neural interfaces in recent years. Considering the mechanical matching and deformation of soft tissues, a single flexible polymer film material can no longer meet the needs, and the application of low Young's modulus elastic materials to flexible nerve electrodes has become one of the important development trends. In the face of this new type of electrode, the existing research often brushes the conductive solder on the electrode pad or directly uses the connector to clamp the pad area, which brings the problems of time-consuming and insufficient reliability for the integra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/24A61B5/25
CPCH01R43/24Y02P70/50
Inventor 吉博文周宇昊常洪龙冯慧成熊俊彦张凯陶凯
Owner MORMA MEDICAL SCI & TECH (SHANGHAI) LTD CO
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