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Semiconductor process equipment

A process equipment and semiconductor technology, applied in semiconductor/solid-state device manufacturing, metal material coating process, vacuum evaporation plating, etc., can solve the problems of difficult detection of film deposition rate, etc., and achieve low detection difficulty, not easy to damage, The effect of simple process

Active Publication Date: 2021-06-22
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention discloses a semiconductor process equipment to solve the problem that it is difficult to detect the film deposition rate of the semiconductor process equipment

Method used

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  • Semiconductor process equipment
  • Semiconductor process equipment
  • Semiconductor process equipment

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Embodiment Construction

[0024] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0026] Such as Figure 1 to Figure 5 As shown, the embodiment of the present invention discloses a semiconductor process equipment, which is used for depositing a thin film for the wafer 500, a...

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Abstract

The invention discloses semiconductor process equipment. The semiconductor process equipment comprises a deposition chamber (100), a device accommodating chamber (200) and a detection device (300), a first through hole (110) is formed in the deposition chamber (100); the device accommodating chamber (200) communicates with the deposition chamber (100) through the first through hole (110); and the detection device (300) is provided with a to-be-detected piece (330), the to-be-detected piece (330) is arranged in the device accommodating chamber (200), and the detection device (300) is used for driving the to-be-detected piece (330) to penetrate through the first through hole (110) to extend into the deposition chamber (100) and obtaining the thin film deposition rate of the semiconductor process equipment by detecting the vibration frequency change of the to-be-detected piece (330). According to the scheme, the problem that the thin film deposition rate of semiconductor process equipment is difficult to detect can be solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor chip manufacturing, in particular to a semiconductor process equipment. Background technique [0002] Physical vapor deposition technology is widely used in the field of semiconductor manufacturing, including vacuum evaporation, sputtering coating, molecular beam epitaxy, etc. Among them, sputtering coating is widely used in the metal thin film process. The basic principle of sputtering coating is to introduce process gas in a high vacuum environment and apply a voltage across the electrodes to make the gas generate glow discharge. At this time, the positive ions in the plasma hit the target under the action of a strong electric field. , the target metal atoms are sputtered and deposited on the surface of the wafer. [0003] In order to improve the yield rate of wafer coating, it is usually necessary to detect the film deposition rate of semiconductor process equipment, so that the stable s...

Claims

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Application Information

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IPC IPC(8): C23C14/34C23C14/54C23C14/16H01L21/67
CPCC23C14/34C23C14/546C23C14/165H01L21/67253
Inventor 李默林
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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