Boron-doped selective emitter and preparation method thereof, and boron-doped selective emitter battery
A boron doping and selective technology, which is applied in circuits, electrical components, climate sustainability, etc., can solve the problems of high doping amount, high production cost, and high maintenance cost, so as to ensure the light trapping effect and reduce the production cost. Cost, the effect of improving conversion efficiency
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[0034] The invention provides a method for preparing a boron-doped selective emitter, which comprises preparing a heavily doped region and a lightly doped region on the surface of a silicon wafer after texturing, and first covering a layer of boron dopant on the surface of the silicon wafer. The coverage area of the boron dopant is not smaller than the size of the heavily doped region; then the boron dopant located in the heavily doped region is laser doped to form silicon boride, and then the silicon boride is advanced at high temperature to form a heavily doped Finally, a lightly doped region is formed on the surface of the silicon wafer by high-temperature diffusion of a liquid boron source in a tubular diffusion furnace; a boron-doped selective emitter is produced. Specifically include the following steps:
[0035] (1) Texturing n-type silicon wafers;
[0036] (2) Cover a layer of boron dopant on the surface of the silicon wafer and dry it;
[0037] Among them, a layer...
Embodiment 1
[0052] A method for preparing a boron-doped selective emitter, comprising preparing a heavily doped region and a lightly doped region on the surface of a silicon wafer after texturing, specifically comprising the following steps:
[0053] (1) Texture the n-type silicon wafer.
[0054] (2) Partially cover a layer of boron dopant with a thickness of 20um on the surface of the silicon wafer (with suede) by screen printing, and the area covered by the boron dopant and the laser-doped heavily doped area and the front of the battery The positions of the electrodes are corresponding, and then the silicon wafer is dried at a temperature of 100° C. for 60 minutes. The covered boron dopant is boron-doped nano silicon powder.
[0055] (3) Laser doping the boron dopant covered on the surface of the silicon wafer to form silicon boride on the surface of the silicon wafer. The laser can be set as a continuous laser with a power of 5~60W and a wavelength of 355~1064nm. The laser doping wil...
Embodiment 2
[0062] A method for preparing a boron-doped selective emitter, comprising preparing a heavily doped region and a lightly doped region on the surface of a silicon wafer after texturing, specifically comprising the following steps:
[0063] (1) Texture the n-type silicon wafer.
[0064] (2) Cover the entire surface of the silicon wafer (with suede) with a layer of boron dopant with a thickness of 3um by spraying, and then place the silicon wafer at a temperature of 500°C to dry for 1min. The covered boron dopant is boron ink.
[0065] (3) Laser doping the boron dopant covered on the surface of the silicon wafer to form silicon boride on the surface of the silicon wafer. The laser can be set as a pulsed laser, with a pulse width of 50~5000ns, a power of 5~60W, and a wavelength of 355~1064nm. Laser doping will form boron dopants on the surface of the silicon wafer into silicon boride, and the boron element of silicon boride The doping concentration is 1E24atm / cm 3 , the doping ...
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