Boron-doped selective emitter and preparation method thereof, and boron-doped selective emitter battery

A boron doping and selective technology, which is applied in circuits, electrical components, climate sustainability, etc., can solve the problems of high doping amount, high production cost, and high maintenance cost, so as to ensure the light trapping effect and reduce the production cost. Cost, the effect of improving conversion efficiency

Active Publication Date: 2021-06-25
CHANGZHOU SHICHUANG ENERGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are two main reasons for the high preparation cost of this method: first, the cost of ion implantation equipment is generally high and the maintenance cost is high; on the other hand, the heavily doped region of the boron-doped selective emitter requires higher quantity, requires a longer single-chip process time, and increases the equipment investment per unit of production capacity
Excessive production costs are contrary to the concept of solar cell grid parity
[0008]The above preparation methods of boron-doped selective emitter limit the technical development of n-type battery selective emitter to a certain extent

Method used

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preparation example Construction

[0034] The invention provides a method for preparing a boron-doped selective emitter, which comprises preparing a heavily doped region and a lightly doped region on the surface of a silicon wafer after texturing, and first covering a layer of boron dopant on the surface of the silicon wafer. The coverage area of ​​the boron dopant is not smaller than the size of the heavily doped region; then the boron dopant located in the heavily doped region is laser doped to form silicon boride, and then the silicon boride is advanced at high temperature to form a heavily doped Finally, a lightly doped region is formed on the surface of the silicon wafer by high-temperature diffusion of a liquid boron source in a tubular diffusion furnace; a boron-doped selective emitter is produced. Specifically include the following steps:

[0035] (1) Texturing n-type silicon wafers;

[0036] (2) Cover a layer of boron dopant on the surface of the silicon wafer and dry it;

[0037] Among them, a layer...

Embodiment 1

[0052] A method for preparing a boron-doped selective emitter, comprising preparing a heavily doped region and a lightly doped region on the surface of a silicon wafer after texturing, specifically comprising the following steps:

[0053] (1) Texture the n-type silicon wafer.

[0054] (2) Partially cover a layer of boron dopant with a thickness of 20um on the surface of the silicon wafer (with suede) by screen printing, and the area covered by the boron dopant and the laser-doped heavily doped area and the front of the battery The positions of the electrodes are corresponding, and then the silicon wafer is dried at a temperature of 100° C. for 60 minutes. The covered boron dopant is boron-doped nano silicon powder.

[0055] (3) Laser doping the boron dopant covered on the surface of the silicon wafer to form silicon boride on the surface of the silicon wafer. The laser can be set as a continuous laser with a power of 5~60W and a wavelength of 355~1064nm. The laser doping wil...

Embodiment 2

[0062] A method for preparing a boron-doped selective emitter, comprising preparing a heavily doped region and a lightly doped region on the surface of a silicon wafer after texturing, specifically comprising the following steps:

[0063] (1) Texture the n-type silicon wafer.

[0064] (2) Cover the entire surface of the silicon wafer (with suede) with a layer of boron dopant with a thickness of 3um by spraying, and then place the silicon wafer at a temperature of 500°C to dry for 1min. The covered boron dopant is boron ink.

[0065] (3) Laser doping the boron dopant covered on the surface of the silicon wafer to form silicon boride on the surface of the silicon wafer. The laser can be set as a pulsed laser, with a pulse width of 50~5000ns, a power of 5~60W, and a wavelength of 355~1064nm. Laser doping will form boron dopants on the surface of the silicon wafer into silicon boride, and the boron element of silicon boride The doping concentration is 1E24atm / cm 3 , the doping ...

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Abstract

The invention discloses a preparation method of a boron-doped selective emitter, which comprises the following steps of preparing a heavily doped region and a lightly doped region on the surface of a textured silicon wafer, covering a layer of boron dopant on the surface of the silicon wafer, and enabling the coverage area of the boron dopant to be not smaller than the area of the heavily doped region, carrying out laser doping on the boron dopant in the heavily doped region to form silicon boride, then carrying out high-temperature propulsion on the silicon boride to form a heavily doped region, forming a lightly doped region on the surface of the silicon wafer, and preparing the boron-doped selective emitter. According to the method, the silicon boride is formed through laser doping, the silicon boride is propelled at high temperature to form the heavily-doped region, the used laser is low in power and friendly to the textured surface of the silicon wafer, and the heavily-doped region is prepared while the light trapping effect of the textured surface of the silicon wafer is guaranteed; An alkali liquor or acid liquor cleaning process is added after the laser doping process, so that the residual boron dopant and attached impurities on the surface of the silicon wafer are well removed, and the minority carrier lifetime of the silicon wafer is not reduced.

Description

technical field [0001] The invention relates to a selective emitter and a preparation method, in particular to a boron-doped selective emitter, a preparation method and a boron-doped selective emitter battery. Background technique [0002] In the field of crystalline silicon solar cell technology, selective emitter is a relatively mature technology to improve cell performance. At present, the use of phosphosilicate glass (PSG) laser doping technology to prepare selective emitters for large-scale p-type cells has become a standard process scheme. However, the preparation technology of the selective emitter of the current n-type battery has not been very mature, as follows: [0003] First of all, the boron-doped selective emitter prepared by borosilicate glass (BSG) laser doping method cannot achieve the effect that phosphorus-doped selective emitter can achieve by the phosphosilicate glass (PSG) laser doping method. There are two reasons. One is that the equilibrium concent...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/0224H01L31/18
CPCH01L31/022441H01L31/1804H01L31/1876Y02P70/50Y02E10/547
Inventor 许佳平沈梦超顾振华曹育红符黎明
Owner CHANGZHOU SHICHUANG ENERGY CO LTD
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