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Preparation method of ultra-thin large-size LTCC (Low Temperature Co-Fired Ceramic) substrate

A ceramic substrate and large-size technology, which is applied in the field of large-size ultra-thin ceramic substrates and electronic components, can solve problems such as warping, crushing, curling, etc., to improve reliability, reduce production energy consumption, and sinter The effect of low temperature

Active Publication Date: 2021-07-09
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problems that the existing ultra-thin large-size ceramic substrates are prone to warping, curling and breaking during the sintering process

Method used

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  • Preparation method of ultra-thin large-size LTCC (Low Temperature Co-Fired Ceramic) substrate
  • Preparation method of ultra-thin large-size LTCC (Low Temperature Co-Fired Ceramic) substrate

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Embodiment Construction

[0026] With ZnO and Nb 2 o 5 Synthesis of ZnNb according to molar ratio 2 o 6 For example, the specific implementation manner of the present invention is as follows:

[0027] (1) ZnO and Nb 2 o 5 After passing the molar ratio, use deionized water as a solvent, ball mill for 3-5 hours, and use an oven to discharge and dry at 80°C to 100°C;

[0028] (2) The dried powder is kept at 1000℃~1050℃ for 3h~4h to prepare ZnNb 2 o 6 Powder;

[0029] (3) The synthesized ZnNb 2 o 6 Powder, TiO 2 The powder and sintering aid are ball milled and mixed, and then dried in an oven at 80°C to 100°C;

[0030] (4) Sinter the dried powder at 600°C to 700°C for 2 hours to remove organic matter and impurities in the system;

[0031] (5) Use a sand mill to sand the mixed and dried powder to make the particle size of the system D 50 ≤0.5μm;

[0032] The sand-milled powder is spray-dried at 240°C to 260°C to obtain the dried powder, which is ready for batching;

[0033] (6) Use the powder...

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Abstract

The invention relates to a preparation method of an ultra-thin large-size LTCC (Low Temperature Co-Fired Ceramic) substrate. The preparation method comprises the following steps: mixing ZnO and Nb2O5 according to a molar ratio, pre-sintering and synthesizing to obtain a ZnNb2O6 system as a basic system; adjusting the dielectric constant of the material system by compounding a high-dielectric-constant TiO2 material; reducing the sintering temperature of the system by adding a sintering aid; reducing the particle size of the powder by introducing a sanding process, so that the specific surface area of the powder is increased, and the reaction activity of the powder is improved; adding a solvent, a dispersing agent and a defoaming agent into the powder obtained by sanding, carrying out primary ball milling to prepare slurry, supplementing a binder and a solvent, and carrying out secondary ball milling to prepare a casting material; and performing casting, laminating, isostatic pressing and cutting, and sintering and molding according to an LTCC (Low Temperature Co-Fired Ceramic) process. The problems of warping, edge curling, breaking and the like of an existing ultra-thin large-size ceramic substrate in the sintering process are solved. The ratio of the size to the thickness size of the prepared substrate can reach 5000: 1, and the method can be widely applied to the field of miniaturization of electronic components.

Description

technical field [0001] The present invention relates to the field of electronic components, specifically, to the field of ceramic substrates, and more specifically, to the field of large-size ultra-thin ceramic substrates. Background technique [0002] With the development of communication technology, electronic ceramic devices have developed vigorously due to their advantages of miniaturization, integration, and low loss. Ceramic substrates are also widely used in the field of electronic components due to their inherent advantages. Using ceramic substrates as substrates to print circuits on their surfaces to prepare various electronic components, but in ultra-thin large-size substrates (such as size > 35mm, thickness <0.25mm and other dimensions of the ceramic substrate) in the preparation process, because the ratio of its surface size to thickness size (referred to as surface-thickness ratio) has exceeded 100:1, the traditional preparation process is prone to warping...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/495C04B35/622C04B35/626C04B35/64
CPCC04B35/495C04B35/622C04B35/6261C04B35/64C04B2235/3284C04B2235/3232C04B2235/656C04B2235/6567
Inventor 袁世逢庞锦标韩玉成窦占明舒国劲
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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