Pre-wetting method before electroplating

Abstract

The invention provides a pre-wetting method before electroplating. The pre-wetting method before electroplating comprises the following steps of configuring a vacuum pressure value and a spraying liquid pressure value according to a product type; obtaining the vacuum pressure value and the spraying liquid pressure value, controlling a vacuum pump to work according to the vacuum pressure value so as to reach the vacuum pressure value, and controlling a hydraulic adjusting device according to the spraying liquid pressure value so as to reach the spraying liquid pressure value; driving a wafer carrying table to rotate at a preset rotating speed, and stopping vacuumizing; opening a liquid spraying valve of a liquid spraying pipeline to spray and pre-wet a wafer for a preset time; opening an air inlet valve until a preset air pressure value is reached in a pre-wetting cavity; and conveying the wafer into an electroplating cavity. According to the method, the requirements of different depth-to-width ratios and different line widths on the pre-wetting pressure can be effectively met, the pre-wetting effect before electroplating is improved, the combination between a subsequent electroplated layer and a seed layer is improved, short circuit caused by interconnection of the electroplated layers due to damage of photoresist is prevented, and the yield after electroplating is improved.

Description

technical field [0001] The invention belongs to the field of packaging of semiconductor integrated circuits and relates to a pre-wetting method before electroplating. Background technique [0002] In the era of slowing down of Moore's Law, advanced packaging has become one of the saviors for the future development of the semiconductor industry. Advanced packaging is critical to driving innovation in semiconductors. The semiconductor industry is in a period of great transformation and has entered a stage of disruptive development. Emerging megatrends such as mobile applications, big data, artificial intelligence, 5G, high-performance computing, Internet of Things, smart cars, Industry 4.0, and data centers drive applications , will significantly affect the development of the semiconductor industry and bring great opportunities to the entire supply chain. Electronic hardware to support these emerging megatrends requires high computing power, high speed, more bandwidth, low l...

AI Technical Summary

Problems solved by technology

[0004] For products with a large aspect ratio, the current pre-wetting process is likely to have insufficient pre-wetting. For products with small line spacing, the current pre-wetting process is likely to damage the photoresist and cause short circuits in subsequent coatings.

Moreover, the current pre-wetting process still has the problem of uneven water film or water film being blown dry, resulting in oxidation of the seed layer and affecting subsequent electroplating.

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