A kind of preparation method of discrete semiconductor packaging support

Abstract

The invention belongs to the technical field of semiconductor packaging devices, and specifically relates to a discrete semiconductor packaging bracket and a preparation method thereof, which includes a packaging bracket unit and a carrier plate, the upper surface of the packaging bracket unit is electroplated with a nickel-silver-gold layer, and the lower surface area is electroplated Nickel-gold layer, the package bracket unit is tightly welded with solder paste and the electroplated nickel-gold layer on the lower surface to support the package bracket; the package bracket is sequentially protected by the upper surface, the lower surface circuit, nickel-plated gold, stripping etching, and the lower surface Weld the carrier plate, remove the upper surface protection, upper surface circuit, nickel-plated silver gold, and remove the film to etch to obtain a discrete packaging bracket with the carrier plate; the present invention is equipped with a supplementary The strong plate and the peelable carrier plate are used as load support, no need for connecting leads as support, and are not limited by the thickness of the metal substrate. It can produce packaging brackets with complex structures, extremely small spacing, high airtightness, and high reliability without connecting leads. .

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a method for preparing a discrete semiconductor packaging bracket. Background technique [0002] The packaging bracket is the basic component for manufacturing integrated circuit semiconductor components. It provides a carrier for the chip of the integrated circuit, and realizes the connection between the chip and the electrical signal of the external circuit board by means of the bonding material, and at the same time provides a heat conduction channel for the chip to release heat. Quad Flat No-leads (QFN) is the most common package structure. The traditional QFN package usually uses: a package bracket with a lead frame structure and a separate package bracket imported from abroad without a lead frame structure. [0003] For the packaging bracket with lead frame structure, since each independent packaging bracket unit point in the bracket needs to be supported b...

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Problems solved by technology

[0003] For the packaging bracket with lead frame structure, since each independent packaging bracket unit point in the bracket needs to be supported by connecting leads, and the base material of the packaging bracket needs to reach a certain thickness to facilitate production and processing, this process cannot produce complex structures. High-precision, extremely small pitch and highly integrated package holder

Among them is the lead frame structure design. After the package is cut, all the positions with leads will expose the metal base material, the quality is unstable, and the sealing is poor; Seriously restricting the development of high-precision and light-weight semiconductor packaging devices; the imported discrete packaging brackets with a stripped lead frame structure are not only expensive, but also have a long transaction cycle. There is no such strippable substrate in China. Production; especially affected by multiple international factors, the shortage of semiconductor packaging brackets is serious, and even the supply of high-end products is directly cut off, which severely restricts semiconductor packaging companies

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