Large-current nonpolar Schottky diode

A Schottky diode, non-polar technology, used in the field of diodes, can solve the problems of insufficient conduction current, difficult to apply high-power circuits, etc., to achieve the effect of ensuring reliability, convenient installation and operation, and meeting application requirements

Active Publication Date: 2021-07-30
东莞市佳骏电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, a Schottky chip is usually packaged inside the Schottky diode. During production, the positive and negative electrodes need to be marked on the package or the packaging tape. When soldering and installing the Schottky diode on the PCB, careful observation is req

Method used

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  • Large-current nonpolar Schottky diode
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  • Large-current nonpolar Schottky diode

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Embodiment Construction

[0021] In order to further understand the features, technical means, and specific objectives and functions achieved by the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0022] refer to Figure 1 to Figure 3 .

[0023] The embodiment of the present invention discloses a large current non-polar Schottky diode, such as figure 1 As shown, the insulating package body 10 is included, and the first Schottky chip 21, the second Schottky chip 22, the third Schottky chip 23, the fourth Schottky chip 24, the first Schottky chip 24, the first The conductive pin 30, the second conductive pin 40, and the mountain-shaped conductive support 50, the first conductive pin 30 and the second conductive pin 40 have one end protruding from the insulating package 10, and the Schottky chip It is a diode chip made by using the Schottky barrier formed between noble metal and semiconductor;

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PUM

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Abstract

The invention provides a large-current non-polar Schottky diode. The large-current non-polar Schottky diode comprises an insulating packaging body, the positive electrode of a first Schottky chip is connected to one side of a first core connecting piece, the negative electrode of a second Schottky chip is connected to the other side of the first core connecting piece, the negative electrode of a third Schottky chip is connected to one side of a second core connecting piece, and the positive electrode of a fourth Schottky chip is connected to the other side of the second core connecting piece; the negative electrode of the first Schottky chip is connected to one side of a central sheet, the positive electrode of the third Schottky chip is connected to the other side of the central sheet, the positive electrode of the second Schottky chip is connected to one side of a first edge sheet, and the negative electrode of the fourth Schottky chip is connected to one side of a second edge sheet; the center sheet is perpendicular to the horizontal plane. No matter which conductive pin the positive electrode and the negative electrode of an external circuit are connected with, conduction can be achieved, use and operation are convenient, large current can be borne, and the vertically-arranged Schottky chip can enable heat to be dispersed to the peripheral side faces.

Description

technical field [0001] The invention relates to a diode, and specifically discloses a large current non-polar Schottky diode. Background technique [0002] A Schottky diode is a metal-semiconductor device with rectification characteristics made of a noble metal as the positive pole and an N-type semiconductor as the negative pole, using the Schottky junction formed on the contact surface of the two, that is, the Schottky barrier. When a forward voltage is applied, the Schottky junction becomes narrower and the internal resistance becomes smaller, and when a reverse voltage is applied, the Schottky junction becomes wider and the internal resistance becomes larger. [0003] In the prior art, a Schottky chip is usually packaged inside the Schottky diode. During production, the positive and negative electrodes need to be marked on the package or the packaging tape. When soldering and installing the Schottky diode on the PCB, careful observation is required. Its positive and neg...

Claims

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Application Information

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IPC IPC(8): H01L25/07H01L29/872H01L23/495H01L23/367
CPCH01L25/072H01L29/872H01L23/49562H01L23/49575H01L23/367
Inventor 曾贵德
Owner 东莞市佳骏电子科技有限公司
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