Large-current nonpolar Schottky diode

Abstract

The invention provides a large-current non-polar Schottky diode. The large-current non-polar Schottky diode comprises an insulating packaging body, the positive electrode of a first Schottky chip is connected to one side of a first core connecting piece, the negative electrode of a second Schottky chip is connected to the other side of the first core connecting piece, the negative electrode of a third Schottky chip is connected to one side of a second core connecting piece, and the positive electrode of a fourth Schottky chip is connected to the other side of the second core connecting piece; the negative electrode of the first Schottky chip is connected to one side of a central sheet, the positive electrode of the third Schottky chip is connected to the other side of the central sheet, the positive electrode of the second Schottky chip is connected to one side of a first edge sheet, and the negative electrode of the fourth Schottky chip is connected to one side of a second edge sheet; the center sheet is perpendicular to the horizontal plane. No matter which conductive pin the positive electrode and the negative electrode of an external circuit are connected with, conduction can be achieved, use and operation are convenient, large current can be borne, and the vertically-arranged Schottky chip can enable heat to be dispersed to the peripheral side faces.

Description

technical field [0001] The invention relates to a diode, and specifically discloses a large current non-polar Schottky diode. Background technique [0002] A Schottky diode is a metal-semiconductor device with rectification characteristics made of a noble metal as the positive pole and an N-type semiconductor as the negative pole, using the Schottky junction formed on the contact surface of the two, that is, the Schottky barrier. When a forward voltage is applied, the Schottky junction becomes narrower and the internal resistance becomes smaller, and when a reverse voltage is applied, the Schottky junction becomes wider and the internal resistance becomes larger. [0003] In the prior art, a Schottky chip is usually packaged inside the Schottky diode. During production, the positive and negative electrodes need to be marked on the package or the packaging tape. When soldering and installing the Schottky diode on the PCB, careful observation is required. Its positive and neg...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, a Schottky chip is usually packaged inside the Schottky diode. During production, the positive and negative electrodes need to be marked on the package or the packaging tape. When soldering and installing the Schottky diode on the PCB, careful observation is required. Its positive and negative poles can only be operated. Once reverse connection occurs, it needs to be repaired or even scrapped. In addition, the Schottky diode in the prior art has the problem of insufficient conduction current, which is difficult to apply to high-power circuits.

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