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A kind of highly conductive copper alloy sheet and preparation method thereof

A copper alloy, high conductivity technology, applied in manufacturing tools, heat treatment equipment, furnaces, etc., can solve the problem that the conductivity is only 10%

Active Publication Date: 2022-01-07
安徽绿能技术研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The existing copper alloy plates cannot meet the above requirements due to the selection of the composition formula
[0004] In order to solve the above problems, the patent CN 107090553A discloses a Cu-Ni-Co-V-Cr-Mo-Zn-Mn-Ti alloy, the composition of which contains by weight percentage: 4.8% to 7.6% Ni, 2.3% to 5.7% % of V, 1.7% to 2.2% of Cr, 3.5% to 5.7% of Mo, 1.5% to 2.3% of Zn, 1.2% to 2.3% of Mn, 0.7% to 2.5% of Ti, and the Co content is only 0.05% %~0.10%, the balance is Cu, the strength of the copper alloy reaches 1300MPa, but the electrical conductivity is only 10% IACS

Method used

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  • A kind of highly conductive copper alloy sheet and preparation method thereof

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preparation example Construction

[0015] Another object of the present invention is to provide a method for preparing the high-conductivity copper alloy plate, which is characterized in that it includes the following steps:

[0016] Step S1, smelting and refining: After mixing the ingredients evenly according to the weight percentage, put them into the smelting furnace for smelting, then add refining agent to it, spray inert gas for refining, each heat preservation and refining time is 15-30min; Carry out slag removal and filtration to obtain the refined melt; take samples to test its chemical composition, compare the difference between the design composition and the measured composition, and make fine-tuning to ensure that the alloy composition meets the design composition requirements;

[0017] Preferably, the melting temperature is 1200-1220°C; the inert gas is any one of nitrogen, helium, neon and argon.

[0018] Preferably, the refining agent includes the following components in parts by weight: 4-8 parts...

Embodiment 1

[0028] A highly conductive copper alloy plate, characterized in that it contains 0.01wt% Ag, 0.8wt% Ni, 0.01wt% W, 0.10wt% P, 0.01wt% Ta, 0.05wt% Sb, 0.03wt% of Hf, 0.01wt% of Ho, 0.001% of graphene-coated nano-aluminum powder, further containing 0.1% of Sn, B, and Mn mixed in a mass ratio of 1:1:3. The amount is nano copper powder.

[0029] The graphene-coated nano-aluminum powder is made according to the method described in Example 1 of Chinese invention patent CN104923796B. The Cs is added in the form of Cu-Cs master alloy, wherein the mass percentage of Cs is 10%.

[0030] A method for preparing the high-conductivity copper alloy plate, characterized in that it comprises the following steps:

[0031] Step S1, smelting and refining: After mixing the ingredients evenly according to the weight percentage, put them into the smelting furnace for smelting, then add refining agent into it, spray inert gas for refining, each heat preservation and refining time is 15min; Slag an...

Embodiment 2

[0036]A high-conductivity copper alloy plate is characterized in that it contains 0.02wt% of Ag, 1wt% of Ni, 0.015wt% of W, 0.13wt% of P, 0.015wt% of Ta, 0.08wt% of Sb, 0.04 wt% of Hf, 0.015wt% of Ho, 0.0015% of graphene-coated nano-aluminum powder, further containing 0.15% of Sn, B, Mn, Cs, Ca and Sc in a mass ratio of 1:3:2:1:2 : 1 mixed additive component, the balance is nano-copper powder.

[0037] The graphene-coated nano-aluminum powder is made according to the method described in Example 1 of Chinese invention patent CN104923796B. The Cs is added in the form of Cu-Cs master alloy, wherein the mass percentage of Cs is 13%.

[0038] A method for preparing the high-conductivity copper alloy plate, characterized in that it comprises the following steps:

[0039] Step S1, smelting and refining: After mixing the ingredients evenly according to the weight percentage, put them into the smelting furnace for smelting, then add refining agent to it, spray inert gas for refining,...

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Abstract

The invention discloses a high-conductivity copper alloy plate, which is characterized in that it contains 0.01-0.05wt% Ag, 0.8-1.5wt% Ni, 0.01-0.03wt% W, 0.10-0.20wt% P, 0.01-0.03wt% Ta, 0.05-0.13wt% Sb, 0.03-0.06wt% Hf, 0.01-0.03wt% Ho, 0.001-0.003% graphene-coated nano-aluminum powder, further containing 0.1-0.3 % of one or more additive components selected from Sn, B, Mn, Cs, Ca and Sc, and the balance is nano-copper powder. The invention also provides a preparation method of the high-conductivity copper alloy plate. The high-conductivity copper alloy sheet material disclosed in the application has excellent conductivity, high heat resistance, heat dissipation and mechanical strength.

Description

technical field [0001] The invention relates to the technical field of nonferrous metal processing, in particular to a high-conductivity copper alloy plate and a preparation method thereof. Background technique [0002] In various electrical / electronic industrial fields, a conductive sheet is required as a conductive member having high conductivity. As such a conductive sheet, in order to suppress the heat generated when electricity is applied, the material is required to have good electrical conductivity and heat transfer (radiation performance), and at the same time, in order to ensure the flow of current, sufficient contact pressure between parts is required. It is in this situation that high-conductivity copper alloy sheet material emerges as the times require, and its appearance brings dawn to the development of electrical / electronics. [0003] With the high-speed transmission (high current) and miniaturization of electrical and electronic components, the conductivity ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/06C22C1/02C22C1/06C22F1/02C22F1/08C21D9/00
CPCC22C9/06C22C1/02C22F1/08C21D9/0081C22C1/06C22F1/02
Inventor 葛平平贺威郭斗斗
Owner 安徽绿能技术研究院有限公司