Semiconductor chip wafer rod transferring and slitting device

A wafer bar and semiconductor technology, applied in the field of semiconductor chip wafer bar transfer and slitting device, can solve the problems of wafer bar damage, inconvenient wafer transfer, low slitting efficiency, etc.
CN113276296AInactive Publication Date: 2021-08-20SICHUAN HONGXINWEI TECH
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SICHUAN HONGXINWEI TECH
Publication Date
2021-08-20
Estimated Expiration
Not applicable · inactive patent

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Abstract

Disclosed is a semiconductor chip wafer rod transferring and slitting device. The device comprises: a supporting body, wherein the supporting body comprises a cabinet body, and the two sides of the lower end of the cabinet body are each provided with a pair of adjusting mechanisms; a feeding assembly, arranged at one end of the supporting body and comprising an upward moving mechanism, wherein the upward moving mechanism is provided with a pair of placing mechanisms; a transferring assembly, arranged at the upper end of the supporting body and comprising a translation mechanism, wherein the translation mechanism is provided with a pair of lifting mechanisms, and clamping mechanisms are arranged at the lower ends of the lifting mechanisms; a clamping assembly, arranged at the upper end of the supporting body and comprising a lower clamping component, wherein a downward pressing mechanism is arranged on one side of the lower clamping component, a turnover mechanism is arranged at the upper end of the downward pressing mechanism, and an upper clamping component is installed on the turnover mechanism; and a slitting assembly, arranged at the upper end of the supporting body and comprising a feeding mechanism, wherein the feeding mechanism is provided with a slitting mechanism. According to the device, the cutting operation of a wafer rod is facilitated, the cutting automation degree, the cutting efficiency and the cutting precision of the wafer rod are improved, the automatic transfer of the wafer rod is facilitated, the clamping and positioning of the wafer rod are facilitated, and the cutting quality of a wafer disc is improved.
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Description

technical field

[0001] The invention relates to the related technical field of chip wafer processing, in particular to a semiconductor chip wafer rod transfer and cutting device. Background technique

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon.

[0003] Generally, the common silicon wafer production process includes: silicon extraction and purification, single crystal silicon growth, and wafer molding. Among them, the purification of silicon is the first process, and sandstone raw materials need to be placed in a temperature exceeding 2,000 degrees Celsius In an electric arc furnace with a carbon source, a reduction reaction occurs at a high temperature to obtain metallurgical-grade silicon, and then the pulverized metallurgical-grade silicon i...

Claims

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