A kind of sicp/al-si-cu composite powder material and preparation method
An al-si-cu, composite powder technology, applied in metal processing equipment, transportation and packaging, etc., can solve the problems affecting the performance of powder metallurgy formed products, difficult to control powder particle size, poor interface bonding performance, etc., to improve flow Properties and physical and chemical properties, reducing surface impurities, reducing the effect of surface tension
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0036] The embodiment of the present invention provides a method for preparing SiCp / Al-Si-Cu composite material powder with high purity, high performance and fine particle size, which includes the following steps:
[0037] S1, SiCp / Al-Si-Cu composite material composition design:
[0038] In S1, increase Si and Cu content to improve fluidity and mechanical properties; add Mg, Sb, P elements to modify and improve wettability; add Zr element to refine grains; in order to meet low expansion, wear resistance and other properties , add the SiCp component. Raw materials include: Si: 5-20%; Cu: 0.2-6%; Mg: 0.1-3.0%; Sb: 0.01-0.20%; Zr: 0.05-0.80%; Fe: 0.20-0.80%; : 0.05-0.50%, the rest is Al. The mass ratio of SiCp to Al-Si-Cu is (1:2)-(1:20).
[0039] S2, SiC powder pretreatment:
[0040] In S2, put 10-150 μm national standard silicon carbide powder into a container filled with acetone, and clean it in an ultrasonic cleaner. Cleaning time: 10-40min, heating temperature: 45-55°C,...
Embodiment 1
[0048] This embodiment provides a method for preparing a high-purity, high-performance, fine-grained SiCp / Al-Si-Cu composite material powder, the steps are as follows:
[0049] S1. Composition design of SiCp / Al-Si-Cu composite material, Al-Si-Cu components are calculated by mass fraction, raw materials include: Si: 5.0%; Cu: 6.0%; Mg: 0.1%; Sb: 0.20%; Zr : 0.80%; Fe: 0.20%; P: 0.05%, the balance is Al, and the mass ratio of SiCp to Al-Si-Cu components is 1:15.
[0050] S2. Add 10 μm national standard silicon carbide powder into a container filled with acetone, and clean it in an ultrasonic cleaning machine. The cleaning time is 10 minutes, the heating temperature is 50°C, the vibration frequency is 15khz, and then ultrasonic cleaning is performed twice with distilled water. dry.
[0051] S3, at first the AlSiCu alloy ingot that does not contain Sb, Mg, P, Zr element is melted at 680 ℃; After melting, add Al-Sb master alloy, Al-Zr master alloy, high-purity magnesium successiv...
Embodiment 2
[0055] This embodiment provides a high-purity, high-performance, fine-grain SiCp / Al-Si-Cu composite powder preparation method, the steps are as follows:
[0056] S1, SiCp / Al-Si-Cu composite composition design: Si: 9.5%; Cu: 3.0%; Mg: 1.0%; Sb: 0.1%; Zr: 0.25%; Fe: 0.5%; The amount is Al, and the mass ratio of SiCp to Al-Si-Cu components is 1:3.
[0057] S2. Add 70 μm national standard silicon carbide powder into a container filled with acetone, and clean it in an ultrasonic cleaning machine. Cleaning time: 20min, heating temperature: 53°C, vibration frequency 30khz. Ultrasonic cleaning was performed three times with distilled water, and then dried in a drying oven after cleaning. First at 65°C for 35 minutes, then at 300°C for 80 minutes to perform double-stage drying.
[0058] S3, first melt the AlSiCu alloy ingot without Sb, Mg, P, Zr elements at 720 ° C; after melting, add Al-Sb master alloy, Al-Zr master alloy, high-purity magnesium (adding temperature 760 °C) through a...
PUM
Property | Measurement | Unit |
---|---|---|
bulk density | aaaaa | aaaaa |
density | aaaaa | aaaaa |
density | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com