A kind of mems microphone chip with dustproof structure and manufacturing method thereof

A dust-proof structure and microphone technology, applied in sensor parts, microphone port/microphone accessories, sensors, etc., can solve the problem that dust particles are easy to enter the chip, affect the performance and reliability of MEMS microphones, enter the diaphragm and between backplanes, etc., to avoid damage to chip performance, avoid accumulation of dust particles, and improve reliability.

Active Publication Date: 2021-11-05
山东新港电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the air leakage path after the air leakage valve is opened is large, dust particles are easy to enter the chip, especially directly between the diaphragm and the backplane, thereby affecting the performance and reliability of the MEMS microphone

Method used

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  • A kind of mems microphone chip with dustproof structure and manufacturing method thereof
  • A kind of mems microphone chip with dustproof structure and manufacturing method thereof
  • A kind of mems microphone chip with dustproof structure and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] Embodiment 1: as Figure 3-Figure 4 Shown, a kind of MEMS microphone chip with dust-proof structure provided by the invention comprises:

[0069] The substrate 10 is provided with a back cavity 11 penetrating vertically;

[0070] The diaphragm 30 is arranged at intervals on one side of the substrate 10, and at least part of the diaphragm 30 is movably arranged above the back cavity 11;

[0071] The back plate 50 is arranged at intervals on the side of the diaphragm 30 away from the substrate 10; the back plate 50 is also provided with a plurality of through holes 53 arranged at intervals and penetrating the back plate 50 vertically;

[0072] The vibration gap 43 is arranged between the diaphragm 30 and the back plate 50, and forms a capacitor structure together with the diaphragm 30 and the back plate 50;

[0073] The sacrificial layer 40 is located between the diaphragm 30 and the back plate 50 and outside the vibration gap 43;

[0074] The insulating layer 20 is lo...

Embodiment 2

[0093] Example 2: See Figure 5 , in this embodiment of the present invention, backplane 50 can adopt the sandwich structure thin film that silicon nitride / doped polysilicon / silicon nitride are compounded, and at this moment, dust-proof structure 42 is made of the silicon nitride of backplane 50 Layer formation, since silicon nitride is electrically insulating, there is no need to form isolation trenches 54 . The remaining parts in this embodiment are the same as in Embodiment 1.

Embodiment 3

[0094] Embodiment 3: the present invention also provides the manufacturing method of the above-mentioned MEMS microphone chip with dust-proof structure, please refer to Image 6 , including the following steps:

[0095] S1: Provide a substrate 10, form an insulating layer 20 and a diaphragm 30 on the substrate 10, and partially etch a gas release valve 31 on the diaphragm 30, as Figure 7a-Figure 7b shown;

[0096] Specifically, the substrate 10 is a double-sided polished semiconductor substrate, including but not limited to a silicon substrate, a germanium substrate, and a silicon carbide substrate; in an embodiment of the present invention, the substrate 10 is double-sided polished single crystal silicon substrate.

[0097] Specifically, the insulating layer 20 is made of silicon oxide, which can be formed by thermal oxidation, low pressure chemical vapor deposition, or plasma chemical vapor deposition; in the embodiment of the present invention, the insulating layer 20 is...

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PUM

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Abstract

The present invention provides a MEMS microphone chip with a dust-proof structure and a manufacturing method thereof. The MEMS microphone chip comprises: a substrate provided with a back cavity penetrating up and down; a capacitor structure arranged on the same side of the substrate The diaphragm, the back plate, and the vibration gap between the diaphragm and the back plate; the diaphragm is provided with a vent valve, and the periphery of the vent valve is provided with a dust-proof structure; the dust-proof structure The upper and lower ends are respectively connected with the backboard and the diaphragm. The technical solution disclosed in the present invention arranges a dust-proof structure surrounding the air release valve between the diaphragm and the back plate, which can prevent dust particles from directly entering the vibration gap from the side to cause damage while ensuring the pressure relief capacity of the air release valve. The performance of the chip is compromised, thereby improving the reliability of the MEMS microphone chip.

Description

technical field [0001] The invention belongs to the technical field of electroacoustic devices, and in particular relates to a MEMS microphone chip with a dustproof structure and a manufacturing method thereof. Background technique [0002] MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) microphone has attracted people's attention due to its high sensitivity, low power consumption, flat frequency response and many other advantages, and has become the mainstream of today's microphone market. The MEMS chip is an important part of the MEMS microphone. Its working principle is: the diaphragm vibrates under the action of sound waves, which changes the distance between the diaphragm and the back plate, thereby changing the capacitance and converting the sound wave signal into an electrical signal. [0003] When the MEMS chip is subjected to severe impacts such as blowing or dropping, the diaphragm is easily broken and damaged due to excessive pressure, whic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R1/08H04R31/00
CPCH04R1/083H04R31/00H04R31/003H04R2201/003H04R2307/023H04R2307/027
Inventor 不公告发明人
Owner 山东新港电子科技有限公司
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