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Epoxy composite material with heterostructure and preparation method thereof

A composite material, heterogeneous structure technology, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc. Good thermal conductivity, increased electromagnetic shielding properties, increased electrical insulation properties

Active Publication Date: 2021-09-03
HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the introduction of nano-carbon materials will greatly affect the insulating properties of epoxy resins. At the same time, the continuous overlapping of fillers and fillers requires a high filler filling amount, which usually leads to processing difficulties and even a decline in mechanical properties.

Method used

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  • Epoxy composite material with heterostructure and preparation method thereof
  • Epoxy composite material with heterostructure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A method for preparing an epoxy composite material with a heterogeneous structure of heat conduction, heat storage and electromagnetic shielding properties, comprising the following steps:

[0032] S1. Modification of low-melting-point alloys: Mix ethanol and chloroform at a mass ratio of 1:1.5 to obtain a mixed solution of ethanol-chloroform, and mix the low-melting-point alloy SnBi with a particle size of 30 μm 17 Cu 0.5 Add it into the ethanol-chloroform mixed solution together with propyl methylphosphoric acid, take it out after soaking for 28 hours, and place it in a new ethanol-chloroform mixed solution for 15 minutes to remove excess modifier.

[0033]S2. Modification of insulating inorganic filler: mix absolute ethanol and Tris-HCl solution buffer solution according to the volume ratio of 1:1.5, add 4g of silicon nitride with a particle size of 15μm and ultrasonically treat for 40min to disperse, and adjust the pH value of the suspension If it is 9.0, add 0.12g...

Embodiment 2

[0038] The preparation method is the same as in Example 1, the difference is that 8.8g of modified SnBi is weighed in step S4 17 Cu 0.5 (particle size is 30 μm), as a comparative example of Example 1, an epoxy composite material 2 with a heterogeneous structure was prepared.

Embodiment 3

[0040] The preparation method is the same as that of Example 1, except that 0.48 g of modified silicon nitride is weighed in step S4 as a comparative example of Example 1 to prepare the epoxy composite material 3 with heterogeneous structure.

[0041] The thermal conductivity of table 1 embodiment 1, 2 and 3, the comparison of electric insulation performance and shielding effectiveness

[0042]

[0043] As can be seen from the data in Table 1, comparing Example 1 and Example 2, under the condition that the content of modified carbon nitride is constant, as the modified SnBi 17 Cu 0.5 As the content increases, the thermal conductivity of the bottom of the epoxy composite material is greatly improved, so it can be modified by changing the SnBi 17 Cu 0.5 The amount of addition can be used to control the thermal conductivity of the bottom of the epoxy composite material. Comparative example 1 and embodiment 3, in modified SnBi 17 Cu 0.5 When the content remains unchanged, ...

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Abstract

The invention discloses a heat conduction, heat storage and electromagnetic shielding epoxy composite material with a heterostructure and a preparation method thereof, and belongs to the technical field of electronic packaging materials. The epoxy composite material is composed of epoxy resin, modified low-melting-point alloy and modified insulating inorganic filler and is of a heterostructure, the modified insulating inorganic filler is dispersed at the top of the composite material, the modified low-melting-point alloy is dispersed at the bottom of the composite material, and the lower surface of the modified low-melting-point alloy is coated with the epoxy resin. Good heat conduction, heat storage and electromagnetic shielding performance are achieved, and the upper and lower surfaces have excellent electrical insulating properties. The epoxy composite material is prepared by taking epoxy, a curing agent and a curing accelerator as precursors, uniformly mixing the precursors, sequentially adding the modified insulating inorganic filler and the modified low-melting-point alloy, uniformly stirring, quickly removing bubbles in vacuum and curing step by step, and is simple in process route, low in cost and easy to produce on a large scale.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging materials, and in particular relates to an epoxy composite material with a heterogeneous structure and a preparation method thereof. Background technique [0002] In recent years, with the widespread introduction of high-frequency chips and the upgrading of hardware components in consumer electronics, 5G communications, computers and other fields, electromagnetic interference and electromagnetic radiation between devices and inside devices are ubiquitous, seriously affecting the safety and security of devices. Stability; at the same time, with the increase of equipment power and the decrease of volume, the calorific value of equipment also increases rapidly, which seriously affects the service life and reliability of equipment. Therefore, the design of electronic products will require more and more effective EMI shielding and heat dissipation devices, and the demand for such dual-func...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J163/02C09J11/04
CPCC09J163/00C09J11/04C08K9/10C08K3/08
Inventor 张献张萍丁欣郑康刘香兰陈林田兴友
Owner HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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