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High-temperature-resistant, anti-corrosion and insulating vapor deposition equipment

A technology of anti-corrosion insulation and vapor deposition, which is applied in the direction of gaseous chemical plating, coating, metal material coating process, etc. It can solve the problems of easy corrosion, insufficient high temperature resistance, and affecting the efficiency of vapor deposition equipment.

Inactive Publication Date: 2021-09-07
北京市永康药业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Normally, the higher the temperature, the faster the vapor deposition rate. However, under high temperature conditions, the existing vapor deposition equipment has insufficient high temperature resistance, poor insulation, and is easily corroded, which affects the efficiency of vapor deposition equipment.

Method used

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  • High-temperature-resistant, anti-corrosion and insulating vapor deposition equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A vapor deposition equipment for high temperature resistance, anticorrosion and insulation, such as figure 1 , including a gas phase reaction chamber 1, the gas phase reaction chamber 1 includes a base 2, a heat insulation frame 3, a gas inlet 4, a wafer tray 5 and a gas outlet 6, the base 2 is fixedly arranged on the bottom of the gas phase reaction chamber 1, and the heat insulation frame 3 is erected Above the base 2 and fixedly connected to the base 2, the wafer tray 5 is arranged on the upper surface of the base 2, the gas inlet 4 is arranged on the top of the heat insulation frame 3, and the gas outlet 6 is arranged on one side of the heat insulation frame 3; The material of the thermal insulation frame 3 is modified quartz.

[0037] There are at least two gas inlets 4 and one gas outlet 6 .

[0038] The gas outlet 6 is located outside the heat insulation frame 3 and is connected with an air extraction device.

[0039] The material of the wafer tray 5 is graphit...

Embodiment 2

[0057] A vapor deposition equipment for high temperature resistance, anticorrosion and insulation, such as figure 1 , including a gas phase reaction chamber 1, the gas phase reaction chamber 1 includes a base 2, a heat insulation frame 3, a gas inlet 4, a wafer tray 5 and a gas outlet 6, the base 2 is fixedly arranged on the bottom of the gas phase reaction chamber 1, and the heat insulation frame 3 is erected Above the base 2 and fixedly connected to the base 2, the wafer tray 5 is arranged on the upper surface of the base 2, the gas inlet 4 is arranged on the top of the heat insulation frame 3, and the gas outlet 6 is arranged on one side of the heat insulation frame 3; The material of the thermal insulation frame 3 is modified quartz.

[0058] There are at least two gas inlets 4 and one gas outlet 6 .

[0059] The gas outlet 6 is located outside the heat insulation frame 3 and is connected with an air extraction device.

[0060] The material of the wafer tray 5 is graphit...

Embodiment 3

[0078] A vapor deposition equipment for high temperature resistance, anticorrosion and insulation, such as figure 1 , including a gas phase reaction chamber 1, the gas phase reaction chamber 1 includes a base 2, a heat insulation frame 3, a gas inlet 4, a wafer tray 5 and a gas outlet 6, the base 2 is fixedly arranged on the bottom of the gas phase reaction chamber 1, and the heat insulation frame 3 is erected Above the base 2 and fixedly connected to the base 2, the wafer tray 5 is arranged on the upper surface of the base 2, the gas inlet 4 is arranged on the top of the heat insulation frame 3, and the gas outlet 6 is arranged on one side of the heat insulation frame 3; The material of the thermal insulation frame 3 is modified quartz.

[0079] There are at least two gas inlets 4 and one gas outlet 6 .

[0080] The gas outlet 6 is located outside the heat insulation frame 3 and is connected with an air extraction device.

[0081] The material of the wafer tray 5 is graphit...

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Abstract

The invention relates to high-temperature-resistant, anti-corrosion and insulating vapor deposition equipment. The high-temperature-resistant, anti-corrosion and insulating vapor deposition equipment comprises a vapor reaction chamber, wherein the vapor reaction chamber comprises a base, a heat-isolation frame, a gas inlet, a wafer tray and a gas outlet, the base is fixedly arranged at the bottom of the vapor reaction chamber, and the heat-isolation frame is erected above the base and fixedly connected with the base; the wafer tray is arranged on the upper surface of the base, the gas inlet is formed in the top of the heat-isolation frame, and the gas outlet is formed in one side surface of the heat-isolation frame; and the heat-isolation frame is made of modified quartz. The heat-isolation frame is used for isolating a temperature in the reaction chamber, so that normal reaction is guaranteed, meanwhile, energy waste can be reduced, the wafer tray is used for bearing wafers to complete deposition, the gas inlet is used for guiding reaction gas into the reaction chamber, and the gas outlet is used for discharging redundant gas. The high-temperature-resistant, anti-corrosion and insulating vapor deposition equipment is characterized in that the heat-isolation frame in the vapor reaction chamber is improved, so that the vapor deposition equipment can bear higher temperature and is more durable.

Description

technical field [0001] The invention relates to the field of vapor deposition equipment, in particular to a high temperature resistant, anti-corrosion and insulating vapor deposition equipment. Background technique [0002] Chemical Vapor Deposition (CVD) is the most widely used technique in the semiconductor industry to deposit a variety of materials, including a wide range of insulating materials, most metallic materials and metal alloy materials. Theoretically speaking, two or more gaseous raw materials are introduced into a reaction chamber, and then they chemically react with each other to form a new material and deposit a single crystal thin film compound. Normally, the higher the temperature, the faster the vapor deposition rate. However, under high temperature conditions, the existing vapor deposition equipment has insufficient high temperature resistance, poor insulation, and is easily corroded, which affects the efficiency of vapor deposition equipment. . Conten...

Claims

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Application Information

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IPC IPC(8): C23C16/44C03C1/02C03C3/06
CPCC23C16/44C03C3/06C03C1/02
Inventor 王艳华秦红燕
Owner 北京市永康药业有限公司
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