Cutting steel wire surface treatment device for semiconductor wafer
A surface treatment device and technology for cutting steel wire, which is applied in the direction of thin material processing, grinding drive device, grinding/polishing safety device, etc., can solve the problems of heavy cutting steel wire, troublesome manual handling, poor processing effect, etc., and achieve convenient cleaning Cleans, prevents detachment, improves wiping effect
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[0037]The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0038] see Figure 1-7 , the present invention provides a technical solution: a cutting wire surface treatment device for semiconductor wafers, such as figure 1 , figure 2 and image 3 As shown, the inside of the device body 1 is connected with a brush roller 2 rotating close to the left side, and the upper end of the brush roller 2 penetrates the device body 1 and is connected to the first rotating shaft 3, and at the same time, the left and right first rot...
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