Cutting steel wire surface treatment device for semiconductor wafer
A surface treatment device and technology for cutting steel wire, which is applied in the direction of thin material processing, grinding drive device, grinding/polishing safety device, etc., can solve the problems of heavy cutting steel wire, troublesome manual handling, poor processing effect, etc., and achieve convenient cleaning Cleans, prevents detachment, improves wiping effect
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[0037]Next, the technical solutions in the embodiments of the present invention will be apparent from the embodiment of the present invention, and it is clearly described, and it is understood that the described embodiments are merely embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.
[0038] See Figure 1-7 The present invention provides a technical solution: a semiconductor wafer dicing wire surface treatment apparatus, such as figure 1 , figure 2 with image 3 Shown, inside the apparatus body 1 near the left brush roller 2 rotatably connected, through the upper end 2 and the brush roller means 3 is connected to the first rotary shaft 1, while the left and right between the first shaft 34 is connected via a toothed belt, apparatus 1 comprises a cleaning chamber 101, pickling chamber 102, heating chamber 10...
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