The invention discloses a
cutting steel wire surface treatment device for a
semiconductor wafer. The
cutting steel wire surface treatment device comprises a device body, a hot air fan, a fixing frame, a supporting plate, a collecting box and third hydraulic telescopic rods,
brush rollers are rotationally connected to the position, close to the left side, in the device body, the upper ends of the
brush rollers penetrate through the device body to be connected with first rotating shafts, the left first rotating shaft and the right first rotating shaft are connected through a
toothed belt, the front first rotating shaft and the rear first rotating shaft on the right side are in meshed connection through first gears, the first gears are arranged on the first rotating shafts in a penetrating mode, and meanwhile the first rotating shaft on the right rear side is connected with a first motor. According to the
cutting steel wire surface treatment device for the
semiconductor wafer, a cutting steel wire
raw material penetrates through the
brush rollers, the brush rollers are driven to rotate through the gears, the
toothed belt and the first rotating shaft under the action of the first motor,
rust removal treatment is conducted on the cutting steel wire
raw material through the brush rollers in a mechanical mode, and follow-up surface treatment
machining is facilitated, and in addition, flying dust generated in the
rust removal process can be sucked into the collecting box under the action of a draught fan and a suction
pipe.