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Heating body and preparation method and application thereof

A heating element and heating element green body technology, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problem of high process cost, large grain growth of aluminum nitride ceramics, which is not conducive to large-scale production and market of products Promotion and other issues to achieve high thermal conductivity and meet the effect of process requirements

Pending Publication Date: 2021-09-17
合肥商德应用材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for the aluminum nitride ceramic heating element, the method of secondary sintering correction, that is, secondary sintering, will lead to the growth of aluminum nitride ceramic grains, thereby reducing the bending strength and thermal conductivity of the product, and will also lead to Decreased equipment utilization, increased manpower and energy costs
Make the process cost of aluminum nitride ceramic heating element with higher cost already higher, which is not conducive to the large-scale production and market promotion of products
[0006] The method of grinding after one-time sintering is to use flat grinding or grinding to eliminate surface unevenness after the aluminum nitride ceramic substrate is sintered. This requires a certain grinding allowance for the product, thus increasing the product’s Production and Material Costs
More importantly, for aluminum nitride co-fired ceramic heating elements, although the simple post-use grinding process can make the surface flatness of the product meet the requirements, it often makes the distance between the position of each point of the printed circuit layer and the surface inconsistent, As a result, the temperature uniformity of each point is difficult to meet the requirements of use

Method used

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  • Heating body and preparation method and application thereof
  • Heating body and preparation method and application thereof
  • Heating body and preparation method and application thereof

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Experimental program
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preparation example Construction

[0032] A method for preparing a heating element, comprising the following steps:

[0033] placing the green body of the heating element in a sintering device, placing at least three pre-fired supports around the green body of the heating element to support the plate above the green body of the heating element, placing the sintering device in an inert protective atmosphere, Sintering the green body of the heating element, the green body of the heating element is an aluminum nitride ceramic green body containing a circuit layer;

[0034] The composition of the supporting piece and the green body of the heating element is the same, and the pre-firing temperature of the supporting piece is (T-100°C) ~ T, T is the sintering reaction temperature of aluminum nitride and the sintering aid, and the thickness of the supporting piece is greater than that of the raw body of the heating element. The thickness of the billet is 0.2 mm to 1 mm, and the plate is used to pressurize the green bo...

Embodiment 1

[0061] figure 1 It is a front perspective schematic diagram of the positional relationship between the sintering device, the support and the plate used in the preparation of the aluminum nitride ceramic heating element in this embodiment. In this embodiment, the sintering device 1 is a boron nitride crucible, the support 2 is pre-fired at 1500° C. for 2 hours, and the plate 3 is a tungsten steel plate.

[0062] 1) Preparation of aluminum nitride ceramic heating element green body

[0063] Take the aluminum nitride ceramic slurry and cast it to make the ceramic raw porcelain tape, add 3.5wt% Y in the aluminum nitride slurry 2 o 3 as a sintering aid. The tungsten metal paste is printed on the ceramic green tape by the screen printing process and dried to form a circuit, and the printed green tape is stacked up and down, which contains 6 layers of printed circuits inside. Then the laminated multi-layer ceramic raw porcelain belt was hot-pressed at 20MPa, 65°C for 45min, and t...

Embodiment 2

[0067] In this embodiment, the support member 2 is pre-fired at 1550° C. for 2 hours.

[0068] 1) Preparation of aluminum nitride ceramic heating element green body

[0069] Take the aluminum nitride ceramic slurry and cast it into a ceramic green ceramic belt, and add 5wt% Y in the aluminum nitride slurry 2 o 3 as a sintering aid. The tungsten metal paste is printed on the ceramic green tape by the screen printing process and dried to form a circuit, and the printed green tape is laminated by upper and lower alignment, which contains 4 layers of printed circuits inside. Then the laminated multi-layer ceramic raw porcelain belt was hot-pressed at 15MPa, 70°C for 60min, then pressed at 80MPa, 70°C for 25min, and processed to prepare a diameter of 300mm and a thickness of 10mm. Aluminum nitride ceramic heating element green body.

[0070] 2) Preparation of aluminum nitride ceramic heating element

[0071] Take 4 pieces of leftovers left over from the above cutting process a...

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Abstract

The invention relates to the technical field of heating body sintering, in particular to a heating body and a preparation method and application thereof. The preparation method of the heating body comprises the following steps: placing a heating body green body in a sintering device, placing at least three pre-sintered supporting pieces around the heating body green body to support a plate positioned above the heating body green body, and placing the sintering device in an inert protective atmosphere to sinter the heating body green body, wherein the heating body green body is an aluminum nitride ceramic green body comprising a circuit layer. The supporting pieces and the heating body green body are the same in composition, the pre-sintering temperature of the supporting piece is (T-100 DEG C)-T, T is the sintering reaction temperature of aluminum nitride and the sintering aid, the thickness of the supporting piece is 0.2 mm-1mm greater than that of the heating body green body, and the heating body green body is pressurized in the sintering process of the plate. The heating body prepared by the method has high flatness and thermal conductivity. The invention also provides the heating body prepared by the preparation method and application of the heating body as a wafer heating device.

Description

technical field [0001] The invention relates to the technical field of heating element sintering, in particular to a heating element and its preparation method and application. Background technique [0002] In the semiconductor process, people usually bond, debond, etch or deposit on the surface of the wafer through various physical or chemical methods. In the above-mentioned processing procedures and processing equipment, a ceramic heating element is usually used to heat the silicon wafer. The temperature uniformity of the ceramic heating element directly affects the processing quality of the wafer and ultimately affects the performance and yield of the chip. [0003] With the development of large-scale integrated circuits, high-power modules and LEDs, in order to further improve packaging efficiency, reduce costs, and expand application areas, wafers for making chips tend to use large-size wafers such as 8 inches and 12 inches. In order to meet the quality and yield requi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/581C04B35/622C04B35/64H01L21/67C04B41/88
CPCC04B35/581C04B35/622C04B35/64H01L21/67098C04B41/88C04B41/009C04B41/51C04B2235/3225C04B2235/3208C04B2235/3224C04B2235/3203C04B2235/3409C04B2235/445C04B2235/3817C04B2235/9607C04B2235/96C04B41/4539
Inventor 杨雪蛟付苒谭毅成
Owner 合肥商德应用材料有限公司