Integrated substrate gap waveguide millimeter wave annular coupler based on multilayer packaging

Abstract

The invention discloses an integrated substrate gap waveguide millimeter wave annular coupler based on multilayer packaging, which belongs to the electrical field, and is characterized in that three layers of media are constructed, the bottommost layer is a PMC layer of which the lower surface is coated with metal copper, a plurality of metal via holes are periodically arranged in the layer, the upper edge tightly abuts against a circular metal patch, and the lower edge is connected with the metal copper to form a mushroom-shaped EBG array; the middle layer is a layer of dielectric plate; the uppermost layer is a gap layer, the lower surface is printed with a hybrid ring coupling microstrip line, and the upper surface is coated with a layer of metal copper; the microstrip line comprises four sections of microstrip lines as ports, and seven sections of microstrip lines form a two-section hybrid ring; different ports are excited, and the bandwidth is enhanced to 50% through the two-section hybrid ring structure; and the metal copper on the uppermost layer and the mushroom type EBG array on the lowermost layer in the three layers of dielectric plates form a substrate gap waveguide, the working frequency band is distributed between 24 GHz and 40 GHz, and most of 5G millimeter wave frequency bands are covered. The antenna is low in transmission loss, compact in structure and easy to process and integrate.

Description

technical field [0001] The invention belongs to the electrical field, and relates to a passive radio frequency device, in particular to a millimeter-wave ring coupler based on a multilayer packaging integrated substrate gap waveguide. Background technique [0002] In recent years, people's demand for wireless communication has been increasing day by day, which has continuously promoted the development of communication technology. With the popularization of wireless communication equipment, low-frequency spectrum resources have become increasingly tight. The crowded spectrum has been unable to meet the high-speed, large-capacity and low latency requirements. [0003] With the development of 5G mobile communication systems, the entire mobile communication industry has begun to explore new frequency bands. Research on high-frequency frequency bands, especially millimeter wave frequency bands, has attracted more and more attention from researchers, experts and scholars. As an i...

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Problems solved by technology

Traditional waveguide structures such as microstrip line structure, stripline structure or rectangular waveguide structure can no longer meet the design requirements of high frequency circuits due to the problems of radiation loss, surface wave, insertion loss, high processing cost and easy mode conversion loss. , so researchers have turned their attention to the gap waveguide structure that can be applied to the millimeter wave frequency band

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