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Metal single crystal preparation device and process

A preparation device and preparation process technology, applied in the field of metal single crystal preparation devices, can solve the problems of poor overall consistency, low single crystal ratio, easy formation of micropores, etc., and achieve continuous feeding, easy precision machining, and stable chemical properties. Effect

Pending Publication Date: 2021-10-01
上海希金维纳新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing copper single crystal preparation process, such as continuous casting method, etc., it is repeated casting, and the rapid cooling leads to the formation of micropores during the shrinkage process, and the prepared whole material has a low single crystal ratio and contains a large amount of The phenomenon of polycrystalline grain boundary, high dislocation density and poor overall consistency

Method used

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  • Metal single crystal preparation device and process
  • Metal single crystal preparation device and process
  • Metal single crystal preparation device and process

Examples

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Embodiment Construction

[0037] In order to further illustrate the various embodiments, the present invention provides accompanying drawings, which are part of the disclosure of the present invention, and are mainly used to illustrate the embodiments, and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments, for reference Those of ordinary skill in the art should be able to understand other possible implementations and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0038] In the description of the present invention, it should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, so that those familiar with this technology can understand and read , is not used to limit the restri...

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PUM

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Abstract

The invention discloses a metal single crystal preparation device and process, and the device comprises a furnace body; and a seed crystal rod, a seed crystal fixed with the seed crystal rod, a thermal insulation layer, a crucible cover fixed with the thermal insulation layer, a mold fixed with the crucible cover, a crucible located in a space enclosed by the thermal insulation layer, and a crucible pillar for supporting the crucible, which are sequentially arranged in the furnace body from top to bottom. The furnace body is provided with an air inlet and an air outlet, and the outer wall of the thermal insulation layer is provided with an induction coil for heating the crucible. The crystal forming rate of the copper raw material is greatly increased, and the single crystal quality and process repeatability of the prepared material are improved; through intervention of a mold, the copper melt can be drawn according to the shape of a finished product, and the machining cost is reduced.

Description

technical field [0001] The invention relates to the technical field of metal single crystal preparation, in particular to a metal single crystal preparation device and process. Background technique [0002] The metal copper single crystal workpiece is composed of long-range ordered copper atoms, which eliminates the grain boundaries in the material, avoids the generation of resistance generation sources and signal reduction sources, and makes copper single crystal materials have excellent electrical conductivity and ductility. . Compared with ordinary copper materials, the quality of audio and video transmission, conductive signal transmission, and ultra-long thin wire drawing has been greatly improved. It has a very wide range of applications in the fields of new energy vehicles, consumer electronics, microelectronic devices, and integrated circuit preparation. [0003] In the existing copper single crystal preparation process, such as continuous casting method, etc., it ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B29/02C30B15/34C30B15/36C30B15/30C30B15/14
CPCC30B29/02C30B15/34C30B15/36C30B15/005C30B15/305C30B15/14
Inventor 王小璐
Owner 上海希金维纳新材料科技有限公司
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