Flexible pressure sensing structure and flexible pressure sensor

A pressure and flexibility technology, applied in the field of flexible sensors, can solve the problems of reduced sensitivity and poor stability, and achieve the effects of increased sensitivity, strong scalability, and simple design principles

Pending Publication Date: 2021-10-01
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the technical problems of the existing piezoresistive pressure sensor that the sensitivity decreases with the increase of pressure and the stability is poor, and to provide a flexible pressure sensing structure and a flexible pressure sensor

Method used

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  • Flexible pressure sensing structure and flexible pressure sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A novel flexible pressure sensing structure prepared by the following method:

[0035] 1) The 6 μm thick copper foil was hot-pressed on the polydimethylsiloxane film by the lamination method, and the interdigitated electrode array was processed by the laser direct writing process.

[0036] 2) Under the condition of 3000rmp / 30s, spin-coat the conductive carbon oil on the silicon-based inverted pyramid template. When the carbon film is semi-cured, attach the conductive copper foil to the carbon film, and peel off the carbon film after curing, thus , interdigitated electrode pairs surface-integrated miniature conductive pyramid arrays, see figure 1 in c.

[0037] 3) Under the condition of 3000rmp / 60s, spin-coat the conductive carbon oil on the PVA film, and heat it at 80°C for 60s. After the conductive film is cured, use the water transfer method to transfer the conductive film to the surface of the PI film, and then use the laser to write directly patterning of conducti...

Embodiment 2

[0042] A novel flexible pressure sensing structure prepared by the following method:

[0043] 1) The 6 μm thick copper foil is hot-pressed on the polydimethylsiloxane film by the lamination method, and the copper foil is processed by laser direct writing to form an arrayed ring-shaped lower electrode and an upper electrode. The upper electrode is smaller in diameter than the lower electrode. surface electrode.

[0044] 2) The patterned PI film after laser direct writing is used as a mask and attached to the lower electrode.

[0045] 3) Under the condition of 3000rmp / 60s, spin-coat the conductive carbon oil on the lower electrode, and cure it at 80°C for 30s. When the film is semi-cured, align and bond the upper electrode array on the conductive film; A flexible pressure-sensing structure without microstructures is formed.

[0046]The flexible pressure sensing structure is used for further processing. After the electrode leads, the Ecoflex solution is spin-coated at 5000rmp / 3...

Embodiment 3

[0049] A novel flexible pressure sensing structure prepared by the following method:

[0050] 1) Hot-press 6μm thick copper foil on the polydimethylsiloxane film by lamination method, and use laser direct writing copper foil to form an arrayed ring-shaped lower electrode and upper electrode. The diameter of the upper electrode is smaller than that of the lower electrode surface electrodes.

[0051] 2) Under the condition of 3000rmp / 30s, spin-coat the conductive carbon oil on the silicon-based inverted pyramid template. When it is semi-cured, attach the copper foil electrode to the carbon film, and peel it off after curing to form a film, thus obtaining surface integration. Electrodes with micro-pyramid structures, see figure 1 in a.

[0052] 3) Use the patterned PI film after laser direct writing as a mask, and attach it to the lower arrayed electrode, apply conductive carbon oil to the lower electrode by spin coating, and cure at 80°C for 30s, and wait until the film is hal...

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Abstract

The invention provides a flexible pressure sensing structure and a flexible pressure sensor, and solves the technical problems that the sensitivity of an existing piezoresistive pressure sensor is reduced along with the increase of pressure, and the stability is poor. The flexible pressure sensing structure comprises a conductive film, an upper electrode and a lower electrode, wherein the upper electrode and the lower electrode are respectively adhered to the upper surface and the lower surface of the conductive film and are arranged in a face-to-face staggered manner; when the flexible pressure sensing structure is under pressure, the conductive film generates strain along the direction vertical to the electrode plane, so that the resistance is increased, that is, when the pressure is applied to the structure, the stress of the upper electrode acting on the conductive film enables the film to pass through the hollow part (namely the gap) between the electrodes to generate strain vertical to the electrode plane, and the resistance of the sensing unit is increased along with the increase of the pressure.

Description

technical field [0001] The invention belongs to the technical field of flexible sensors, and in particular relates to a novel flexible pressure sensing structure and a flexible pressure sensor. Background technique [0002] The flexible piezoresistive pressure sensor is the most widely studied sensor in the past 20 years. It has the advantages of simple structure, large working range, and good stability. It has potential development in the fields of wearable health monitoring, smart medical care, and human-computer interaction. need. A practical pressure sensor needs to have a high sensitivity value. [0003] Practical pressure sensors need to have higher sensitivity values. The sensitivity of piezoresistive pressure sensors is defined as the rate of change of resistance under certain pressure conditions. Therefore, to improve sensitivity, the amount of resistance change under certain pressure must be increased. However, the resistance of most current pressure sensors decr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/22
CPCG01L1/2293
Inventor 王学文李玥杨亚宝卢乾波
Owner NORTHWESTERN POLYTECHNICAL UNIV
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