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Method for improving roughness of inner surfaces of laser ablation micropores and grooves

A technology of laser ablation and inner surface, which is applied in the micro-nano field to achieve the effect of improving smoothness and easy cleaning

Active Publication Date: 2021-10-08
HANGZHOU DIANZI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when there are higher requirements for the roughness of microstructures such as holes and grooves, untreated laser ablation microstructures can no longer meet the requirements, and the inner surface after ablation must be sufficiently smooth and flat.

Method used

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  • Method for improving roughness of inner surfaces of laser ablation micropores and grooves
  • Method for improving roughness of inner surfaces of laser ablation micropores and grooves
  • Method for improving roughness of inner surfaces of laser ablation micropores and grooves

Examples

Experimental program
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Effect test

Embodiment 1

[0029] like figure 1 As shown, a method for improving the surface roughness of laser ablation micropores and grooves comprises the following steps,

[0030] S1: Use mechanical design software CAD to draw a 10mm*10mm rectangle as a polymer PMMA substrate, engrave 3-7 microholes with a diameter of 500μm in the middle of the rectangle, and draw 2-5 straight lines not exceeding the length and width of the rectangle. Import the drawn CAD drawings into the supporting software of the laser engraving machine. Put the 3-5mm thick polymer PMMA substrate into the laser engraving machine, then perform knife setting, and finally adjust the engraving power of the laser engraving machine to start engraving the required ablation holes and ablation grooves;

[0031] S2: After placing the engraved polymer PMMA substrate with ablation holes and ablation grooves in a glass container in the dark, use a needle to absorb a chloroform solution dissolved in methanol and drop it on the polymer PMMA su...

Embodiment 2

[0036] like figure 2 As shown, a method for improving the surface roughness of laser ablation micropores and grooves comprises the following steps,

[0037] S1: Use mechanical design software CAD to draw a 10mm*10mm rectangle as a polymer PMMA substrate, engrave 3-7 microholes with a diameter of 500μm in the middle of the rectangle, and draw 2-5 straight lines not exceeding the length and width of the rectangle. Import the drawn CAD drawings into the supporting software of the laser engraving machine. Put the 3-5mm thick polymer PMMA substrate into the laser engraving machine, then perform knife setting, and finally adjust the engraving power of the laser engraving machine to start engraving the required ablation holes and ablation grooves;

[0038] S2: After placing the engraved polymer PMMA substrate with ablation holes and ablation grooves in a glass container in the dark, use a needle to absorb a chloroform solution dissolved in methanol and drop it on the polymer PMMA s...

Embodiment 3

[0043] like image 3As shown, a method for improving the surface roughness of laser ablation micropores and grooves comprises the following steps,

[0044] S1: Use mechanical design software CAD to draw a 10mm*10mm rectangle as a polymer PMMA substrate, engrave 3-7 microholes with a diameter of 500μm in the middle of the rectangle, and draw 2-5 straight lines not exceeding the length and width of the rectangle. Import the drawn CAD drawings into the supporting software of the laser engraving machine. Put the 3-5mm thick polymer PMMA substrate into the laser engraving machine, then perform knife setting, and finally adjust the engraving power of the laser engraving machine to start engraving the required ablation holes and ablation grooves;

[0045] S2: After placing the engraved polymer PMMA substrate with ablation holes and ablation grooves in a glass container in the dark, use a needle to absorb a chloroform solution dissolved in methanol and drop it on the polymer PMMA sub...

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Abstract

The invention belongs to the technical field of micro-nano, and particularly relates to a method for improving the roughness of the inner surfaces of laser ablation micropores and grooves. The method comprises the following steps of S1, conducting engraving and ablating treatment on a polymer PMMA substrate by using a laser engraving machine to prepare the required ablation holes and ablation grooves; S2, placing the engraved polymer PMMA substrate in a trichloromethane solution; S3, placing the polymer PMMA substrate with the trichloromethane solution in an ultrasonic field; S4, taking out the polymer PMMA substrate from the ultrasonic field, and conducting illumination treatment; and S5, after the trichloromethane is fully volatilized, cleaning the polymer PMMA substrate by using an ethanol solution. According to the method, the roughness of the surfaces of the micropores and the grooves of the polymer PMMA substrate can be effectively improved, and the smoothness of the inner surfaces of the micropores and the grooves of the polymer PMMA substrate is improved.

Description

technical field [0001] The invention belongs to the field of micro-nano technology, and in particular relates to a method for improving the surface roughness of laser ablation micro-holes and grooves. Background technique [0002] In recent years, the technology of laser ablation of micro-nano holes, grooves and other structures on polymer PMMA substrates has become a research hotspot in the world, and has been widely used in microfluidic chips and other fields. It organically combines high-resolution laser beam with numerical control technology and CAD / CAM technology, and can directly draw the cutting path through CAD software, and then ablate and carve micro-holes, grooves and other structures on the material. Compared with the commonly used chemical wet etching, the process is greatly reduced, the cost is also reduced, and the efficiency is improved a lot. It is especially suitable for the production of micro-nano structures, which has attracted people's attention. Laser...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B08B3/08B08B3/12
CPCB23K26/362B08B3/08B08B3/12
Inventor 张俐楠陆凯张一帆刘红英吴立群王洪成
Owner HANGZHOU DIANZI UNIV