Device for polishing outer end face of ceramic mixed-voltage integrated circuit board and method

Abstract

The invention discloses a device for polishing the outer end face of a ceramic mixed-pressure integrated circuit board. The device comprises a workbench (1), a power unit and a double-acting oil cylinder (2), the power unit and the double-acting oil cylinder (2) are arranged on the workbench (1), a rotating disc (3) is installed on an output shaft of the power unit, and polishing mechanisms (5) are arranged at the acting ends of two piston rods of the double-acting oil cylinder (2); and each polishing mechanism (5) comprises a mounting plate (6), a feeding oil cylinder (7) and a motor (8), the mounting plates (6) are fixedly arranged at the acting ends of the piston rods of the double-acting oil cylinder (2), the feeding oil cylinders (7) are rotatably arranged and fixedly arranged on the top surfaces of the mounting plates (6), an L-shaped plate (9) is fixedly arranged at the acting end of the piston rod of each feeding oil cylinder (7), and a movable plate (11) is fixedly arranged at the acting end of a piston rod of a longitudinal oil cylinder (10). The device has the beneficial effects of being compact in structure, relieving the labor intensity of workers, improving the integrated circuit board polishing efficiency and achieving batch polishing.

Description

technical field [0001] The invention relates to the technical field of grinding burrs on the outer end surface of a circuit board, in particular to a device and method for grinding the outer end surface of a ceramic mixed-pressure integrated circuit board. Background technique [0002] The ceramic hybrid integrated circuit board is an indispensable and important part of electronic equipment. The manufacturing process of the ceramic hybrid integrated circuit board uses the circuit substrate as the raw material, and successively passes through the flattening process, edge grinding, pickling process, and etching process. etc., the purpose of the edge grinding process is to polish the four end faces of the ceramic hybrid integrated circuit board, and then remove the burrs on the end faces, so as to prevent the burrs from hurting people's hands or prevent scratches between the circuit board and the circuit board. Further improve product quality. [0003] The existing methods of ...

AI Technical Summary

Problems solved by technology

[0003] The existing methods of grinding the four end faces of the ceramic hybrid integrated circuit board are mostly manual operation, that is, the worker uses a hand-held grinding wheel to grind along the length direction of the outer end face of the ceramic hybrid integrated circuit board. The four end faces of the mixed-pressure integrated circuit board are polished, but after one side is polished, the other side can be polished until the last side is polished, which undoubtedly increases the polishing time and reduces the polishing efficiency; It increases the work intensity of the workers

In addition, a worker can only polish a single piece of integrated circuit board, and the number of pieces polished every day is limited, thereby reducing the production output of integrated circuit boards, thereby reducing the economic benefits of circuit board manufacturers

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