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Composition and heat conducting material

A technology of composition and phenolic compound, which is applied in the field of composition and thermally conductive materials, and can solve problems such as difficult heat control of power semiconductor devices

Pending Publication Date: 2021-10-26
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Heat generated from power semiconductor devices that are densified with miniaturization becomes difficult to control

Method used

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  • Composition and heat conducting material
  • Composition and heat conducting material
  • Composition and heat conducting material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0554] Hereinafter, the present invention will be described in further detail based on examples. Materials, usage amounts, ratios, processing contents, processing procedures, and the like shown in the following examples can be appropriately changed unless departing from the gist of the present invention. Therefore, the scope of the present invention should not be limitedly interpreted by the Examples shown below.

[0555] [Preparation and evaluation of compositions]

[0556] [various ingredients]

[0557] Various components used in Examples and Comparative Examples are shown below.

[0558]

[0559] The phenol compounds used in Examples and Comparative Examples are shown below.

[0560] In addition, the following phenolic compounds A-1 to A-13 are phenolic compounds represented by the general formula (1).

[0561] In addition, in the following phenolic compounds, Mn represents the number average molecular weight of the phenolic compound. The phenolic compound described ...

Synthetic example A-1

[0567] Phenol compound A-1 was obtained by the following method.

[0568] In the flask, 30 g of phloroglucinol as a monomer and 100 g of water as a solvent were mixed and stirred. In the above-mentioned flask, 0.6 g of oxalic acid and 14.5 g of 37% by mass formalin were further added as a catalyst, and stirred at 105° C. for 4 hours. After cooling the contents of the above-mentioned flask to room temperature, the slurry obtained in the flask was filtered to obtain a crude product (filtrate) of a phenol compound. The obtained crude product was dissolved in 200 g of acetone, and the insoluble matter was removed by filtration with celite. Acetone was distilled off from the filtrate under reduced pressure, water was added to obtain a slurry again, and the slurry was filtered to obtain phenol compound A-1 (filter).

Synthetic example A-2

[0570] Phenolic compound A-2 was obtained by the method similar to synthesis example A-1 except having made the addition amount of 37 mass % formalin into 12.9 g.

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Abstract

Provided is a composition for forming a heat conducting material, said composition being capable of providing a heat conducting material having excellent heat conduction properties. Also provided is a heat conducting material. The composition comprises a phenol compound represented by general formula (1), an epoxy compound and an inorganic matter.

Description

technical field [0001] The invention relates to a composition and a heat conducting material. Background technique [0002] In recent years, the miniaturization of power semiconductor devices used in various electrical equipment such as personal computers, general household appliances, and automobiles has progressed rapidly. Heat generated from power semiconductor devices that have been densified with miniaturization has become difficult to control. [0003] In order to cope with such a problem, a thermally conductive material that promotes heat dissipation from the power semiconductor device is used. [0004] For example, Patent Document 1 discloses a multilayer resin sheet having a resin layer containing an epoxy resin, a curing agent, and an inorganic filler, etc. (claim 1). As the above-mentioned curing agent, for example, a novolak resin containing a compound in which catechol is linked via a methylene chain has been proposed (claim 5). [0005] Previous technical li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/20C08G59/62C08L61/12C08L63/00C08K3/28C08K3/38
CPCC08L61/12C08G8/20C08L63/00C09K5/14C08G59/621C08K2003/385C08G59/245C08G59/32C08K3/38C08K2201/001
Inventor 林大介人见诚一新居辉树高桥庆太
Owner FUJIFILM CORP