Single-component thermosetting packaging adhesive and preparation method thereof

A single-component, packaging adhesive technology, applied in the direction of adhesives, epoxy resin adhesives, non-polymer adhesive additives, etc., can solve the problems affecting the operability of the packaging process, the displacement of pins or terminals, and the increase of colloidal viscosity. Large and other problems, to achieve the effect of excellent insulation and mechanical properties, good fluidity, and reduced thermal expansion and contraction rate

Pending Publication Date: 2021-11-16
苏州艾迪亨斯新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, due to the shortcomings of the current epoxy encapsulant such as large curing shrinkage rate and large expansion yield with temperature changes after curing, the encapsulated pins or terminals are displaced or even broken, causing circuit boards, modules, etc. , poor short circuit or open circuit of the module; on the other hand, in the preparation process of the encapsulant, in order to reduce the curing shrinkage rate of the system and the coefficient of thermal expansion (CTE) after curing, it is usually necessary to add a large amount of inorganic filler with a small expansion coefficient, but when adding When it reaches a certain amount, the viscosity of the colloid will increase sharply, which will affect the operability of the packaging process

Method used

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  • Single-component thermosetting packaging adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] According to the formula in Table 1, pre-disperse 8170C epoxy resin, 8128 epoxy resin, E500 modified epoxy resin, BYK530 defoamer and BYK110 dispersant for 5 minutes until uniform; add carbon black T4 and 1175 spherical filler to disperse evenly, vacuum defoaming ; Add PN23J curing agent and 1021 curing agent to disperse evenly, vacuum defoam to obtain the product, and then store in separate packages at a storage temperature of 5°C. During the whole preparation process, pay attention to controlling the temperature of the material not to exceed 35°C.

[0040] Among them, the weight ratio of 1.0 μm, 5 μm and 40 μm spherical silica is 1:36:63.

[0041] Table 1 embodiment 1 each component addition formula

[0042] component name Parts by mass / Kg 8170C epoxy resin 60 8128 epoxy resin 20 E500 modified epoxy resin 20 BYK530 defoamer 0.2 BYK110 dispersant 0.8 1175 spherical packing 350 T4 carbon black 0.4 PN23J curing a...

Embodiment 2

[0044] On the basis of Example 1, the addition of each component in the formula in Table 1 is replaced by the addition of each component in Table 2.

[0045] Table 2 embodiment 2 each component addition formula

[0046] component name Parts by mass / Kg 8170C epoxy resin 50 8128 epoxy resin 25 E500 modified epoxy resin 25 BYK530 defoamer 0.2 BYK110 dispersant 0.8 1175 spherical packing 200 T4 carbon black 0.4 PN23J curing agent 20 1021 curing agent 5

Embodiment 3

[0048] On the basis of Example 1, the addition amount of each component in the formula in Table 1 is replaced by the addition amount of each component in Table 3.

[0049] Table 3 embodiment 3 each component addition formula

[0050] component name Parts by mass / Kg 8170C epoxy resin 50 8128 epoxy resin 30 E500 modified epoxy resin 20 BYK530 defoamer 0.2 BYK110 dispersant 0.8 1175 spherical packing 250 T4 carbon black 0.4 PN23J curing agent 20 1021 curing agent 7

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Abstract

The invention relates to the technical field of high polymer materials, in particular to a single-component thermosetting packaging adhesive and a preparation method thereof. The single-component thermosetting packaging adhesive is prepared from the following components in parts by weight: 100 parts of epoxy resin, 15 to 30 parts of a curing agent, 0.1 to 0.3 part of a defoaming agent, 0.2 to 1.5 parts of a dispersing agent, 0.1 to 0.5 part of pigment and 150 to 350 parts of a filler. The single-component thermosetting packaging adhesive disclosed by the invention can be cured at a low temperature and is high in curing speed, the expansion and shrinkage rate of a cured system is greatly reduced by adopting the proportion of spherical fillers with different diameters, the purposes of reducing the viscosity of the system and realizing maximum filling are achieved, and the single-component thermosetting packaging adhesive has excellent insulating property, mechanical property, heat resistance and flowability and small water absorption rate. The preparation method of the single-component thermosetting packaging adhesive is simple in process, low in production cost, friendly to environment and wide in application prospect.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a single-component thermosetting encapsulant and a preparation method thereof. Background technique [0002] Epoxy encapsulation glue can be used for bonding and sealing of electronic components and metal materials. At present, most of the two-component encapsulation glues are used in the market, and the two-component glue needs to be weighed and mixed before use. There may also be a mixing ratio during the mixing process. , Mixing uniformity deviation, a lot of bubbles after mixing, etc. It is not easy to operate, not suitable for mechanized production, which reduces production efficiency and production capacity. In addition, in actual mass production, there are still situations where the prepared products are not used in time and are wasted. Increase production cost. The one-component packaging glue does not need to be mixed when used, the operation is simple, and th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/02C09J163/00C09J11/04
CPCC09J163/00C09J11/04C08K2201/014C08K2201/005C08K7/18
Inventor 周建忠王昌勇
Owner 苏州艾迪亨斯新材料科技有限公司
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