Single-component thermosetting packaging adhesive and preparation method thereof

Abstract

The invention relates to the technical field of high polymer materials, in particular to a single-component thermosetting packaging adhesive and a preparation method thereof. The single-component thermosetting packaging adhesive is prepared from the following components in parts by weight: 100 parts of epoxy resin, 15 to 30 parts of a curing agent, 0.1 to 0.3 part of a defoaming agent, 0.2 to 1.5 parts of a dispersing agent, 0.1 to 0.5 part of pigment and 150 to 350 parts of a filler. The single-component thermosetting packaging adhesive disclosed by the invention can be cured at a low temperature and is high in curing speed, the expansion and shrinkage rate of a cured system is greatly reduced by adopting the proportion of spherical fillers with different diameters, the purposes of reducing the viscosity of the system and realizing maximum filling are achieved, and the single-component thermosetting packaging adhesive has excellent insulating property, mechanical property, heat resistance and flowability and small water absorption rate. The preparation method of the single-component thermosetting packaging adhesive is simple in process, low in production cost, friendly to environment and wide in application prospect.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a single-component thermosetting encapsulant and a preparation method thereof. Background technique [0002] Epoxy encapsulation glue can be used for bonding and sealing of electronic components and metal materials. At present, most of the two-component encapsulation glues are used in the market, and the two-component glue needs to be weighed and mixed before use. There may also be a mixing ratio during the mixing process. , Mixing uniformity deviation, a lot of bubbles after mixing, etc. It is not easy to operate, not suitable for mechanized production, which reduces production efficiency and production capacity. In addition, in actual mass production, there are still situations where the prepared products are not used in time and are wasted. Increase production cost. The one-component packaging glue does not need to be mixed when used, the operation is simple, and th...

AI Technical Summary

Problems solved by technology

On the one hand, due to the shortcomings of the current epoxy encapsulant such as large curing shrinkage rate and large expansion yield with temperature changes after curing, the encapsulated pins or terminals are displaced or even broken, causing circuit boards, modules, etc. , poor short circuit or open circuit of the module; on the other hand, in the preparation process of the encapsulant, in order to reduce the curing shrinkage rate of the system and the coefficient of thermal expansion (CTE) after curing, it is usually necessary to add a large amount of inorganic filler with a small expansion coefficient, but when adding When it reaches a certain amount, the viscosity of the colloid will increase sharply, which will affect the operability of the packaging process

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