High-frequency low-loss modified polyphenyl ether-based composite material

A composite material and polyphenylene ether technology, applied in the direction of non-polymer adhesive additives, adhesive types, adhesive additives, etc., can solve problems such as uneven distribution of cross-linking points, few practical applications, and affecting application effects , to achieve the effect of simple and easy modification method, improving solvent resistance and increasing density

Inactive Publication Date: 2021-12-03
JIANGSU UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the functional groups are only located at the two ends of the molecular chain. The disadvantage is that, on the one hand, the number of functional groups that can be introduced is very limited, which makes the crosslinking and curing insufficient; end, making the distribution of cross-linking points uneven
These deficiencies of the existing modified polyphenylene ether resin have seriously affected its application effect in high-end electronic communication products, and it is difficult to meet the current stringent performance requirements
In addition, the existing technology of chemically modifying polyphenylene ether molecules to prepare thermosetting polyphenylene ether resins needs to start from the source of polyphenylene ether resin synthesis. The technology for large-scale production is very difficult. At present, large-scale commercial There are very few varieties of chemically modified thermosetting polyphenylene ether resins produced, resulting in high prices for such resins and few practical applications

Method used

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  • High-frequency low-loss modified polyphenyl ether-based composite material
  • High-frequency low-loss modified polyphenyl ether-based composite material
  • High-frequency low-loss modified polyphenyl ether-based composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] 1) Preparation of acryloyl-modified cyclodextrin monomer: Add 200ml dimethylformamide to 22.6g β-cyclodextrin, stir it with magnetic force to dissolve it completely, then add 30ml triethylamine dropwise and place in ice at 0°C Stir magnetically in a water bath for 5 minutes. Under the condition of nitrogen protection, slowly add 6ml of acryloyl chloride dropwise to the solution with a constant pressure dropping funnel, and react for 40 minutes at room temperature after the addition is completed. A solid was precipitated, and the filtrate was precipitated with acetone and then suction-filtered again. The obtained white solid was washed with acetone and suction-filtered. The final product was dried in a vacuum oven to constant weight. The average acryloyl functionality of the obtained modified cyclodextrin molecule was 3.

[0040] 2) Preparation of polyphenylene ether / acryloyl-modified cyclodextrin complex: step 1) 14g of acryloyl-modified cyclodextrin obtained, add 80ml o...

Embodiment 2

[0043] 1) Preparation of acryloyl-modified cyclodextrin monomer: Add 200ml dimethylformamide to 26g γ-cyclodextrin, stir it with magnetic force to dissolve it completely, then add 30ml triethylamine dropwise and place in an ice-water bath at 0°C Stir with medium magnetic force for 5 minutes. Under the condition of nitrogen protection, slowly add 8ml of acryloyl chloride to the solution with a constant pressure dropping funnel. After the addition is completed, react at room temperature for 60 minutes. solid, the filtrate was precipitated with acetone and filtered again, the white solid obtained was washed with acetone and filtered, and the final product was dried in a vacuum oven to constant weight. The obtained modified cyclodextrin molecule had an average acryloyl functionality of 4.

[0044] 2) Preparation of polyphenylene ether / acryloyl-modified cyclodextrin complex: step 1) 15.7g of acryloyl-modified cyclodextrin obtained, add 80ml of deionized water and grind in a colloid ...

Embodiment 3

[0047] 1) Preparation of acryloyl-modified cyclodextrin monomer: Add 250ml dimethylformamide to 26g γ-cyclodextrin, stir it with magnetic force to completely dissolve it, then add 30ml triethylamine dropwise and place in an ice-water bath at 0°C Stir under medium magnetic force for 10 minutes, and under the condition of nitrogen protection, slowly add 10ml of acryloyl chloride to the solution with a constant pressure dropping funnel, and react at room temperature for 60 minutes after the addition is completed. solid, the filtrate was precipitated with acetone and then suction filtered again, the obtained white solid was washed with acetone and suction filtered, and the final product was dried in a vacuum oven to constant weight, and the average acryloyl functionality of the obtained modified cyclodextrin molecule was 5.

[0048] 2) Preparation of polyphenylene ether / acryloyl-modified cyclodextrin complex: step 1) 16g of acryloyl-modified cyclodextrin obtained, add 100ml of deio...

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Abstract

The invention discloses a high-frequency low-loss modified polyphenyl ether-based composite material, one or more acryloyl modified cyclodextrin monomers are complexed on a polyphenyl ether molecule main chain, and the complexing ratio of a 2, 6-dimethyl-1, 4-phenylene ether repetitive structure unit to the acryloyl modified cyclodextrin monomers is (2-30): 1; after a cross-linking reaction at a proper temperature, the material has the following typical performance indexes: the dielectric constant (10GHz) is less than or equal to 3.2; the dielectric loss (10GHz) is less than or equal to 0.0045; the glass transition temperature is greater than or equal to 200 DEG C; the solvent resistance (toluene, 72 hours) is that the material is not dissolved or swelled.

Description

technical field [0001] The invention belongs to the field of high-performance electronic materials, and in particular relates to a high-frequency and low-loss modified polyphenylene ether-based composite material and its prepreg, potting material, adhesive and prepreg. Background technique [0002] In recent years, with the continuous development of communication and information technology, especially the further popularization and application of 5G, communication signals continue to develop towards high frequency and high speed, which is related to the application of antennas, power amplifiers, servers and other communication network hardware equipment and facilities. Electronic materials, such as circuit board substrates, potting materials and adhesives, have higher performance requirements, especially for the dielectric properties of materials, which require lower dielectric constant and dielectric loss. [0003] Polyphenylene ether is one of the varieties with the most e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F279/02C08F283/08C08F251/00C08F222/40C08F212/36C08F226/06C08F2/44C08K3/36C08K3/22C08B37/16C09J105/16C09J181/02C09J109/06C09J11/04C09J11/00
CPCC08F279/02C08F283/08C08F251/00C08B37/0012C08F2/44C08K3/36C08K3/22C09J105/16C09J181/02C09J11/04C09J11/00C08K2003/2227C08L2201/08C08L2205/03C08F222/40C08L81/02C08L9/06C08L5/16C08F212/36C08F226/06
Inventor 胡杰周学军牛军强
Owner JIANGSU UNIV
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