Method for manufacturing through hole between wiring boards

A manufacturing method and wiring board technology, applied in printed circuit manufacturing, electrical connection formation of printed components, electrical components, etc., can solve problems such as difficult removal of polyimide, improve electroplating adhesion, reduce production costs, equipment less demanding effect

Pending Publication Date: 2021-12-03
大同共聚西安科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, even if the residual polyimide is chemically dissolved and removed, it is difficult to remove the polyimide that has penetrated into the rough surface

Method used

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  • Method for manufacturing through hole between wiring boards
  • Method for manufacturing through hole between wiring boards
  • Method for manufacturing through hole between wiring boards

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] (1) Paste 20 μm copper foil on 80 μm polyimide film to obtain copper foil / polyimide two-layer film (obtained plane diagram is attached figure 1 shown), and then place the copper foil / polyimide two-layer film on top of the circuit board (the planing diagram of the circuit board is shown in the attached figure 2 shown), put it into a hot press, raise the temperature from room temperature to 240 °C at a rate of 5 °C / min, and keep it at this temperature for 1 h under a pressure of 0.5 MPa, and then cool it to room temperature in a water cooling system, where the circuit The thickness of the circuit in the substrate is 20 μm, and the thickness of the substrate is 20 μm. The planing diagram of the obtained laminate is shown in the attached image 3 shown;

[0021] (2) use 2wt% ferric chloride aqueous solution at room temperature and 2Kgf / cm 2 The copper foil on the product obtained in step (1) is etched for 1 min under the spray pressure to form an opening on the copper fo...

Embodiment 2

[0026] (1) Paste 20μm copper foil on 80μm polyimide film to obtain copper foil / polyimide two-layer film, then place copper foil / polyimide two-layer film on top of the circuit board and put it into a hot press In the process, the temperature is raised from room temperature to 240°C at a rate of 5°C / min, and kept at this temperature for 1h under a pressure of 0.5MPa, and then cooled to room temperature in a water cooling system, wherein the thickness of the circuit in the circuit substrate is 20μm, and the substrate Thickness 20μm;

[0027] (2) use 2wt% ferric chloride aqueous solution at room temperature and 2Kgf / cm 2 The copper foil on the product obtained in step (1) is etched for 2min under a spray pressure of 100%, forming an opening on the copper foil, wherein the diameter of the opening is 40 μm;

[0028] (3) consistent with the process of step (3) in embodiment 1;

[0029] (4) consistent with the process of step (4) in embodiment 1;

[0030] (5) consistent with the pr...

Embodiment 3

[0032](1) Paste 20μm copper foil on 40μm polyimide film to obtain copper foil / polyimide two-layer film, then place copper foil / polyimide two-layer film on top of the circuit board and put it into a hot press In the process, the temperature is raised from room temperature to 240°C at a rate of 5°C / min, and kept at this temperature for 1h under a pressure of 0.5MPa, and then cooled to room temperature in a water cooling system, wherein the thickness of the circuit in the circuit substrate is 20μm, and the substrate Thickness 20μm;

[0033] (2) consistent with the process of step (2) in embodiment 1;

[0034] (3) Using the above etched copper foil pattern as a mask, process the polyimide film with a carbon dioxide laser beam to form blind holes, wherein the carbon dioxide laser beam is a pulsed laser, the laser pulse width is 5 μs, and the output energy is 20W , the laser energy per pulse is 48.8mJ, and the energy density is 95J / cm 2 After each irradiating 5 pulses, blow 20L / mi...

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Abstract

The invention relates to a method for manufacturing a through hole between wiring boards. The method comprises the following steps of: pasting a copper foil on a polyimide film to obtain a copper foil / polyimide two-layer film, placing the copper foil / polyimide two-layer film above a circuit substrate, carrying out hot pressing under a hot press to form a laminated board, etching required holes in the surface of the copper foil by using a ferric chloride aqueous solution under the action of a mask, and taking the copper foil with the holes in the uppermost layer as the mask to form the laminated board, processing a polyimide film layer by using a carbon dioxide laser beam to form a blind hole, then etching polyimide residues on the hole wall and the hole bottom of the blind hole by using a commercial soft etching solution under the action of ultrasonic waves, and finally, chemically plating a layer to obtain a required through hole. According to the manufacturing method, after the blind hole is formed through laser processing, soft etching is carried out under ultrasonic irradiation, so that resin left on the bottom surface of the hole can be completely removed, an insulating resin layer cannot be damaged, the electroplating adhesive force of the bottom surface of the copper foil can be improved, and the highly reliable through hole is formed.

Description

technical field [0001] The invention relates to a method for manufacturing a through hole between wiring boards, belonging to the field of integrated circuit and chip processing and manufacturing. Background technique [0002] As a printed wiring board, there is a rigid wiring board in which an insulating material obtained by impregnating reinforcing fibers such as glass fibers or aramid fibers with thermosetting resins such as epoxy resins or polyimide resins is used , and a conductor layer such as copper foil is formed on the surface of the insulating material. Multilayer wiring boards include laminated wiring boards in which printed wiring boards are alternately laminated with conductive layers and insulating layers, or composite wiring boards in which insulating layers and conductive layers are alternately laminated and cured. In these wiring boards, in order to form a via hole for electrically connecting the outer layer copper foil and the inner layer copper foil, a me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/0017H05K3/0035H05K3/42
Inventor 周雨薇
Owner 大同共聚西安科技有限公司
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