Heat-conducting adhesive and heat-conducting double-sided tape

A double-sided adhesive tape and adhesive technology, applied in the direction of adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problems of inability to achieve better heat conduction effect, complex structure, etc., to achieve improved adhesion and not easy to fall off , the effect of stable filling

Pending Publication Date: 2021-12-17
苏州翎慧材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the development of current electronic products in the direction of small size and multi-function, in some key components with complex structures (such

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0030] Example 1

[0031] The preparation of the thermally conductive adhesive includes the following components: side chain carboxy-functional modified styrene-butadiene-styrene block copolymer, 10 rosin resins, 100 xylene, and 100 parts of xylene. 3 parts of the high-conductive nano powder; the highly conductive nano powder includes 60% of the active nano-alumina powder, 35% nano-titanium dioxide, and 5% hydroxylated nanometer. The highly conductive nano powder is capable of crosslinking the side chain of rubber copolymers to form a multi-porous cross-shaped structure capable of conducting a vertical direction thermally conductive heat.

[0032] The thickness of the non-substrate thermally conductive double-sided tape made of the thermally conductive adhesive of this Example 1 was 10 μm; after testing, the thermally conductive coefficient of the thermally conductive double-sided tape in the vertical direction was 25.5 W / mK.

Example Embodiment

[0033] Example 2

[0034] The preparation of the thermally conductive adhesive includes the following components: side chain carboxy-functional modified styrene-butadiene-styrene block copolymer, 12 rosin resin, 105 xylene, 3 parts of the high-conductive nano powder; the highly conductive nano powder includes 60% of the active nano-alumina powder, 35% nano-titanium dioxide, and 5% hydroxylated nanometer. The highly conductive nano powder is capable of crosslinking the side chain of rubber copolymers to form a multi-porous cross-shaped structure capable of conducting a vertical direction thermally conductive heat.

[0035]The thickness of the non-substrate thermally conductive double-sided tape made of the thermally conductive adhesive of this Example 2 was 11 μm; after testing, the thermally conductive coefficient of the thermally conductive double-sided tape in the vertical direction was 28.5 W / mK.

Example Embodiment

[0036] Example 3

[0037] The preparation of the thermally conductive adhesive includes the following components: side chain carboxy-functional modified styrene-butadiene-styrene block copolymer, 15 rosin resin, 110 parts of xylene 5 parts of the high-conductive nano powder; the highly conductive nano powder includes 60% of the active nano-alumina powder, 35% nano-titanium dioxide, and 5% hydroxylated nanocarbon. The highly conductive nano powder is capable of crosslinking the side chain of rubber copolymers to form a multi-porous cross-shaped structure capable of conducting a vertical direction thermally conductive heat.

[0038] The thickness of the non-substrate thermally conductive double-sided tape made of the thermally conductive adhesive of this Example 3 was 12 μm; after testing, the thermally conductive coefficient of the thermally conductive double-sided tape in the vertical direction was 30 W / mK.

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Abstract

The invention discloses a heat-conducting adhesive, which is prepared from the following components in parts by mass: 45 to 60 parts of side chain carboxyl functionalized and modified rubber copolymer, 10 to 15 parts of tackifier, 100 to 120 parts of solvent and 3 to 5 parts of high-heat-conductivity nano powder, wherein the high-heat-conductivity nano powder can be cross-linked with a side chain of the rubber copolymer, so that the thermal conductive adhesive forms a porous cross-linked network structure capable of conducting heat in the vertical direction. The invention also discloses a heat-conducting double-sided tape prepared from the heat-conducting adhesive. The heat-conducting adhesive can be matched with a coating and dispensing machine to be smeared on electronic product parts, a formed adhesive film can be completely attached to the electronic product parts, the use reliability is good, and a good heat dissipation function is achieved. The heat-conducting double-sided adhesive tape can realize a better interface bonding effect, has a better heat-conducting effect, and can be repeatedly stripped and repeatedly used.

Description

technical field [0001] The invention relates to the technical field of heat-conducting materials, in particular to a heat-conducting adhesive and a heat-conducting double-sided adhesive tape. Background technique [0002] With the current expansion of the electronic product market, the functions of electronic products have become increasingly complex, and the design sizes of various key components, ICs, and chips have also been rapidly reduced and complicated, bringing high-speed computing at the same time , which also makes heat dissipation a major problem. Taking the mobile phone CPU as an example, the operating temperature of conventional mobile phone CPU chips on the market can reach above 70°C, some capacitors can reach above 60°C, and the operating temperature of mobile phone LCD screens can also reach the range of 50-70°C. The wireless charging module is also very easy to cause energy to be converted into additional heat energy during the transmission current, making...

Claims

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Application Information

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IPC IPC(8): C09J153/02C09J11/04C09J11/08C09J7/30C09J7/10
CPCC09J153/025C09J11/04C09J11/08C09J7/30C09J7/10C08K2003/2241C09J2453/00C08L93/04C08K3/22C08K3/042
Inventor 顾斌胡桑苒杨钧
Owner 苏州翎慧材料科技有限公司
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