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Pressure control system and method

A technology of pressure control and control method, which is applied in the direction of fluid pressure control, control/regulation system, electric fluid pressure control, etc. It can solve the problems that affect the production rate of the machine, prone to abnormalities, and gas fluctuations, etc., to achieve The effect of improving equipment utilization rate, increasing machine productivity, and reducing the probability of gas flow rate fluctuations

Pending Publication Date: 2021-12-17
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the loading chamber is prone to abnormalities during the inflation process, causing the machine to stop running, and there is a gas fluctuation problem during the inflation process, which affects the production capacity and utilization rate of the machine

Method used

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Embodiment Construction

[0033] Research has found that the main reason for the above problems lies in the structure of the inflatable device used in the prior art for the loading chamber.

[0034] Concretely, when the loading chamber of the existing machine is inflated, the inflated gas is generally nitrogen (N 2 ), the inflation control process is as follows figure 1shown. When the loading chamber is inflated, first open the slow filling valve to inflate, when the loading chamber reaches a certain pressure, close the slow filling valve, then open the fast filling valve to inflate, when the loading chamber reaches close to atmospheric pressure, close the fast filling valve, Then open the slow filling valve and charge for a certain period of time, then close the slow filling valve, so that the detection pressure of the loading chamber reaches a level slightly higher than the standard atmospheric pressure, and finally open the balance valve to exhaust the chamber outward, so that the pressure of the l...

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Abstract

The invention discloses a pressure control system and method. The pressure control system comprises a loading chamber, a pressure detection device, a gas flow assembly, a flow control device and a controller, wherein the detection end of the pressure detection device is arranged in the loading cavity so as to detect the air pressure in the loading cavity and obtain the detected air pressure; the gas flow assembly comprises a connecting pipeline for communicating a gas source with the loading chamber; the flow control device is arranged on the connecting pipeline and is used for controlling and monitoring the flow rate of the target gas flowing into the loading chamber; and the controller is connected to the flow control device and the pressure detection device so as to output a first control instruction to the flow control device according to the detected air pressure and the target air pressure when the difference value between the target air pressure and the detected air pressure is greater than a preset air pressure value, and the air pressure in the loading chamber is adjusted to the target air pressure. According to the invention, the loading chamber can rapidly and stably reach the target air pressure during air inflation, the influence of power conditions and operating environments on equipment is reduced, the alarm frequency of the loading chamber during air inflation is reduced, and the productivity and the utilization rate of the equipment are improved.

Description

technical field [0001] The present application relates to the field of pressure control systems, in particular to a pressure control system and a control method for the pressure control system. Background technique [0002] In the semiconductor manufacturing process, when the wafer is transported on the etching equipment, it will pass through the loading chamber (Loadlock). The loading chamber has a vacuum state and an atmospheric state, and the state of the loading chamber is adjusted according to the requirements of wafer transmission. . The working process of the loading chamber is basically: in the atmospheric state, open the atmospheric side door valve, the atmospheric manipulator takes out or puts the wafer, close the atmospheric side door valve, pump the loading chamber from the atmosphere to a vacuum state, open the vacuum side door valve, and the vacuum manipulator Take out or put in the wafer, close the vacuum side door valve, and fill the loading chamber from vac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D16/20H01L21/677
CPCG05D16/2013H01L21/67739
Inventor 祁乐
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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