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Crimping type power semiconductor structure and internal pressure online measurement method thereof

A power semiconductor, crimping type technology, applied in the direction of measuring devices, instruments, etc., can solve the problem that the pressure change cannot be measured online, and achieve the effect of convenient multi-point measurement, light weight, and improved measurement sensitivity

Pending Publication Date: 2021-12-24
CHONGQING UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, there are many difficulties in online measurement of the internal pressure of crimped power devices, and the existing pressure measurement methods of crimped power devices have limitations:
However, the pressure test paper can only measure the static pressure offline, and cannot measure the pressure change online

Method used

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  • Crimping type power semiconductor structure and internal pressure online measurement method thereof
  • Crimping type power semiconductor structure and internal pressure online measurement method thereof
  • Crimping type power semiconductor structure and internal pressure online measurement method thereof

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Embodiment Construction

[0041] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the diagrams provided in the following embodiments are only schematically illustrating the basic concept of the present invention, and the following embodiments and the features in the embodiments can be combined with each other in the case of no conflict.

[0042] Wherein, the accompanying drawings are for illustrative purposes only, and represent only schematic diagrams, rather than physical drawings, and should not be c...

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Abstract

The invention relates to a crimping type power semiconductor structure and an internal pressure online measurement method thereof, and belongs to the field of power semiconductor devices. The structure comprises a shell and a plurality of parallel subunits; and each subunit comprises a top plate, a flexible assembly, a silver sheet, a molybdenum sheet, a chip and a substrate, wherein the flexible assembly comprises a disc spring group and a conductive copper sheet, and a thin copper sheet is arranged in the middle of the conductive copper sheet, a groove is formed in the side surface of the thin copper sheet, an optical fiber strain gauge and an optical fiber thermometer are installed in the groove, and the optical fiber thermometer is used for temperature compensation of the optical fiber strain gauge. According to the crimping type power semiconductor structure and the internal pressure online measurement method thereof of the invention, real-time measurement of the internal pressure of the crimping type power semiconductor module is realized, and the measurement sensitivity is high.

Description

technical field [0001] The invention belongs to the field of power semiconductor devices, and relates to a crimping type power semiconductor structure and an online measurement method for its internal pressure. Background technique [0002] The internal materials of crimp-type power semiconductor devices are connected by contacts, and proper contact pressure is crucial for their safe and reliable operation. For crimp-type power devices in multi-chip packages, due to dimensional tolerances and structural thermal deformation, there are usually differences in the mechanical pressure between parallel chips. This not only leads to uneven mechanical stress distribution between chips, but also further affects chip current sharing and temperature distribution between chips, and accelerates device failure. By monitoring the internal pressure distribution of crimp-type power devices online, the health of the devices can be evaluated. [0003] However, there are many difficulties in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D21/02
CPCG01D21/02
Inventor 任海冉立刘立蒋华平
Owner CHONGQING UNIV
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