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FFKM sealing ring for wafer processing process cavity application system and preparation method of FFKM sealing ring

A technology of application system and sealing ring, which is applied in applications, household appliances, household components, etc., can solve problems such as endangering product quality, contamination of wafers and molded chips, etc., and achieve high physical and mechanical properties, excellent cleanliness, and excellent pressure change performance effect

Pending Publication Date: 2021-12-31
宁波德固赛密封科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If ordinary fluorine-containing rubber is used as the sealing ring for the cavity application system of the wafer processing process, it is difficult to meet the above-mentioned harsh general environmental requirements, which will easily cause contamination of the wafer and molded chips, and endanger product quality.

Method used

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  • FFKM sealing ring for wafer processing process cavity application system and preparation method of FFKM sealing ring
  • FFKM sealing ring for wafer processing process cavity application system and preparation method of FFKM sealing ring
  • FFKM sealing ring for wafer processing process cavity application system and preparation method of FFKM sealing ring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A new type of FFKM sealing ring for wafer processing chamber application system, made of the following parts by weight:

[0033] 100 parts of FFKM raw gum, 0.7 parts of TR131.

[0034] Preparation:

[0035] Prepare FFKM raw rubber and auxiliary materials in proportion, transport them to the open mill, and use three packs and two rolls for thin-pass mixing. After cooling down, the FFKM compound rubber for the gas supply sealing ring at the equipment end of the wafer processing process is obtained. The mixing temperature is 55°C, keep the rollers passing water to cool down, and the speed ratio of the two rollers is 1:1.27.

[0036] Put the mixed rubber into a single-screw extruder to preform a rubber rope, and the temperature of the head of the extruder is 65°C. The working pressure of the extruder is 5Mpa.

[0037] Put the sealing ring mold in the vulcanizing machine to preheat. The cut rubber rope is put into the mold, the end is overlapped, and a section of vulcani...

Embodiment 2

[0044] A new type of FFKM sealing ring for wafer processing chamber application system, made of the following parts by weight:

[0045] 100 parts of FFKM raw gum, 1 part of TR131.

[0046] Preparation:

[0047] Prepare FFKM raw rubber and auxiliary materials in proportion, transport them to the open mill, and use three packs and two rolls for thin-pass mixing. After cooling down, the FFKM compound rubber for the gas supply sealing ring at the equipment end of the wafer processing process is obtained. The mixing temperature is 55°C, keep the rollers passing water to cool down, and the speed ratio of the two rollers is 1:1.27.

[0048] Put the mixed rubber into a single-screw extruder to preform a rubber rope, and the temperature of the head of the extruder is 65°C. The working pressure of the extruder is 5Mpa.

[0049] Put the sealing ring mold in the vulcanizing machine to preheat. The cut rubber rope is put into the mold, the end is overlapped, and a section of vulcanizat...

Embodiment 3

[0054] The difference from Example 1 is that 100 parts of FFKM raw gum and 0.5 parts of TR131.

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Abstract

The invention discloses an FFKM sealing ring for a wafer processing process cavity application system and a preparation method of the FFKM sealing ring, and belongs to the field of semiconductor chip manufacturing. The FFKM sealing ring is prepared from the following raw materials in parts by weight: 100 parts of FFKM raw rubber and 0.5 to 1.5 parts of TR131. The FFKM sealing ring disclosed by the invention has the advantages of higher physical and mechanical properties, excellent pressure change performance, superstrong medium resistance, excellent cleanliness, good plasma resistance, easiness in mixing and vulcanization molding of the FFKM rubber material, long scorching time, easiness in production operation and the like, and is widely applied to sealing of a wafer processing process cavity application system.

Description

technical field [0001] The invention belongs to the technical field of semiconductor chip manufacturing, and in particular relates to an FFKM sealing ring for a cavity application system in a wafer processing process and a preparation method thereof. Background technique [0002] In the field of semiconductor chip manufacturing, wafer processing is usually exposed to extreme plasma radiation, heat and chemical media (O 2 、CF 4 、NF 3 , SF 6 ) environment. Wafer processing requires high environmental cleanliness. For semiconductor manufacturers, isolating gas, extractables, and particle contamination generated during the sealing process is an important task. If ordinary fluorine-containing rubber is used as the sealing ring for the cavity application system of the wafer processing process, it is difficult to meet the above-mentioned harsh general environmental requirements, which will easily cause contamination of the wafer and molded chips, and endanger product quality. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/18C08L23/06B29C35/02B29B7/72B29L31/26
CPCC08L27/18B29C35/02B29B7/726C08L2207/062B29L2031/265C08L23/06
Inventor 张世鑫
Owner 宁波德固赛密封科技有限公司