Silicon micro-resonance pressure sensor based on electrostatic excitation piezoresistive detection

A pressure sensor and piezoresistive detection technology, applied in the field of micro-nano sensors, can solve the problems of late start of silicon micro-resonant pressure sensor research, inability to meet applications, poor linearity, etc., and achieve good system vibration stability and anti-interference ability. The effect of strengthening and improving the quality factor

Active Publication Date: 2021-12-31
XI AN JIAOTONG UNIV
View PDF3 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Research on silicon microresonant pressure sensors in China started relatively late. At present, silicon microresonant sensors developed by various scientific research institutions and universities have a small range, generally around 300KPa, and widely exist in the large-range research of silicon microresonant pressure sensors. The shortcomings of poor linearity and low sensitivity cannot meet the application in high-pressure fields such as deep sea and chemical industry.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Silicon micro-resonance pressure sensor based on electrostatic excitation piezoresistive detection
  • Silicon micro-resonance pressure sensor based on electrostatic excitation piezoresistive detection
  • Silicon micro-resonance pressure sensor based on electrostatic excitation piezoresistive detection

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] In order to make the purpose and technical solution of the present invention clearer and easier to understand, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The specific embodiments described here are only used to explain the present invention, not to limit the present invention. invention.

[0027] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inner" and "outer" are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and Simplified descriptions, rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and ope...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Sensitivityaaaaaaaaaa
Login to view more

Abstract

The invention discloses a silicon micro-resonance pressure sensor based on electrostatic excitation piezoresistive detection. The sensor adopts a secondary sensitive structure compounded by a pressure sensitive film and a resonator, and the resonator is in-plane parallel reverse vibration. The resonator is connected with the pressure sensitive film through an anchor point, when external pressure acts on the pressure sensitive film and enables the pressure sensitive film to deform, the deformation is transmitted to the resonator through a silicon island on the pressure sensitive film and the anchor point, the internal stress of a resonant beam on the resonator is changed, and therefore the natural resonant frequency of the resonator is changed. A piezoresistor is arranged on the vibration pickup beam and used for completing pickup of resonant frequency, and then piezoresistive signal output is achieved through a first snakelike beam connected with the coupling beam.

Description

technical field [0001] The invention belongs to the technical field of micro-nano sensors, and in particular relates to a silicon micro-resonance pressure sensor chip based on electrostatic excitation piezoresistive detection. Background technique [0002] Silicon microresonant pressure sensor does not need analog-to-digital conversion because of its quasi-digital output, and its accuracy is mainly affected by the mechanical characteristics of the mechanical structure. Therefore, it has strong anti-interference ability and stable performance. It is currently the most accurate pressure sensor. It is also the focus of scientific research institutions and universities in various countries. Silicon microresonant pressure sensors are widely used in important fields such as aerospace, biomedicine, deep-sea exploration, meteorological monitoring, military equipment, and industrial process control. [0003] Research on silicon microresonant pressure sensors in China started relativ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01L1/18
CPCG01L1/183
Inventor 方续东高博楠方子艳吴俊侠邓武彬赵立波田边王淞立朱楠孙昊吴晨蒋庄德
Owner XI AN JIAOTONG UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products