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Heat-conducting elastomer composition and heat-conducting molded article

An elastomer and heat conduction technology, applied in the direction of semiconductor devices, semiconductor/solid device components, electric solid devices, etc., can solve the problems of inability to peel off, and achieve excellent reworkability and excellent oil leakage resistance.

Pending Publication Date: 2021-12-31
KITAGAWA INDS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, when thermally conductive molded bodies overlap each other, they may stick to each other and cannot be peeled off.
[0008] In addition, in the conventional heat-conducting molded article, the amount of oil component contained in the heat-conducting molded article seeps out to the outside (the amount of oil leakage) is large, which sometimes becomes a problem.

Method used

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  • Heat-conducting elastomer composition and heat-conducting molded article
  • Heat-conducting elastomer composition and heat-conducting molded article
  • Heat-conducting elastomer composition and heat-conducting molded article

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4 and comparative example 1～8

[0084] (making of composition)

[0085]With respect to 100 mass parts of styrene-based elastomers, process oil 1 or process oil 2, nonionic surfactant 1 or olefin resin, heavy metal deactivator, antioxidant by the ratio (mass part) shown in table 1 , aluminum hydroxide, and artificial graphite, and using LABO PLASTOMILL (twin-screw extruder, product name "4C150-1", manufactured by Toyo Seiki Seisakusho Co., Ltd.), knead their mixture at 100 rpm and 200°C 7 minutes, thereby obtaining each composition of Examples 1-4 and Comparative Examples 1-8.

[0086] In addition, the materials used in each Example and each comparative example are as follows.

[0087] "Styrenic elastomer": SEEPS, trade name "Septon 4055", manufactured by Kuraray Co., Ltd.

[0088] "Processing oil 1": Petroleum-based hydrocarbon (paraffin-based processing oil), weight average molecular weight (Mw) = 533, trade name "Diana Processing Oil PW-90", manufactured by Idemitsu Kosan Co., Ltd.

[0089] "Processing ...

Embodiment 5、6 and comparative example 9～15

[0131] (making of composition)

[0132] Examples 5 and 6 were obtained in the same manner as in Example 4 except that the following nonionic surfactants were blended in the ratios (parts by mass) shown in Table 2 instead of nonionic surfactant 1. and each composition of Comparative Examples 9-15.

[0133] In addition, the materials used in each Example and each comparative example are as follows.

[0134] "Nonionic surfactant 2": polyoxyalkylene alkenyl ether, HLB value = 16.2, solid, brand name "Latemul PD-450", manufactured by Kao Corporation.

[0135] "Nonionic surfactant 3": Glycerin fatty acid ester, HLB value = 2.8, solid, brand name "Rheodol MS-50", manufactured by Kao Corporation.

[0136] "Nonionic surfactant 4": polyoxyethylene alkyl ether, HLB value = 13.6, liquid, brand name "EMULGEN109P", manufactured by Kao Corporation.

[0137] "Nonionic surfactant 5": sorbitan ester, HLB value = 1.8, liquid, brand name "Rheodol SP-O30V", manufactured by Kao Corporation.

[...

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Abstract

This heat-conducting elastomer composition contains: 100 parts by mass of a styrene-based elastomer; 610 to 750 parts by mass of a process oil that is constituted of petroleum-based hydrocarbons and that has a weight-average molecular weight of 600 or less; 25 to 40 parts by mass of a solid nonionic surfactant having an HLB of 2.0 or greater; 260 to 640 parts by mass of an aluminum hydroxide powder; and 250 to 340 parts by mass of an artificial graphite powder.

Description

technical field [0001] The present invention relates to a thermally conductive elastomer composition and a thermally conductive molded body. Background technique [0002] As a member for releasing heat generated from electronic components and the like in electronic equipment to the outside, for example, heat conduction molding that uses a styrene-based elastomer as a matrix polymer and contains a heat conduction filler as disclosed in Patent Document 1 body. Such a thermally conductive molded body is used, for example, to be interposed between an electronic component mounted on a substrate and a radiator such as a heat sink, and transfers heat emitted from the electronic component to the radiator. [0003] prior art literature [0004] patent documents [0005] Patent Document 1: Japanese Patent Laid-Open No. 2018-80235 [0006] (problem to be solved by the invention) [0007] In conventional thermally conductive molded articles, reworkability (rework) may become a prob...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36C08L25/08C08L53/02C08L91/00C09K5/14C08K3/04C08K3/22
CPCC08K3/04C08K3/22C08L25/08C08L53/02C08L91/00C09K5/14H01L23/42H01L23/3737H01L23/373C08L2207/322H01L23/36
Inventor 内田达也
Owner KITAGAWA INDS