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Rapid preparation method of tungsten copper with high thermal conductivity

A high thermal conductivity, tungsten copper technology, applied in the field of workpiece molding, can solve the problems of uneven powder distribution, cumbersome and complicated process, and increased processing costs, and achieve the effect of simple preparation method, uniform material distribution, and high density

Pending Publication Date: 2022-01-04
广东金鑫得新材料有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The infiltration method is widely used in the market. The tungsten copper produced by the infiltration method has a relatively high density and good sintering performance. The disadvantage is that after infiltration, machine processing is required to remove the excess infiltrated metal copper, which increases the processing cost and the yield is not high. , and the powder dispersion is uneven, the density is loose, and the thermal conductivity is poor; there is also a high-temperature sintered tungsten skeleton copper infiltration method, which has high comprehensive performance, cumbersome and complicated process, high production cost, and cannot be popularized; there is also an isostatic pressing process, The tungsten copper produced is of good quality, but the cost is extremely high, and it cannot be popularized

Method used

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  • Rapid preparation method of tungsten copper with high thermal conductivity
  • Rapid preparation method of tungsten copper with high thermal conductivity

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preparation example Construction

[0028] A method for rapid preparation of high thermal conductivity copper tungsten disclosure of the present invention, comprising the steps of:

[0029] (1) taking pure tungsten powder and copper powder filler, the surface of the filler powder after mixing balls filled;

[0030] (2) adjusting the air pressure between 0.3-0.6Kg, mixing under vacuum or an inert gas;

[0031] (3) after completion of mixing powder to oxidation treatment;

[0032] (4) powder into a mold, sintering:

[0033] Preload group: preliminary pressing under 20MPa, packing 10-60s;

[0034] Temperature Increasing: at a rate of 120 ℃ / min heating, plasticizing occurs at the beginning of the heating rate changed to 55 ℃ / min, per-5Mpa pressure increases, to a pressure of 120MPa, heated to 600 deg.] C;

[0035] After plasticized state to complete, at a heating rate of 20-22 ℃ / min, heated to 860-1020 ℃, at a pressure of 120MPa under holding pressure, holding time 10min per 50-15Kg powder holding pressure;

[003...

Embodiment 1

[0075] Steps to prepare tungsten copper:

[0076] (1) Take pure tungsten powder and copper powder filler, the formulation of tungsten copper is WCU 50, and the mixed ball is filled in the surface of the powder after the filler;

[0077] The way the filler is: first fill the copper powder at the bottom, then fill the pure tungsten powder to cover the copper powder, to cover complete, complete the filler;

[0078] Next, put it in the powder above the powder; mixed balls are alloy balls.

[0079] The weight ratio of alloy balls and powders is 3: 1, and the ball ball is φ10;

[0080] (2) Vacuum method, vacuum environment is 10 -2 The adjustment gas pressure is between 0.5kg, the mixing, the mixture time is 12 hours, and the powder is removed after the mixture is completed;

[0081] (4) The powder fills in the mold and sinter:

[0082] Predictive segment: under the pre-pressure 20 MPa, pressure 50s;

[0083] The temperature rise section: When the rate is 10 ° C / min, when plasticizati...

Embodiment 2

[0089] This example differs from Example 1:

[0090] (4) The powder fills in the mold and sinter:

[0091] Predict segment: under the pre-press 20 MPa, press 30s;

[0092] The temperature rise section: When the rate is 10 ° C / min, when plasticization is started, the temperature rise rate becomes 55 ° C / min, and the pressure is increased at a pressure of 5 MPa, and the pressure is 120 MPa, warmed to 600 ° C;

[0093] After the formation of the plasticized state, the temperature rate is 22 ° C / min, warmed to 1020 ° C, pressurized under pressure 120 MPa, and the holding time is 10 min 10 min;

[0094] Pressure segment: at a temperature of 1063 ° C, high temperature sintering in a pressure-free state.

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Abstract

The invention discloses a rapid preparation method of tungsten copper with high thermal conductivity. The tungsten copper with high density and strong electrical and thermal conductivity is prepared in a short time. The method comprises the steps: taking pure tungsten powder and copper powder as fillers, and filling the surface of the filled powder with mixing balls; adjusting the air pressure to 0.3-0.6 Kg in vacuum or inert gas, and mixing the materials; after the materials are mixed, performing deoxidation treatment on the powder; filling a mold with the powder for sintering: in the pre-pressing section, under the pre-pressing pressure of 20 MPa, maintaining the pressure for 10-60 s; in the heating section, increasing the temperature at the speed of 120 DEG C / min, when plasticizing begins, changing the heating rate to 55 DEG C / min, increasing the pressure to 120 MPa according to the pressure of 5 MPa per time, and increasing the temperature to 600 DEG C; after the plasticized state is completed, increasing the temperature to 860-1020 DEG C according to the heating rate of 20-22 DEG C / min, maintaining the pressure under the pressure of 120 MPa with the pressure maintaining time of 10 min for every 50-15 Kg of powder; in the pressure maintaining section, performing high-temperature sintering at the temperature of 1063-1080 DEG C in a non-pressure state; and cooling for 2 hours to finish the preparation of the tungsten copper.

Description

Technical field [0001] The present invention relates to the technical field of the workpiece forming, and more particularly, relates to a rapid method for preparing a particularly high thermal conductivity of tungsten and copper. Background technique [0002] Copper alloy of tungsten and copper tungsten, copper tungsten and the two immiscible metals, a dense pseudoalloy molding extremely difficult, part of the metal matrix composite, may be an important application in aerospace and electronics. [0003] For tungsten and copper is immiscible, so that the performance of the tungsten element can be efficiently reflected, comprising a low expansibility, abrasion resistance, corrosion resistance, high electrical and thermal conductivity, high strength, a certain plasticity. [0004] Solution widely used in the market cementation, tungsten, copper cementation solution density is relatively high yield, good sintering properties, the disadvantage that the required infiltration machined t...

Claims

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Application Information

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IPC IPC(8): C22C1/04B22F1/00B22F3/14
CPCC22C1/045B22F3/14B22F2201/20B22F2201/10
Inventor 吴宣成王健
Owner 广东金鑫得新材料有限公司