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A kind of 3D printing wave structure shape memory composite material and its preparation method

A technology of 3D printing and composite materials, which is applied in the field of 3D printing wave structure shape memory composite materials and its preparation, can solve the problems of composite materials with special structures, complex process and high cost, etc., and achieve low-frequency magnetic field shielding performance improvement and material The molding process is simple and the finished product quality is high

Active Publication Date: 2022-06-07
JIANGNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing methods for preparing functional composite materials are relatively complicated, costly, and slow to prepare, and cannot meet the needs of fast and efficient preparation of composite materials with special functions and special structures

Method used

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  • A kind of 3D printing wave structure shape memory composite material and its preparation method
  • A kind of 3D printing wave structure shape memory composite material and its preparation method
  • A kind of 3D printing wave structure shape memory composite material and its preparation method

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Effect test

Embodiment 1

[0028] A preparation method of the 3D printing wave structure shape memory composite material, the preparation method comprises the following steps:

[0029] (1) 50 parts of polylactic acid (PLA), 50 parts of thermoplastic polyurethane (TPU), 5 parts of multi-walled carbon nanotubes (MWCNT), 3 parts of iron-nickel alloy powder (Fe / Ni 50 / 50), 3 parts of nanoscale V-Fe 3 O 4 After weighing with 2 parts of nano-scale conductive copper powder according to the proportion, they were respectively placed in an oven for pre-baking at 65 ℃ for 10 hours;

[0030] (2) The pre-baked raw materials were mechanically mixed for 2 hours at a speed of 800 r / min, added to the feed port of the single-screw extruder, preheated for 0.5 hours at startup, and the preheating temperature of the single-screw extruder was adjusted to 210 ℃, the extrusion head temperature is 180℃ and the extrusion speed is 100r / min, the raw materials are melted and blended and extruded to prepare 3D printing wires with u...

Embodiment 2

[0038] A preparation method of the 3D printing wave structure shape memory composite material, the preparation method comprises the following steps:

[0039] (1) 50 parts of polylactic acid (PLA), 50 parts of thermoplastic polyurethane (TPU), 6 parts of multi-walled carbon nanotubes (MWCNT), 3 parts of iron-nickel alloy powder (Fe / Ni 50 / 50), 3 parts of nanoscale Zr-Fe 3 O 4 After weighing with 2 parts of nano-scale conductive copper powder according to the proportion, they were respectively placed in an oven for pre-baking at 65°C for 9 hours;

[0040] (2) The pre-baked raw materials were mechanically mixed for 1.5 hours at a rotational speed of 780 r / min, added to the feed port of the single-screw extruder, and preheated for 0.5 hours at the start of the machine, and the preheating temperature of the single-screw extruder was adjusted to be 205°C, extrusion head temperature of 175°C and extrusion speed of 90r / min, melt and blend the raw materials and extrude them to prepare...

Embodiment 3

[0045] A preparation method of the 3D printing wave structure shape memory composite material, the preparation method comprises the following steps:

[0046] (1) 50 parts of polylactic acid (PLA), 50 parts of thermoplastic polyurethane (TPU), 8 parts of multi-walled carbon nanotubes (MWCNT), 3 parts of iron-nickel alloy powder (Fe / Ni 50 / 50), 3 parts of nanoscale Co-Fe 3 O 4 After weighing with 2 parts of nano-silver powder according to the proportion, they were respectively placed in an oven for pre-baking at 65°C for 8h;

[0047] (2) The pre-baked raw materials are mechanically mixed for 1.5 hours at a rotational speed of 700 r / min, added to the feed port of the single-screw extruder, and preheated for 0.5 hours at the start of the machine. Adjust the preheating temperature of the single-screw extruder to be 215°C, the extrusion head temperature is 185°C, and the extrusion speed is 80r / min, the raw materials are melt-blended and extruded to prepare 3D printing wires with a ...

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Abstract

The invention discloses a 3D printing wave structure shape memory composite material and a preparation method thereof. The preparation method comprises the following steps: (1) 50-70 parts of polylactic acid, 30-50 parts of thermoplastic polyurethane, 5-8 parts of poly Wall carbon nanotubes, 3 parts of iron-nickel alloy powder, 3 parts of nanoscale supermagnetic particles doped with transition elements and 2 parts of nanoscale conductive copper powder / silver powder are prebaked; (2) the raw materials after prebaking are mechanically mixing to prepare a 3D printing wire; (3) designing a 3D printing path with a wave structure, and printing to obtain the shape memory composite material. The composite material of the invention has excellent mechanical properties, shape memory properties and low-frequency magnetic field electromagnetic shielding performance, and the electromagnetic shielding performance of the low-frequency magnetic field changes with the shape of the overall structure, resulting in dynamic magnetic field shielding performance.

Description

technical field [0001] The invention relates to the technical field of composite materials prepared by 3D printing, in particular to a 3D printing wave structure shape memory composite material and a preparation method thereof. Background technique [0002] In recent years, the electromagnetic pollution and electromagnetic interference caused by the low-frequency electromagnetic radiation generated during the use of electronic equipment have become increasingly prominent, and the low-frequency magnetic field (<100kHz) has a greater impact on the physiology of animals. It can effectively reduce the harm of electromagnetic radiation and reduce the interference to the stability of electronic equipment. The electromagnetic shielding of low-frequency electromagnetic shielding materials is mainly based on internal absorption loss, and the absorption loss will not interfere with the stability of other equipment, which is an ideal shielding mode. The preparation of low-frequency...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L67/04C08L75/04C08K3/04C08K3/08C08K3/22B33Y70/10
CPCC08L67/04C08L75/04B33Y70/10C08K2003/085C08K2003/0806C08K3/041C08K3/08C08K3/22
Inventor 肖学良黄夏妍张康磊王傲
Owner JIANGNAN UNIV
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