Wet etching method and distributed parameter circuit layout

Abstract

The invention provides a wet etching method and a distribution parameter circuit layout. The method comprises the following steps: A, sequentially carrying out the gluing, drying, exposure, development and hardening of a substrate, and enabling the surface of a metal film layer to be reserved to form a protection layer; B, heating a first corrosive liquid to enable the temperature of the first corrosive liquid to be 35-50 DEG C, immersing the substrate into the first corrosive liquid, and taking out the substrate after the metal film layer which does not need to be reserved is completely corroded; C, immersing the substrate into a second corrosive liquid, taking out the substrate when bubbles are gathered on the surface of an adhesion layer, blowing off the bubbles on the surface of the substrate by using pure nitrogen, and continuously immersing the substrate into the second corrosive liquid; and D, soaking the substrate in a third solution to dissolve the protective layer, washing away the third solution left on the surface of the substrate with clear water, and drying the substrate. According to the wet etching method, etching of the metal film layer can be more thorough, and residues are avoided, so the percent of pass of distributed parameter circuit layout etching is improved.

Description

technical field [0001] The invention relates to a wet etching method and a distributed parameter circuit layout. Background technique [0002] With the full rollout of 5G communications, the application of millimeter waves and submillimeter waves is becoming more and more extensive. This requires higher precision of the microwave components in the corresponding communication system. The miniaturization, high integration and high precision of microwave components have become the current technical trend and trend of the microwave industry. [0003] Under DC operation and low frequency operation, the working electromagnetic wavelength is much larger than the component size, all parameters in the circuit are concentrated at each point in space, and the signals between each point are transmitted instantaneously, which is the lumped parameter circuit. As the operating frequency increases, the transmission of the signal is the propagation of the electric field and the magnetic fie...

AI Technical Summary

Problems solved by technology

These small metal dots not only lead to unqualified product appearance, but also affect the electromagnetic field in the layout

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