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Method for preparing anti-vulcanization thick film chip resistor

A technology of chip resistance and anti-sulfurization, which is applied in the direction of coating resistance materials, etc., can solve the problems of affecting electrode performance and vulcanization, and achieve the effects of reducing the possibility of vulcanization, improving adhesion, and improving stability

Pending Publication Date: 2022-01-25
江西昶龙科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, a resistance layer and an electrode layer are formed on the insulating layer, and the electrode layer, that is, the conductive paste, generally contains silver, which is easily vulcanized by sulfur, sulfide and sulfur-containing compounds in the air, affecting the performance of the electrode

Method used

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  • Method for preparing anti-vulcanization thick film chip resistor
  • Method for preparing anti-vulcanization thick film chip resistor

Examples

Experimental program
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Effect test

Embodiment 1

[0025] A method for preparing an anti-sulfurization thick-film chip resistor. A layer of conformal paint is coated on an insulating plate in advance to obtain a substrate, and an anti-sulfurization conductive paste and a resistance paste are coated on the substrate through a mask, and then Sintering forms an electrode layer and a resistance layer on the substrate, continues to coat a protective coating between the electrode layer and the resistance layer, and dries to form a cladding layer to obtain a chip resistor;

[0026] The protective coating includes raw materials in parts by mass: 59 parts of potting silica gel, 7 parts of modified thermal conductive filler and 4 parts of flame retardant;

[0027] The modified thermally conductive filler is composed of a small particle size thermally conductive filler (3-5 μm) and a large particle size thermally conductive filler (14-20 μm), with a mass ratio of 1:7.

[0028] The anti-sulfurization conductive paste contains palladium-si...

Embodiment 2

[0037] A method for preparing an anti-sulfurization thick-film chip resistor. A layer of conformal paint is coated on an insulating plate in advance to obtain a substrate, and an anti-sulfurization conductive paste and a resistance paste are coated on the substrate through a mask, and then Sintering forms an electrode layer and a resistance layer on the substrate, continues to coat a protective coating between the electrode layer and the resistance layer, and dries to form a cladding layer to obtain a chip resistor;

[0038] The protective coating includes raw materials in parts by mass: 69 parts of potting silica gel, 11 parts of modified thermally conductive filler and 9 parts of flame retardant;

[0039] The modified thermally conductive filler is composed of a thermally conductive filler with a small particle size (3-5 μm) and a thermally conductive filler with a large particle size (14-20 μm), with a mass ratio of 1:8.

[0040] The anti-sulfidation conductive paste contai...

Embodiment 3

[0049] A method for preparing an anti-sulfurization thick-film chip resistor. A layer of conformal paint is coated on an insulating plate in advance to obtain a substrate, and an anti-sulfurization conductive paste and a resistance paste are coated on the substrate through a mask, and then Sintering forms an electrode layer and a resistance layer on the substrate, continues to coat a protective coating between the electrode layer and the resistance layer, and dries to form a cladding layer to obtain a chip resistor;

[0050] The protective coating includes raw materials in parts by mass: 68 parts of potting silica gel, 14 parts of modified thermally conductive filler and 11 parts of flame retardant;

[0051] The modified thermally conductive filler is composed of a small particle size thermally conductive filler (3-5 μm) and a large particle size thermally conductive filler (14-20 μm), with a mass ratio of 1:7.

[0052] The anti-sulfurization conductive paste contains palladiu...

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Abstract

The invention discloses a method for preparing an anti-vulcanization thick-film chip resistor and belongs to the field of thick-film chip resistors. The method specifically comprises the following steps that: an insulating plate is coated with a layer of conformal coating in advance to prepare a substrate; the substrate is coated with anti-vulcanization conductive slurry and resistance slurry through a mask; sintering is performed to form an electrode layer and a resistance layer on the substrate; and a protective coating is further applied between the electrode layer and the resistance layer, and drying is performed to form a coating layer to prepare a chip resistor, wherein the protective coating is prepared from the following raw materials in parts by mass: 40 to 89 parts of potting silica gel, 5 to 20 parts of modified heat-conducting filler and 1 to 20 parts of flame retardant, wherein the modified heat-conducting filler is composed of a small-particle-size heat-conducting filler and a large-particle-size heat-conducting filler. According to the method of the invention, a layer of conformal coating is coated on the insulating plate in advance, so that silver migration under the action of high temperature, high humidity and electric field force can be prevented, and short circuit between lines is avoided.

Description

technical field [0001] The invention relates to the field of thick-film chip resistors, in particular to a method for preparing anti-sulfurization thick-film chip resistors. Background technique [0002] Thick film chip resistors use screen printing to mask the conductor paste and resistor paste on the insulating board to make corresponding patterns, and finally make it through heating. That is, a resistive layer and an electrode layer are formed on the insulating layer, and the electrode layer, that is, the conductive paste, generally contains silver, which is easily vulcanized by sulfur, sulfide and sulfur-containing compounds transmitted in the air, affecting the performance of the electrode. Therefore, how to strengthen the anti-sulphurization property of the chip resistor is an important issue in the industry. Contents of the invention [0003] The object of the present invention is to at least solve one of the technical problems in the prior art, and provide a metho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C17/06
CPCH01C17/06
Inventor 贾碧溪帅晓晴田空圣朱其乐李国武洪志斌
Owner 江西昶龙科技有限公司
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