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Surface treatment process for reducing peel strength heat loss rate of electrolytic copper foil

A technology of heat loss rate and surface treatment, applied in the direction of electrolysis, electroforming, etc., can solve the problems of low anti-peel strength of electrolytic copper foil, reduce the heat loss rate of electrolytic copper foil anti-peel strength, high heat loss rate, etc., to avoid The effects of high dendrites, low heat loss rate of peel strength, and good heat resistance

Active Publication Date: 2022-01-28
安徽华创新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a surface treatment process for reducing the heat loss rate of the electrolytic copper foil anti-peeling strength. During the roughening process of the electrolytic copper foil surface, heat-resistant metal ions are added to promote the roughening of the electrolytic copper foil. The chemical layer contains a heat-resistant metal, which makes it have excellent heat resistance, and combined with two-stage heat-resistant treatment, a more stable surface treatment layer is formed. The electrolytic copper foil produced according to this surface treatment process has an excellent peel strength. The heat loss rate can be controlled within 10%, which solves the problem of low anti-peel strength of electrolytic copper foil in the prior art and high heat loss rate

Method used

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  • Surface treatment process for reducing peel strength heat loss rate of electrolytic copper foil
  • Surface treatment process for reducing peel strength heat loss rate of electrolytic copper foil
  • Surface treatment process for reducing peel strength heat loss rate of electrolytic copper foil

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] see figure 1 As shown, a surface treatment process to reduce the heat loss rate of the electrolytic copper foil anti-peel strength, the thickness of the copper foil is selected to be 12 μm, mainly including the following processes:

[0030] Copper foil unwinding, pickling, roughening 1, washing, curing 1, washing, roughening 2, washing, curing 2, washing, heat resistance 1, washing, heat resistance 2, washing, passivation, washing, coupling agent Coating, drying, copper foil winding;

[0031] The measured process parameter values ​​of each process are shown in Table 1 below:

[0032] Table 1

[0033]

[0034]

Embodiment 2

[0036] see figure 1 As shown, a surface treatment process for reducing the heat loss rate of the anti-peel strength of electrolytic copper foil, the thickness of the copper foil is selected as 18 μm, mainly includes the following processes:

[0037] Copper foil unwinding, pickling, roughening 1, washing, curing 1, washing, roughening 2, washing, curing 2, washing, heat resistance 1, washing, heat resistance 2, washing, passivation, washing, coupling agent Coating, drying, copper foil winding;

[0038] The measured process parameter values ​​of each process are shown in Table 2 below:

[0039] Table 2

[0040]

[0041]

[0042]

Embodiment 3

[0044] see figure 1 As shown, a surface treatment process to reduce the heat loss rate of the electrolytic copper foil anti-peel strength, the thickness of the copper foil is selected to be 35 μm, mainly including the following processes:

[0045] Copper foil unwinding, pickling, roughening 1, washing, curing 1, washing, roughening 2, washing, curing 2, washing, heat resistance 1, washing, heat resistance 2, washing, passivation, washing, coupling agent Coating, drying, copper foil winding;

[0046] The measured process parameter values ​​of each process are shown in Table 3 below:

[0047] table 3

[0048]

[0049]

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Abstract

The invention relates to a surface treatment process for reducing the peel strength heat loss rate of an electrolytic copper foil, which belongs to the technical field of copper foil surface treatment and mainly comprises the following procedures: copper foil unwinding, acid pickling, coarsening 1, water washing, curing 1, water washing, coarsening 2, water washing, curing 2, water washing, heat resistance 1, water washing, heat resistance 2, water washing, passivation, water washing, coupling agent coating, drying and copper foil winding. According to the surface treatment process, Co<2+> and Mo<6+> heat-resistant metal ions are added in the tank solutions of the coarsening step 1 and the coarsening step 2, so that the coarsened copper nodule layer on the rough surface of the copper foil has good heat resistance, meanwhile, the uniformity of the electroplated copper nodule layer can be improved, and the serious defects that due to the fact that dendritic crystals are too high and uneven in distribution, copper powder of the copper foil falls off and the like are overcome; coSO4 is used for replacing ZnSO4 in a tank solution of the heat resistance 1 working procedure, a layer of cobalt-nickel alloy is electroplated on the rough surface of the copper foil, and compared with zinc-nickel alloy, the peeling strength heat loss rate of the cobalt-nickel alloy is lower.

Description

technical field [0001] The invention belongs to the technical field of copper foil surface treatment, and in particular relates to a surface treatment process for reducing the heat loss rate of anti-peeling strength of electrolytic copper foil. Background technique [0002] Electrolytic copper foil is widely used in the production of copper clad laminates and printed circuit boards, and is a basic material for electronic products. Before the production of printed circuit boards, the electrolytic copper foil and the prepreg (insulating material) are pressed into a copper clad laminate under high temperature conditions in the copper clad laminate factory, and then transferred to the downstream enterprise circuit board factory for circuit board processing. In the processing and production of printed circuit boards, especially multilayer circuit boards, it is necessary to repeatedly process under high temperature conditions, such as copper sinking process, drilling process, etch...

Claims

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Application Information

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IPC IPC(8): C25D1/04
CPCC25D1/04Y02E60/10
Inventor 黄国平操声跃邴吉辰何桂青吴其舟
Owner 安徽华创新材料股份有限公司
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