High-thermal-conductivity low-viscosity two-component organic silicon pouring sealant and preparation method thereof

A low-viscosity silicone potting compound technology, applied in the direction of polymer adhesive additives, non-polymer adhesive additives, adhesives, etc., can solve the problems of poor application of thermally conductive fillers and achieve excellent anti-settling properties , Disperse evenly and reduce viscosity

Pending Publication Date: 2022-02-11
深圳联腾达科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to improve the problem that the addition of thermally conductive fillers in silicone potting adhesives is prone to agglomeration and settlement of thermally conductive fillers, resul

Method used

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  • High-thermal-conductivity low-viscosity two-component organic silicon pouring sealant and preparation method thereof
  • High-thermal-conductivity low-viscosity two-component organic silicon pouring sealant and preparation method thereof
  • High-thermal-conductivity low-viscosity two-component organic silicon pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0058] Example 1

[0059] A component preparation: 25 parts of vinyl silicone oil and 0.3 parts of silane coupling agent were added to the reaction kettle and mixed for 10 minutes at a rotational speed of 600 rpm, and then 0.2 parts of anti-sedimentation and 80 parts. Spherical alumina was stirred at 1000 rpm to stir for 15 minutes, then 80 spherical alumina was added, stirred at 1000 rpm of rotation for 2 hours to obtain the base gum A, cooled to room temperature, and transfer the base gum A to homogeneous machines and 2 parts of polyimethylsiloxane and 0.2 parts of platinum catalyst were added, and stirred at 1200 rpm of rotation for 20 minutes, then vacuum-defoated for 20 minutes at 0.02 mP vacuum to obtain a component;

[0060] The preparation of the B component: 21 parts of the vinyl silicone oil and 0.3 parts of the silane coupling agent were mixed and stirred at a rotation of 600 rpm for 10 minutes, then 0.2 parts of anti-deposition agent, 0.1 parts of carbon black and 80 s...

Example Embodiment

[0062] Example 2

[0063] The preparation of the A component: 21 parts of the vinyl silicone oil and 0.35 parts of silane coupling agent were added to the reaction kettle and stirred for 8 minutes at a rotational speed of 650 rpm, and then 0.3 parts of anti-deposition and 85 parts Spherical alumina was stirred at 1050 rpm to stir for 12 minutes, then 85 parts of spherical alumina were added, stirred at 1050 rpm to give the base gum A, cooled to room temperature, and transfer the base gum A to homogeneous machines and 4 parts of polyimethylsiloxane and 0.25 parts of platinum catalyst were added, and stirred at 1300 rpm for 15 minutes, then evacuated at 0.04 MP vacuum for 15 minutes to obtain a component;

[0064] The preparation of B component: 18 parts of vinyl silicone oil and 0.35 parts of silane coupling agent were mixed and stirred at a rotation of 650 rpm for 8 minutes, then 0.3 parts of anti-deposition, 0.2 servocal black and 85 spherical alumina, The mixture was stirred at ...

Example Embodiment

[0066] Example 3

[0067] The preparation of the A component: 20 parts of the vinyl silicone oil and 0.4 parts of silane coupling agent were added to the reactor in the reaction kettle and stirred for 5 minutes at a rotational speed of 700 rpm, and then 0.35 parts of anti-deposition and 87.5 parts. Spherical alumina was stirred at 1100 rpm to stir for 10 minutes, then 87.5 parts of spherical alumina were added, stirred at a radius of 1100 rpm for 1 hour to give the base gum A, cooled to room temperature, and transfer the base gum A to a huge machine. 3 parts of polyimethylsiloxane and 0.3 parts of platinum catalyst were added, stirred at 1500 rpm for 15 minutes, then evacuated at 0.06 MP vacuum for 10 minutes, and the a component was obtained;

[0068] The preparation of B component: 16 parts of vinyl silicone oil and 0.4 parts of silane coupling agent were mixed and stirred at a rotation of 700 rpm for 5 minutes, then 0.35 parts of anti-deposition agent, 0.3 copper black and 87.5...

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Abstract

The invention relates to the field of organic silicon pouring sealants, and particularly discloses a high-thermal-conductivity low-viscosity two-component organic silicon pouring sealant and a preparation method thereof. The organic silicon pouring sealant is composed of a component A and a component B, the component A is prepared from the following raw materials in parts by weight: 15 to 25 parts of vinyl silicone oil, 2 to 5 parts of polydimethylsiloxane, 0.3 to 0.5 part of a silane coupling agent, 0.2 to 0.4 part of a catalyst, 160 to 185 parts of spherical aluminum oxide and 0.2 to 0.5 part of an anti-settling agent; and the component B is prepared from the following raw materials in parts by weight: 13 to 21 parts of vinyl silicone oil, 2 to 5 parts of polydimethylsiloxane, 0.3 to 0.5 part of a silane coupling agent, 2 to 5 parts of hydrogen-containing silicone oil, 160 to 185 parts of spherical aluminum oxide, 0.02 to 0.1 part of an inhibitor, 0.2 to 0.5 part of an anti-settling agent and 0.1 to 0.5 part of carbon black.

Description

technical field [0001] The present application relates to the field of silicone potting compound, more specifically, it relates to a high thermal conductivity and low viscosity two-component silicone potting compound and a preparation method thereof. Background technique [0002] Silicone potting adhesive is mainly used for bonding, sealing, potting and coating protection of electronic components. It is usually composed of A and B components. The mixing of A and B components will gradually solidify, and it will be liquid before curing. It has fluidity, and its advantages are excellent weather resistance and high and low temperature resistance. It can be used for a long time at -60 ° C to 200 ° C. The curing shrinkage rate is low, and the curing process basically does not damage the components. It is controllable and has excellent insulation performance, so it is widely used in new energy vehicles, LED lighting, power modules and other fields. According to different applicat...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/04C09J183/05C09J11/04C09J11/06C09J11/08
CPCC09J183/04C09J11/04C09J11/06C09J11/08C08K2201/005C08K2201/014C08K2201/006C08K2201/011C08K2003/265C08L83/04C08K7/18C08K3/04C08K3/26C08K7/26C08K5/5425C08K5/5419C08K5/5435Y02E60/10
Inventor 张浩清罗裕锋唐浩李华李中鹏
Owner 深圳联腾达科技有限公司
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