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High-thermal-conductivity low-viscosity two-component organic silicon pouring sealant and preparation method thereof

A low-viscosity silicone potting compound technology, applied in the direction of polymer adhesive additives, non-polymer adhesive additives, adhesives, etc., can solve the problems of poor application of thermally conductive fillers and achieve excellent anti-settling properties , Disperse evenly and reduce viscosity

Pending Publication Date: 2022-02-11
深圳联腾达科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to improve the problem that the addition of thermally conductive fillers in silicone potting adhesives is prone to agglomeration and settlement of thermally conductive fillers, resulting in poor application effects after curing of the glue, this application provides a high thermal conductivity and low viscosity two-component silicone potting adhesive and its preparation method

Method used

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  • High-thermal-conductivity low-viscosity two-component organic silicon pouring sealant and preparation method thereof
  • High-thermal-conductivity low-viscosity two-component organic silicon pouring sealant and preparation method thereof
  • High-thermal-conductivity low-viscosity two-component organic silicon pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Preparation of component A: In parts by weight, add 25 parts of vinyl silicone oil and 0.3 parts of silane coupling agent into the reactor, mix and stir at 600 rpm for 10 minutes, then add 0.2 parts of anti-settling agent and 80 parts of Spherical alumina, stirred at a rotating speed of 1000rpm for 15 minutes, then added 80 parts of spherical alumina, stirred at a rotating speed of 1000rpm for 2 hours to obtain base glue A, cooled to room temperature, transferred base glue A to a homogenizer and Add 2 parts of polydimethylsiloxane and 0.2 parts of platinum catalyst, stir at 1200rpm for 20 minutes, then vacuumize and defoam for 20 minutes at a vacuum of 0.02MP to obtain component A;

[0060] Preparation of component B: Mix 21 parts of vinyl silicone oil and 0.3 parts of silane coupling agent and stir at 600 rpm for 10 minutes, then add 0.2 parts of anti-sedimentation agent, 0.1 part of carbon black and 80 parts of spherical alumina. Stir at a speed of 1000rpm for 15 minu...

Embodiment 2

[0063] Preparation of component A: In parts by weight, add 21 parts of vinyl silicone oil and 0.35 parts of silane coupling agent into the reactor, mix and stir at 650 rpm for 8 minutes, then add 0.3 parts of anti-settling agent and 85 parts of Spherical alumina, stirred at a rotating speed of 1050rpm for 12 minutes, then added 85 parts of spherical alumina, stirred at a rotating speed of 1050rpm for 1.5 hours to obtain base glue A, cooled to room temperature, transferred base glue A to a homogenizer and Add 4 parts of polydimethylsiloxane and 0.25 parts of platinum catalyst, stir at 1300rpm for 15 minutes, and then vacuumize and defoam for 15 minutes at a vacuum of 0.04MP to obtain component A;

[0064] Preparation of component B: Mix 18 parts of vinyl silicone oil and 0.35 parts of silane coupling agent and stir at 650rpm for 8 minutes, then add 0.3 parts of anti-sedimentation agent, 0.2 parts of carbon black and 85 parts of spherical alumina. Stir at 1050rpm for 12 minutes,...

Embodiment 3

[0067] Preparation of component A: In parts by weight, add 20 parts of vinyl silicone oil and 0.4 parts of silane coupling agent into the reactor, mix and stir at 700 rpm for 5 minutes, then add 0.35 parts of anti-settling agent and 87.5 parts of Spherical alumina, stirred at a rotating speed of 1100rpm for 10 minutes, then added 87.5 parts of spherical alumina, stirred at a rotating speed of 1100rpm for 1 hour to obtain base glue A, cooled to room temperature, transferred base glue A to a homogenizer and Add 3 parts of polydimethylsiloxane and 0.3 parts of platinum catalyst, stir at 1500rpm for 15 minutes, then vacuumize and defoam for 10 minutes at a vacuum of 0.06MP to obtain component A;

[0068] Preparation of component B: Mix 16 parts of vinyl silicone oil and 0.4 parts of silane coupling agent and stir at 700 rpm for 5 minutes, then add 0.35 parts of anti-sedimentation agent, 0.3 parts of carbon black and 87.5 parts of spherical alumina. Stir at a speed of 1100rpm for 1...

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Abstract

The invention relates to the field of organic silicon pouring sealants, and particularly discloses a high-thermal-conductivity low-viscosity two-component organic silicon pouring sealant and a preparation method thereof. The organic silicon pouring sealant is composed of a component A and a component B, the component A is prepared from the following raw materials in parts by weight: 15 to 25 parts of vinyl silicone oil, 2 to 5 parts of polydimethylsiloxane, 0.3 to 0.5 part of a silane coupling agent, 0.2 to 0.4 part of a catalyst, 160 to 185 parts of spherical aluminum oxide and 0.2 to 0.5 part of an anti-settling agent; and the component B is prepared from the following raw materials in parts by weight: 13 to 21 parts of vinyl silicone oil, 2 to 5 parts of polydimethylsiloxane, 0.3 to 0.5 part of a silane coupling agent, 2 to 5 parts of hydrogen-containing silicone oil, 160 to 185 parts of spherical aluminum oxide, 0.02 to 0.1 part of an inhibitor, 0.2 to 0.5 part of an anti-settling agent and 0.1 to 0.5 part of carbon black.

Description

technical field [0001] The present application relates to the field of silicone potting compound, more specifically, it relates to a high thermal conductivity and low viscosity two-component silicone potting compound and a preparation method thereof. Background technique [0002] Silicone potting adhesive is mainly used for bonding, sealing, potting and coating protection of electronic components. It is usually composed of A and B components. The mixing of A and B components will gradually solidify, and it will be liquid before curing. It has fluidity, and its advantages are excellent weather resistance and high and low temperature resistance. It can be used for a long time at -60 ° C to 200 ° C. The curing shrinkage rate is low, and the curing process basically does not damage the components. It is controllable and has excellent insulation performance, so it is widely used in new energy vehicles, LED lighting, power modules and other fields. According to different applicat...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/04C09J183/05C09J11/04C09J11/06C09J11/08
CPCC09J183/04C09J11/04C09J11/06C09J11/08C08K2201/005C08K2201/014C08K2201/006C08K2201/011C08K2003/265C08L83/04C08K7/18C08K3/04C08K3/26C08K7/26C08K5/5425C08K5/5419C08K5/5435Y02E60/10
Inventor 张浩清罗裕锋唐浩李华李中鹏
Owner 深圳联腾达科技有限公司
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