LED chip and preparation method thereof
A technology of LED chips and quantum well layers, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of affecting the luminous efficiency of InGaN-based LEDs, deteriorating the crystal quality of multi-quantum well active layers, and increasing non-radiative recombination centers. Achieve the effects of improving luminous efficiency, improving crystal quality, and reducing non-radiative recombination centers
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[0091] The embodiment of the present application also provides a method for preparing an LED chip, the method comprising:
[0092] S100: providing a substrate 10;
[0093] S200: forming a first-type semiconductor layer 20 on one side of the substrate 10;
[0094] S300: Form a multi-quantum well active layer 30 on the side of the first-type semiconductor layer 20 away from the substrate 10, such as figure 1 As shown, the multiple quantum well active layer 30 includes quantum barrier layers 31 and quantum well layers 32 alternately arranged along the direction away from the substrate 10, the quantum barrier layer 31 is an InGaN quantum barrier layer, and the quantum barrier layer 31 is an InGaN quantum barrier layer. The well layer 32 includes at least one stack unit 320, and the stack unit 320 includes a first InGaN quantum well layer 321, an InN layer 322 and a second InGaN quantum well layer 323 arranged in sequence along a direction away from the substrate 10;
[0095] S40...
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