Multi-chip packaging structure applied to dynamic backlight

Abstract

The invention relates to a multi-chip packaging structure applied to dynamic backlight. The multi-chip packaging structure effectively solves the problems that during existing LED multi-chip packaging, LED chips are low in light emitting efficiency and poor in heat dissipation effect. According to the technical scheme, heat dissipation is conducted through a heat sink and heat conduction metal traditionally, meanwhile, better heat dissipation can be conducted on packaging glue in an air cooling mode, then the heat dissipation efficiency of an LED chip is improved, the LED chip is made to be in a good working environment, and the service life of the LED chip is prolonged.

Description

technical field [0001] The invention belongs to the technical field of LED lighting, and in particular relates to a multi-chip packaging structure applied to dynamic backlights. Background technique [0002] LED packaging components mainly include substrate (heat dissipation), packaging glue (silica gel), packaging lens (with high refractive index and light transmittance), etc. The combination of packaging glue and packaging lens provides protection for the chip (prevents the chip from being exposed to air Long-term exposure or mechanical damage and failure to improve the stability of the chip), but also achieved a better light extraction efficiency, which in turn makes the LED have better luminous efficiency; [0003] Since, basically more than 80% of the input power of the existing LED devices is converted into heat, if the heat is not dissipated in time, the LED chip will work in a high-temperature environment for a long time, which will cause obvious damage. Light decay...

AI Technical Summary

Problems solved by technology

[0003] Since, basically more than 80% of the input power of the existing LED devices is converted into heat, if the heat is not dissipated in time, the LED chip will work in a high-temperature environment for a long time, which will cause obvious damage. Light decay (shorten its life), and the encapsulant is exposed to high temperature for a long time and the internal thermal stress increases, resulting in a decrease in the refractive index and affecting light emission;

[0004] Existing heat dissipation methods for LED chips mainly adopt the heat transfer method to dissipate heat, that is, by installing the LED chip on a heat sink or a metal material with good thermal conductivity to conduct the heat generated when it emits light to the outside , because the end of the encapsulant away from the base is far away from the heat sink and heat-conducting metal, the heat inside the end of the encapsulant away from the base cannot be dissipated quickly, and the performance of the encapsulant is also an important factor in the luminous efficiency of LEDs;

[0005] Aiming at the fact that the heat dissipation method of the existing LED chips is relatively single and cannot achieve a good heat dissipation effect, this solution provides a multi-chip packaging structure applied to dynamic backlights to solve the above problems

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