Multi-chip packaging structure applied to dynamic backlight

A technology of multi-chip packaging and dynamic backlight, which is applied to semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, light sources, etc., can solve the problems of affecting light emission, heat cannot be quickly dissipated outward, and shortening lifespan, etc. Achieve the effect of accelerating heat dissipation efficiency, improving electro-optical conversion efficiency, and improving light output efficiency

Pending Publication Date: 2022-02-18
GUANGDONG GMA OPTOELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since, basically more than 80% of the input power of the existing LED devices is converted into heat, if the heat is not dissipated in time, the LED chip will work in a high-temperature environment for a long time, which will cause obvious damage. Light decay (shorten its life), and the encapsulant is exposed to high temperature for a long time and the internal thermal stress increases, resulting in a decrease in the refractive index and affecting light emission;
[0004] Existing heat dissipation methods for LED chips mainly adopt the heat transfer method to dissipate heat, that is, by installing the LED chip on a heat sink or a metal material with goo

Method used

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  • Multi-chip packaging structure applied to dynamic backlight
  • Multi-chip packaging structure applied to dynamic backlight
  • Multi-chip packaging structure applied to dynamic backlight

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0028] Example 1, a multi-chip package structure applied to dynamic backlight, such as attached figure 1 As shown, the heat dissipating base 1 is provided with an insulating layer 2 and mounted on the insulating layer 2 to achieve a better insulation effect, preventing the LED chip 3 from damage due to leakage, short circuit, and is installed on the heat dissipation base 1. The lens 4 and the encapsulating lens 4 is filled with encapsulating glue 5 (silica gel), while providing a good physical protection effect on the LED chip 3, in order to achieve good lighting effects of the LED chip 3, the improvement of this program is: Append figure 2 As shown, the closed channel 6 is mounted on the insulating layer 2, and the encapsulating glue 5 is also wrapped in the closed channel 6 (closed channel 6 with the package glue 5), in which multi-LED chip is filled. When the light generated by the LED chip 3 is emitted outwardly through the encapsulating glue 5 (since the heat dissipating base...

Example Embodiment

[0035] Example 2, on the basis of Example 1, Figure 7 As shown, the corresponding two block 8 is fixed between the link 12, and the transmission includes a long pendulum 13 that rotates to the center portion of the link 12, and when the temperature of the closed channel 6 exceeds the required range, feel The short swing rod 16 of the temperature-loaded drive and the rotation mounted is moved to the small circular plate 15 rotation to the mounting of the short swing rod 16 eccentricly rotated, and the rotation of the small disk 15 is rotated and the coaxial rotation of the coaxial rotation 14 Turn (small round plate 15, the matte of the large circular plate 14 achieves the effect of amplifying the stroke), along with the rotation of the large disc 14, and thus moving the link 12 by the long swing rod 13 mounted with it, ultimately realizes the driving two The block 8 moves, and it is achieved by the effect of opening the rectangular hole 7 that is blocked;

[0036] At this time, th...

Example Embodiment

[0037] Example 3, on the basis of Example 2, Figure 7 As shown, the temperature temperature device includes a sensing temperature block 17 fixed to the top wall of the closed channel 6, and the sensing temperature block 17 selects a material that is easily expanded, such as hot double metals, etc., when it is hot, it produces a certain degree of expansion. The deformation, thereby producing a distance of a distance;

[0038] The thermal bimetallic refers to a composite material that is firmly combined with a metal or alloy component layer having different thermal expansion coefficients, and can eventually obtain different types of thermal doubles depending on the material used in the first. Metal, such as high temperature, medium temperature, low temperature, high sensitive, etc., such that changes in temperature in temperature intervals of different sizes can produce a certain degree of expansion, deformation;

[0039] The short swing rod 16 is rotated on the sensing temperature ...

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PUM

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Abstract

The invention relates to a multi-chip packaging structure applied to dynamic backlight. The multi-chip packaging structure effectively solves the problems that during existing LED multi-chip packaging, LED chips are low in light emitting efficiency and poor in heat dissipation effect. According to the technical scheme, heat dissipation is conducted through a heat sink and heat conduction metal traditionally, meanwhile, better heat dissipation can be conducted on packaging glue in an air cooling mode, then the heat dissipation efficiency of an LED chip is improved, the LED chip is made to be in a good working environment, and the service life of the LED chip is prolonged.

Description

technical field [0001] The invention belongs to the technical field of LED lighting, and in particular relates to a multi-chip packaging structure applied to dynamic backlights. Background technique [0002] LED packaging components mainly include substrate (heat dissipation), packaging glue (silica gel), packaging lens (with high refractive index and light transmittance), etc. The combination of packaging glue and packaging lens provides protection for the chip (prevents the chip from being exposed to air Long-term exposure or mechanical damage and failure to improve the stability of the chip), but also achieved a better light extraction efficiency, which in turn makes the LED have better luminous efficiency; [0003] Since, basically more than 80% of the input power of the existing LED devices is converted into heat, if the heat is not dissipated in time, the LED chip will work in a high-temperature environment for a long time, which will cause obvious damage. Light decay...

Claims

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Application Information

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IPC IPC(8): H01L33/58H01L33/64H01L25/075F21V29/60F21V29/70F21Y115/10
CPCH01L33/58H01L33/648H01L25/0753F21V29/60F21V29/70F21Y2115/10
Inventor 陈本亮张诺寒廖勇军李文庭吴宪军王志邦
Owner GUANGDONG GMA OPTOELECTRONICS TECH
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