Application of organosilicon material in 3D printing

A 3D printing and 3D printer technology, which is applied in the application field of silicone materials in 3D printing, can solve the problems of poor tensile strength and elongation at break of silicone rubber, and achieve high thermal curing elongation at break and high strength , the effect of improving the mechanical properties

Active Publication Date: 2022-03-18
中化化工科学技术研究总院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This patent generates free radicals through UV-sensitive photoinitiators to initiate the curing of vinyl-containing organopolysiloxanes and silicon-hydrogen bond-containing organopolysiloxanes. Compared with addition-type silicone rubber, its mechanical properties are relatively poor. Large gap, the tensile strength and elongation at break of silicone rubber are relatively poor

Method used

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  • Application of organosilicon material in 3D printing
  • Application of organosilicon material in 3D printing
  • Application of organosilicon material in 3D printing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] An application of an organosilicon material in 3D printing, wherein the organosilicon material is composed of the following components: 100g of dimethylvinylsiloxy-terminated dimethylpolysiloxane with a viscosity of 20000cps, 10g of Trimethylsiloxy terminated methyl hydrogen polysiloxane, 10g Jiangxi Xinjiayi XJY-8206N, 0.01g Lumogen (TM) IR788, 0.2 g 3-methyl-1-butyn-3-ol, 10 ppm chloroplatinic acid isopropanol solution (calculated as Pt metal, based on the mass of the total silicone material), 5 g fumed silica.

[0034] The preparation process of the above-mentioned organosilicon material is: (1) mixing and stirring the above-mentioned materials except for the isopropanol solution of chloroplatinic acid; (2) adding the alcohol solution of chloroplatinic acid to the mixture obtained in (1), stirring and mixing Uniform, you can get a transparent light-cured 3D printing material.

[0035] The preservation method of the organosilicon material prepared by the present inve...

Embodiment 2

[0037] An application of an organosilicon material in 3D printing, wherein the organosilicon material is composed of the following components: 50g dimethylvinylsiloxy-terminated dimethylpolysiloxane, 50g dimethylvinyl Siloxy-terminated dimethylsiloxane and methylphenylsiloxane copolymer, 20g methyl hydrogen-containing polysiloxane, 20g Shandong Dayi DY-VMQ102, 0.01g (methylcyclopentadiene ) manganese tricarbonyl, 0.2g 1-ethynyl cyclohexanol, 10ppm Shanghai Sibao ACS-Pt-30 (calculated as Pt metal, based on the total gel mass), 30g calcium carbonate.

[0038] The preparation process of the above-mentioned organosilicon material is the same as that in Example 1.

Embodiment 3

[0040] An application of an organosilicon material in 3D printing, wherein the organosilicon material is composed of the following components: 100g of dimethylvinylsiloxy-terminated dimethylsiloxane and methylvinylsiloxane Copolymer, 10g methylphenylhydrogenpolysiloxane, 5g methylhydrogenpolysiloxane, 5g Jiangxi Xinjiayi XJY-8206N, 5g Shandong Dayi DY-VMQ102, 0.01g Lumogen (TM) IR788, 0.2g 1-ethynyl cyclohexanol, 10ppm chloroplatinic acid isopropanol solution (calculated as Pt metal, based on the total colloid mass), 5g precipitated silica, 5g fumed silica.

[0041] The preparation process of the above-mentioned organosilicon material is the same as that in Example 1.

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Abstract

The invention relates to application of an organosilicon material in 3D printing, and belongs to the technical field of 3D printing photocuring. The organic silicon material is cured by infrared light in the 3D printing process. According to the single-component organic silicon material, infrared light is adopted to initiate local short-time curing of the addition type organic silicon material, rapid curing forming of the organic silicon material in the printing process of a 3D printer is achieved, and good mechanical performance is achieved.

Description

technical field [0001] The invention relates to the technical field of 3D printing photocuring, and specifically provides an application of an organic silicon material in 3D printing. Background technique [0002] At present, the curable resin materials used for 3D printing include acrylic resin, polyurethane resin, epoxy resin, etc. These resins have the advantages of high strength and good adhesion. However, due to its high curing hardness, it cannot be made into an ideal elastomer material, and its weather resistance is relatively poor, and its biocompatibility is also poor. Silicone materials are a class of materials with excellent biocompatibility, stable performance, excellent weather resistance and durability, and can be made into rubber elastomers with excellent performance. However, silicone materials require two-component cross-linking curing or moisture curing, and silicone materials cannot be used in 3D printing and other scenarios that require short-term curing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05B33Y70/10
CPCC08L83/04B33Y70/10Y02P10/25
Inventor 杨淼
Owner 中化化工科学技术研究总院有限公司
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