Multi-channel digital optical module airtight packaging structure and ceramic circuit board

Abstract

The invention relates to a multichannel digital optical module airtight packaging structure and a ceramic circuit board, and the multichannel digital optical module airtight packaging structure comprises a packaging cover plate and a packaging tube shell which are welded to form a packaging shell, and the ceramic circuit board is welded and fixed at the bottom of the packaging tube shell. First bonding pads used for being in contact conduction with an LGA connector assembled in a groove in the bottom of the packaging tube shell are distributed at the bottom of the ceramic circuit board in an array mode. An array PD chip and a VCSEL chip which are used for achieving photoelectric conversion between the ceramic circuit board and the FA optical fiber assembly are further attached to the bottom of the packaging tube shell, and the FA optical fiber assembly and the packaging tube shell are welded and sealed. The packaging structure is not only high in reliability, but also large in pin density, and the overall packaging size can be remarkably reduced when the multi-channel optical module is integrally packaged. The whole module adopts metal ceramic packaging, and the chip is tightly attached to the bottom metal of the packaging tube shell, so that the excellent heat dissipation performance of the whole module is ensured, the module is suitable for extremely harsh application environments, and the requirement of rapid development of the photoelectric information technology in the military field can be met.

Description

technical field [0001] The invention belongs to the technical field of digital light, and in particular relates to a multi-channel digital light module hermetic packaging structure. Background technique [0002] The digital optical module is mainly composed of optoelectronic devices, functional circuits and optical interfaces to realize the optical / electrical and electrical / optical conversion of digital signals, and is widely used in various digital optical communication systems, such as fiber channel, Gigabit Ethernet, SONET / SDH, switches etc. With the continuous improvement of the data communication capacity of the digital optical module, the number of optical module channels continues to increase, and the application scenarios of the module continue to expand, and the environmental requirements are more stringent. The packaging structure of the digital optical module must also be continuously improved. [0003] The existing digital optical module products benefit from th...

AI Technical Summary

Problems solved by technology

[0004] 1) The packaging structure cannot reliably protect the internal circuit of the product

The current optical module packaging process mainly uses conductive glue, epoxy glue or silicone rubber to bond, fix and seal the internal components. Stress and mechanical stress lead to interface cracking and delamination, which limits the application of products in some special fields (such as military and aerospace);

[0005] 2) The use temperature is lower

The high-frequency signal carrier board inside the digital optical module mostly uses a PCB board. The thermal expansion coefficient of the board itself is quite different from that of the tube shell. When the temperature difference changes greatly, there will be a large thermal stress at the material interface, which will affect the overall working temperature of the product. promotion;

[0006] 3) The number of channels is small: the signal pins of conventional digital optical modules are generally transmitted by plane differential lines, and the plane area occupied by the interface is large. When the number of module channels increases, the pin arrangement becomes the main factor limiting the module size

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