A kind of multilayer circuit board manufacturing method and multilayer circuit board
A technology for multilayer circuit boards and manufacturing methods, which is applied in the direction of multilayer circuit manufacturing, conductive pattern formation, and electrical connection formation of printed components, etc., can solve problems such as high cost and complicated processing, achieve low difficulty, simple operation, and reduce production cost effect
Active Publication Date: 2022-05-10
四川英创力电子科技股份有限公司
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Problems solved by technology
This method uses an acidic or alkaline etching solution to corrode the copper layer. The treatment after the etching solution is used is relatively complicated and the cost is high.
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[0052] In order to enable those skilled in the art to better understand the solution of the present application, the present application will be further described in detail below in conjunction with specific embodiments. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0053] The multilayer circuit board manufacturing method is implemented in the following steps:
[0054] S100: Choose an epoxy glass cloth board with a thickness of 0.15mm~0.5mm as the substrate 4, such as figure 1 As shown, the substrate 4 is processed: including the following steps,
[0055] S101: Drilling a number of first through holes 41 at predetermined positions on the surface of the substrate 4, the drilling method may be mechanical drilling...
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A method for manufacturing a multilayer circuit board, comprising the steps of processing a substrate, processing an adhesive layer, laminating, and hot pressing. Processing the substrate includes drilling a number of first through holes at predetermined positions on the surface of the substrate, opening a number of depth-controlling grooves on the surface of the substrate, filling the first through-holes with copper paste for drying, and filling the depth-controlling grooves with copper paste for drying. step. Processing the adhesive layer includes the steps of drilling a plurality of second through holes on the surface of the adhesive layer, filling the second through holes with copper paste and drying. Lamination is to stack the processed substrate and the processed adhesive layer sequentially. Hot pressing is to hot press the laminated substrate and depth control groove to make a multi-layer circuit board. A multilayer circuit board is processed by using the multilayer circuit board manufacturing method. The manufacturing method of the multi-layer circuit board provided by the invention is less difficult, avoids the steps of high energy consumption and high cost such as electroplating and etching, reduces the production cost, and has high work efficiency. The surface of the substrate of the multi-layer circuit board provided by the invention is flat, and the circuit gap does not need to be filled in the pressing process.
Description
technical field [0001] The invention relates to the processing technology of electronic components, in particular to a method for manufacturing a multilayer circuit board and the multilayer circuit board. Background technique [0002] With the development of society and science and technology, electronic products are increasingly miniaturized, printed circuit boards for connecting different devices and substrates for semiconductor chip packaging are becoming lighter, thinner, shorter, and development in a small direction. In order to meet the above requirements, finer lines with smaller dimensions and thinner insulating layers are technical conditions that must be met. [0003] In the current manufacturing method of printed circuit boards, the circuit is generally processed by etching. That is, on the surface of the copper foil, the film is developed to form a resist pattern, and the exposed copper layer is removed by selective etching, and the conductor pattern is obtaine...
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IPC IPC(8): H05K3/10H05K3/40H05K3/46
Inventor 胡志强陈坤郑发应杨海军牟玉贵邓岚张仁军
Owner 四川英创力电子科技股份有限公司