Unlock instant, AI-driven research and patent intelligence for your innovation.

Support structure for ultrasonic resonator and ultrasonic vibration processing device

A vibration processing and ultrasonic technology, applied in the direction of fine working devices, manufacturing tools, metal processing, etc., can solve problems such as easy tilting, long processing time, and cutting-in speed limit, etc., to achieve improved replacement operations, excellent support stability, Effect of Simplified Support Structure

Active Publication Date: 2022-04-01
TAKATA CORPORATION
View PDF10 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In Patent Document 1, since it becomes a cantilever structure in which a cutting blade is installed at the front end of the ultrasonic resonator, there is a problem as follows: due to the impact from the wafer during processing, Reaction force, the front end side of the ultrasonic resonance body is easy to tilt, the cutting speed is limited and the processing time becomes longer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Support structure for ultrasonic resonator and ultrasonic vibration processing device
  • Support structure for ultrasonic resonator and ultrasonic vibration processing device
  • Support structure for ultrasonic resonator and ultrasonic vibration processing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] Next, an embodiment of the present invention will be described with reference to the drawings for understanding the present invention.

[0035] figure 1 The ultrasonic vibration processing apparatus 11 having a support structure 10 having an ultrasonic resonator of one embodiment of the present invention performs a silicon wafer (one of the processing tools of the processing tool) 12, while performing an ultrasonic vibration on the radial direction. Waiting for hard crispy materials (cut, cut, grinding, etc.). Such as figure 1 As shown, the support structure 10 of the ultrasonic resonator is a cylindrical first, second enhancer, respectively, along both sides of the axial ultrasonic benech 13 mounted a disk-shaped ultrasonic beacon mesh 13, respectively. The ultrasonic resonance body 16 of 14, 15 is supported in the manner supported by both ends into a configuration that is rotatable relative to the holder 17. Here, in order to make the transmission of ultrasonic waves, the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A support structure (10) for an ultrasonic resonator rotatably supports an ultrasonic resonator (16), in which a first intensifier (14) and a second intensifier (15) are coaxially fixed to both sides in the axial direction of an ultrasonic horn (13) to which a machining tool (12) is attached, so that both ends of the ultrasonic resonator (16) are supported with respect to a holder (17), the holder (17) having: a rolling bearing mechanism (18) that supports the first intensifier (14) and the second intensifier (15) and that supports the first intensifier (14) and the second intensifier (15); the first booster (14) side of the ultrasonic resonance body (16) is supported by the first booster (14) side of the ultrasonic resonance body (16) in a rotatable mode. And a gas bearing mechanism (19) that rotatably supports the second booster (15) side of the ultrasonic resonator (16).

Description

Technical field [0001] The present invention mainly relates to a support structure of an ultrasonic resonator for a processed ultrasonic resonance in a rigid material such as a semiconductor wafer (silicon wafer) and ultrasonic vibration processing apparatus. Background technique [0002] In Patent Document 1, an ultrasonic vibration cutting device is disclosed, and the ultrasonic vibration cutting means is mounted on a disc mounted on a disc-turning cutter (machining tool) of the front end of the ultrasonic resonator (ultrasonic vibration rotation mechanism) axially horizontal direction. One is one side performs ultrasonic vibration in the radius direction of the cutting knife while rotating, and the cutting blade is shut down to cut off the wafer (cutting object member). [0003] In Patent Document 1, since the cantilever configuration is mounted on the front end of the ultrasonic resonator, there is a problem that the front end side of the ultrasonic resonator is easily tilt d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/24B06B1/02H01L21/301H01L21/304
CPCB24B1/04B06B3/00B28D5/047B28D5/0058B06B1/02B28D5/02B23B2270/10B23C2270/10B23C3/04B24B55/00B28D5/022
Inventor 四元敬一森伸广久保直树松山裕宣
Owner TAKATA CORPORATION