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Filler aluminum powder, modification method and application thereof

A technology of aluminum powder and modification, applied in the direction of chemical instruments and methods, heat exchange materials, etc., can solve the problems that cannot be used to prepare thermal conductivity, wire drawing and high stability thermal conductive silicone grease, etc., to achieve good wire drawing performance and The effect of stability, high thermal conductivity, and good drawing performance

Pending Publication Date: 2022-04-08
JONES TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a filler aluminum powder, a modification method and a thermally conductive silicone grease, aiming at solving the problem that the filler aluminum powder in the prior art cannot be used to prepare thermally conductive silicon with high thermal conductivity, stringiness and high stability. Technical issues with lipid products

Method used

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  • Filler aluminum powder, modification method and application thereof
  • Filler aluminum powder, modification method and application thereof

Examples

Experimental program
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Effect test

example 1

[0055] 1. Preparation of modified aluminum powder with a particle size of 1-3 μm:

[0056] 1) Mix vinyltrimethoxysilane, deionized water, and isopropanol in a mass ratio of 1:5:5 to form a mixed solution, add 1% hydrochloric acid, condense and reflux, and continue stirring at 60°C for 1 hour;

[0057] 2) Add 1% hydrochloric acid and aluminum powder with a particle size of 1-3 μm to the mixed solution after the reaction in 1), condense and reflux, and continue stirring at 40° C. for 12 hours to obtain modified aluminum powder;

[0058] 3) Put the modified aluminum powder at room temperature, filter it with suction, wash it, and dry it for later use.

[0059] 2. Preparation of modified aluminum powder with a particle size of 12-14 μm:

[0060] 1) Mix vinyltrimethoxysilane, deionized water, and isopropanol in a mass ratio of 1:4:6 to form a mixed solution, add 1% hydrochloric acid, condense and reflux, and continue stirring at 60°C for 2 hours;

[0061] 2) Add 1% hydrochloric a...

example 2

[0067] 1. Preparation of modified aluminum powder with a particle size of 1-3 μm:

[0068] 1) Mix 3-aminopropyltrimethoxysilane, deionized water, and absolute ethanol in a mass ratio of 1:4:5 to form a mixed solution, add 2% glacial acetic acid, condense and reflux, and continue stirring at 40°C for 40 minutes;

[0069] 2) Add 2% glacial acetic acid and aluminum powder with a particle size of 1-3 μm to the mixed solution after the reaction in 1), condense and reflux, and continue stirring at 60° C. for 6 hours to obtain modified aluminum powder;

[0070] 3) Put the modified aluminum powder at room temperature, filter it with suction, wash it, and dry it for later use.

[0071] 4) Repeat steps 1)-3) 5 times.

[0072] 2. Preparation of modified aluminum powder with a particle size of 12-14 μm:

[0073] 1) Mix 3-aminopropyltrimethoxysilane, deionized water, and absolute ethanol in a mass ratio of 1:5:4 to form a mixed solution, add 2% glacial acetic acid, condense and reflux, a...

example 3

[0080] 1. Preparation of modified aluminum powder with a particle size of 1-3 μm:

[0081] 1) Prepare a mixed solution of propyltrimethoxysilane, deionized water and isopropanol in a mass ratio of 1:3:6, add 0.5% glacial acetic acid, condense and reflux, and continue stirring at room temperature for 10 minutes;

[0082] 2) Add 0.5% glacial acetic acid and aluminum powder with a particle size of 1-3 μm to the mixed solution after the reaction in 1), condense and reflux, and continue stirring at 80° C. for 2 hours to obtain modified aluminum powder;

[0083] 3) Put the modified aluminum powder at room temperature, filter it with suction, wash it, and dry it for later use.

[0084] 4) Repeat 1)-3) steps 2 times.

[0085] 2. Preparation of modified aluminum powder with a particle size of 12-14 μm:

[0086] 1) Prepare a mixed solution of propyltrimethoxysilane, deionized water and isopropanol at a mass ratio of 1:5:4, add 0.5% glacial acetic acid, condense and reflux, and continu...

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Abstract

The invention provides filler aluminum powder, which belongs to the technical field of heat-conducting filler and comprises aluminum powder and a modifier. The modifier and the surface of the aluminum powder continuously grow and are directionally arranged and oriented through a physical adsorption-chemical bonding synergistic effect, so that an aluminum powder interface layer with spatial conformation is formed. The effective grafting rate of the aluminum powder interface layer is 0.01-5%; the thickness of the aluminum powder interface layer ranges from 0.5 nm to 150 nm. The reduction rate of the specific surface area of the aluminum powder is 0.1-5%; the retention rate of the particle size D50 of the aluminum powder is 100.1-115%; and the reduction rate of the surface energy of the aluminum powder is 50-90%. The filler aluminum powder and the heat-conducting silicone grease prepared from the filler aluminum powder provided by the invention have high heat conductivity, high stability and excellent manufacturability. When the heat conductivity coefficient is greater than or equal to 6W / mK, the wire drawing performance is still very good, and after being aged for 1000 hours under the conditions of high temperature, high humidity and temperature cycle, the wire drawing performance is not dried or hardened, and the thermal resistance attenuation rate is 1t; and 15%. The invention also provides a modification method of the filler aluminum powder. The invention further provides application of the filler aluminum powder.

Description

technical field [0001] The invention belongs to the technical field of thermally conductive fillers, and more specifically relates to a filler aluminum powder, a modification method and thermally conductive silicone grease. Background technique [0002] At present, the heat dissipation requirements of electronic components are relatively high. Thermal grease products that meet the requirements of the current electronics industry need to meet the requirements of high thermal conductivity and excellent process for wire drawing, as well as high stability that can withstand high temperature, humid heat and temperature cycle environment reliability. [0003] High thermal conductivity silicone grease usually uses metal aluminum powder as the main thermal conductivity filler. However, at present, there are two problems in the high thermal conductivity silicone grease products with aluminum powder as the main filler in the industry: high viscosity, no wire drawing, poor workmanship;...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/06C08K3/08C08L83/04C08K3/22C09K5/14
Inventor 陈肖男周占玉韩杨吴晓宁
Owner JONES TECH