Digital transceiving integrated microsystem and manufacturing method thereof

Abstract

The invention discloses a digital transceiving integrated microsystem and a manufacturing method, and the system comprises a packaging substrate, a surrounding frame cover plate is installed on the substrate, a first glass adapter plate and a second glass adapter plate are arranged in the surrounding frame cover plate, a programmable logic device is embedded in a cavity of the substrate, and a miniature cold plate is arranged at the bottom of the substrate. Heat-conducting silicone grease is filled between the passive surface of the programmable logic device and the miniature cold plate, a solder ball bump array formed by wafer-level ball planting is arranged on the active surface of the programmable logic device and is welded to the reverse side of the first glass adapter plate, small solder balls are distributed between the first glass adapter plate and the substrate, high solder balls are distributed between the second glass adapter plate and the packaging substrate, and the high solder balls are welded to the reverse side of the second glass adapter plate. Peripheral components are arranged on the front surface of the second glass adapter plate, and a communication device is arranged in a cavity between the two glass adapter plates; plate bodies of the two adapter plates are provided with through holes, metal columns are arranged in the through holes, and rewiring layers are arranged on the front faces and the back faces of the two adapter plates. The wiring difficulty of the rewiring layer on the adapter plate can be reduced, and the stability of the overall structure is improved.

Description

technical field [0001] The invention relates to the technical field of electronic information, in particular to a digital transceiver integrated microsystem and a manufacturing method. Background technique [0002] With the rapid development of electronic technology, electronic systems are developing in the direction of miniaturization, high performance, multi-function, low cost and high reliability, and hybrid integrated microsystems have become an inevitable trend of development. For the all-digital transceiver DBF phased array radar system, there are many transceiver units (that is, transceiver branches), and usually hundreds or even tens of thousands of transceiver units are required for one array. However, the traditional digital transceiver modules still used at present will lead to low integration of the whole system, and the volume, weight, power consumption, reliability, cost and consistency between channels of the system equipment are far from meeting the engineeri...

AI Technical Summary

Problems solved by technology

[0005] However, the three-bit Internet broadband digital transceiver microsystem is a conventional 2.5D stacking structure, that is, the upper and lower layer signals are interconnected through copper pillars between the two silicon transfer boards, and the FPGA on the back of the lower transfer board is on the packaging substrate. structural instability

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